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AM4376BZDND30

Texas Instruments

AM4376BZDND30 by Texas Instruments

The Texas Instruments AM4376BZDND30 is a System on Chip with 491 terminals in a low profile, fine pitch grid array package. It operates at -40 to 90°C, with supply voltage ranging from 0.912V to 1V. Ideal for industrial applications requiring CMOS technology and bottom terminal position.

Median Price

$15.858

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 404 parts In-Stock

1+ parts

$11.675

100+ parts

$10.198

1k+ parts

$7.033

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404

$11.675

$10.198

$7.033

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Mouser Electronics

USA . 7 parts In-Stock

1+ parts

$20.040

100+ parts

$12.790

1k+ parts

$12.440

10k+ parts

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7

$20.040

$12.790

$12.440

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$10.395

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-

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50

$10.395

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Digiode

USA . 3,500 parts In-Stock

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$11.091

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3,500

$11.091

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VNN

France . 1,730 parts In-Stock

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1,730

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ComSIT Distribution GmbH

Germany . 430 parts In-Stock

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430

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Chip Stock

USA . 275 parts In-Stock

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275

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Vyrian

USA . 206 parts In-Stock

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206

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Distributors (Availability)

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Ampacity Inc.

Singapore . 206 parts In-Stock

1+ parts

$9.920

100+ parts

-

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206

$9.920

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Continental Prestige Electronics

USA . 2,669 parts In-Stock

1+ parts

$10.395

100+ parts

-

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$10.187

2,669

$10.395

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-

$10.187

Corphita

USA . 1,749 parts In-Stock

1+ parts

$10.508

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1,749

$10.508

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AZTECH Wire

Italy . 539 parts In-Stock

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$10.556

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539

$10.556

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Parana Technologies

USA . 1,293 parts In-Stock

1+ parts

$37.752

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1,293

$37.752

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DigiPath Technology Company

USA . 2,233 parts In-Stock

1+ parts

$41.570

100+ parts

$38.244

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2,233

$41.570

$38.244

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ChromeModa Solutions

Germany . 2,763 parts In-Stock

1+ parts

$42.418

100+ parts

$34.783

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2,763

$42.418

$34.783

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IDEA Electronic Components Group

UK . 2,200 parts In-Stock

1+ parts

$42.418

100+ parts

$40.297

1k+ parts

$38.176

10k+ parts

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2,200

$42.418

$40.297

$38.176

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QUARKTWIN TECHNOLOGY LTD

USA . 3,929 parts In-Stock

1+ parts

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3,929

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Argo Parts USA

USA . 3,924 parts In-Stock

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Overview

Discover the AM4376BZDND30 by Texas Instruments, a cutting-edge System on Chip designed to elevate your electronic projects. With a focus on quality and innovation, Texas Instruments delivers exceptional products that are trusted by professionals worldwide. This versatile chip is perfect for a wide range of applications in the Other Function uPs, uCs & Peripheral ICs category, providing value and reliability to customers. Experience the benefits of this high-tech solution and unlock new possibilities for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material provides good durability and protection for the ICs inside the package.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly, saving time and labor costs.

Maximum Supply Voltage: 1 V

The ability to handle a maximum supply voltage of 1V makes this product suitable for low power applications.

Package Shape: SQUARE

Square shape allows for efficient use of space on the PCB.

No. of Terminals: 491

High number of terminals allow for more connectivity options and flexibility in circuit design.

Minimum Operating Temperature: -40 °C

Wide operating temperature range makes this product suitable for use in harsh environments or extreme conditions.

Technology: CMOS

CMOS technology ensures low power consumption and high noise immunity, making the product energy efficient and reliable.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs AM4376BZDND30 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PBGA-B491

JESD-609 Code:

e1

Length:

17 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

491

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA491,25X25,25

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.3 mm

Maximum Supply Voltage:

1 V

Minimum Supply Voltage:

.912 V

Nominal Supply Voltage:

.95 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

17 mm

Peripheral IC Type:

Trade Compliance

AM4376BZDND30 Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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