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MSP430F6777AIPZR

Texas Instruments

MSP430F6777AIPZR by Texas Instruments

MSP430F6777AIPZR by Texas Instruments is a 16-bit microprocessor with 262144 ROM words and 32 RAM words. It features 6-Ch 10-Bit ADC channels, PWM support, and connectivity options like I2C, IRDA, SPI, UART. Ideal for industrial applications requiring low power consumption and high performance in a compact form factor.

Median Price

$6.344

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 2,000 parts In-Stock

1+ parts

$6.344

100+ parts

$5.172

1k+ parts

$3.448

10k+ parts

-

2,000

$6.344

$5.172

$3.448

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,646 parts In-Stock

1+ parts

$6.027

100+ parts

-

1k+ parts

-

10k+ parts

-

2,646

$6.027

-

-

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Nova Conductors

Japan . 200 parts In-Stock

1+ parts

$6.571

100+ parts

-

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-

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200

$6.571

-

-

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Vyrian

USA . 8,603 parts In-Stock

1+ parts

-

100+ parts

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8,603

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-

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 1,907 parts In-Stock

1+ parts

$5.390

100+ parts

$5.255

1k+ parts

$5.228

10k+ parts

-

1,907

$5.390

$5.255

$5.228

-

Ampacity Inc.

Singapore . 1,621 parts In-Stock

1+ parts

$5.390

100+ parts

-

1k+ parts

-

10k+ parts

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1,621

$5.390

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-

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Corphita

USA . 1,878 parts In-Stock

1+ parts

$5.710

100+ parts

-

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-

10k+ parts

-

1,878

$5.710

-

-

-

Continental Prestige Electronics

USA . 3,286 parts In-Stock

1+ parts

$6.571

100+ parts

-

1k+ parts

-

10k+ parts

$6.439

3,286

$6.571

-

-

$6.439

Advanced Electronics

New Zealand . 500 parts In-Stock

1+ parts

$6.702

100+ parts

$6.702

1k+ parts

$6.702

10k+ parts

-

500

$6.702

$6.702

$6.702

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AZTECH Wire

Italy . 491 parts In-Stock

1+ parts

$14.910

100+ parts

-

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491

$14.910

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-

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Microchip USA

USA . 1,532 parts In-Stock

1+ parts

$30.560

100+ parts

$30.370

1k+ parts

$30.280

10k+ parts

$30.180

1,532

$30.560

$30.370

$30.280

$30.180

Corohmni

South Africa . 4,982 parts In-Stock

1+ parts

$42.650

100+ parts

-

1k+ parts

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4,982

$42.650

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Parana Technologies

USA . 158 parts In-Stock

1+ parts

$57.391

100+ parts

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1k+ parts

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10k+ parts

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158

$57.391

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DigiPath Technology Company

USA . 1,935 parts In-Stock

1+ parts

$63.194

100+ parts

$58.139

1k+ parts

-

10k+ parts

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1,935

$63.194

$58.139

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ChromeModa Solutions

Germany . 6,241 parts In-Stock

1+ parts

$64.484

100+ parts

$52.877

1k+ parts

-

10k+ parts

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6,241

$64.484

$52.877

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IDEA Electronic Components Group

UK . 721 parts In-Stock

1+ parts

$64.484

100+ parts

$61.260

1k+ parts

$58.036

10k+ parts

-

721

$64.484

$61.260

$58.036

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Argo Parts USA

USA . 3,374 parts In-Stock

1+ parts

-

100+ parts

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3,374

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Overview

Unlock the power of innovation with the Texas Instruments MSP430F6777AIPZR, a top-of-the-line microprocessor circuit designed for industrial-grade applications. With advanced features like multiple ADC and DMA channels, this device offers unmatched performance and reliability. Perfect for a wide range of functions, from data processing to connectivity, the MSP430F6777AIPZR delivers exceptional value and quality that only Texas Instruments can provide. Experience seamless integration and cutting-edge technology with this versatile solution, setting new standards in the industry.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the components inside, ensuring the product has a longer lifespan.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage allows for versatile power options, making this product suitable for a variety of applications.

CPU Family: MSP430

Being part of the MSP430 family ensures reliable performance and compatibility with other devices within the same family.

ADC Channels: YES

The presence of analog to digital converters allows for accurate conversion of analog signals to digital data, making this product ideal for sensing and measurement applications.

Connectivity: I2C(2), IRDA(4), SPI(6), UART(4)

Multiple connectivity options make it easy to integrate this product into different communication protocols and networks, enhancing its versatility and usability.

RAM Bytes: 32768

With a large memory capacity, this product can handle complex tasks and store significant amounts of data efficiently.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MSP430F6777AIPZR attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY

Address Bus Width:

0

Bit Size:

16

Bus Compatibility:

I2C; SPI; UART

CPU Family:

MSP430

Maximum Clock Frequency:

.032768 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

62

No. of Terminals:

100

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

32768

RAM Words:

32

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

25 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), IRDA(4), SPI(6), UART(4)

Peripherals:

BOR, COMPARATOR(3), DMA(3), RTC, TIMER(4), WDT

Analog To Digital Convertors:

6-Ch 10-Bit

Trade Compliance

MSP430F6777AIPZR Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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