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MSP430F6779IPZR

Texas Instruments

MSP430F6779IPZR by Texas Instruments

MSP430F6779IPZR by Texas Instruments is a 16-bit microprocessor with 524288 ROM words and 32 RAM words. Operating at a max frequency of 25 MHz, it's ideal for industrial applications requiring low power consumption and high performance. With I2C, SPI, and UART compatibility, this microprocessor offers versatile connectivity options in a compact FLATPACK package.

Median Price

$13.377

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 11,216 parts In-Stock

1+ parts

$9.054

100+ parts

$7.908

1k+ parts

$5.454

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-

11,216

$9.054

$7.908

$5.454

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Mouser Electronics

USA . 487 parts In-Stock

1+ parts

$17.700

100+ parts

$11.360

1k+ parts

$10.110

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-

487

$17.700

$11.360

$10.110

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Distributors (In-Stock)

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Digiode

USA . 4,842 parts In-Stock

1+ parts

$8.601

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$8.601

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Nova Conductors

Japan . 90 parts In-Stock

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$9.672

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90

$9.672

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Vyrian

USA . 6,490 parts In-Stock

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Chip Stock

USA . 4,500 parts In-Stock

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Distributors (Availability)

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Semicontronic

India . 5,904 parts In-Stock

1+ parts

$7.700

100+ parts

$7.508

1k+ parts

$7.469

10k+ parts

-

5,904

$7.700

$7.508

$7.469

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Ampacity Inc.

Singapore . 5,844 parts In-Stock

1+ parts

$7.700

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$7.700

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Corphita

USA . 556 parts In-Stock

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$8.149

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556

$8.149

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Netroflash

USA . 1,000 parts In-Stock

1+ parts

$9.672

100+ parts

-

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$9.188

10k+ parts

$8.995

1,000

$9.672

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$9.188

$8.995

Continental Prestige Electronics

USA . 975 parts In-Stock

1+ parts

$9.672

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-

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$9.478

975

$9.672

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$9.478

Parana Technologies

USA . 729 parts In-Stock

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$48.750

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$48.750

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DigiPath Technology Company

USA . 1,354 parts In-Stock

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$53.680

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$53.680

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ChromeModa Solutions

Germany . 2,607 parts In-Stock

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$54.775

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$44.916

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2,607

$54.775

$44.916

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IDEA Electronic Components Group

UK . 1,947 parts In-Stock

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$54.775

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$52.036

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$49.298

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$54.775

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Corohmni

South Africa . 2,102 parts In-Stock

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Lixinc

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Argo Parts USA

USA . 2,051 parts In-Stock

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Futuretech Components

Singapore . 827 parts In-Stock

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Perfect Parts

USA . 488 parts In-Stock

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Robosynatics

Brazil . 200 parts In-Stock

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Lucentia Tech

USA . 200 parts In-Stock

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$5.642

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$5.642

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$5.642

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$5.642

$5.642

$5.642

Overview

Unlock the power of cutting-edge technology with the Texas Instruments MSP430F6779IPZR microprocessor circuit. Designed with precision and expertise, this product offers unparalleled performance in a wide range of applications. From IoT devices to industrial automation systems, this versatile solution delivers reliable operation and efficiency. Experience seamless integration, high-speed processing, and low power consumption with the MSP430F6779IPZR. Trust in Texas Instruments to bring you quality, innovation, and value in every product. Upgrade your projects today with the MSP430F6779IPZR.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making it ideal for portable electronic devices.

Surface Mount: YES

Surface mount technology allows for compact design and easy assembly, saving space in the final product.

Maximum Supply Voltage: 3.6 V

With a high maximum supply voltage, this product can handle power surges without risking damage.

Package Shape: SQUARE

The square shape of the package allows for efficient use of space on a circuit board.

Bit Size: 16

A 16-bit architecture allows for faster processing and better performance in tasks that require complex calculations.

Power Supplies (V): 2/3.3

The ability to operate on both 2V and 3.3V power supplies offers flexibility in various applications.

No. of Terminals: 100

A high number of terminals provide more connectivity options for peripherals and sensors.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

This package style ensures efficient heat dissipation and easy PCB routing.

Minimum Supply Voltage: 1.8 V

With a low minimum supply voltage, this product is energy-efficient and suitable for battery-operated devices.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliability and performance in harsh environments.

CPU Family: MSP430

The MSP430 family is known for its low power consumption and high performance, making it a popular choice for embedded systems.

Minimum Operating Temperature: -40 °C

The product can function in extremely cold conditions without any loss in performance.

Terminal Finish: NICKEL PALLADIUM GOLD

This finish provides corrosion resistance and ensures reliable connections for long-term use.

ADC Channels: YES

Analog-to-digital converter channels allow for interfacing with analog sensors and inputs.

Terminal Position: QUAD

Quad terminal positions make it easy to solder and connect the product to the rest of the circuit.

ROM Words: 524288

A large ROM capacity allows for storing complex programs and data for advanced functionality.

Maximum Seated Height: 1.6 mm

The low-seated height of the package saves space and allows for slim device designs.

RAM Words: 32

Ample RAM capacity enables fast data processing and multitasking capabilities.

Width: 14 mm

The compact width of the product makes it suitable for small form factor devices.

Maximum Clock Frequency: 25 MHz

A high clock frequency enables fast data processing and real-time operation.

Maximum Time At Peak Reflow Temperature (s): 30

The product can withstand reflow soldering processes without compromising performance.

Peak Reflow Temperature °C: 260

The high peak reflow temperature ensures reliable solder joints and proper assembly.

Length: 14 mm

The short length of the package saves space on the PCB and allows for compact designs.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance ensures reliable operation in harsh environments.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

The peripheral IC type provides additional functionality and processing power to the main microprocessor.

RAM Bytes: 32768

The large RAM capacity allows for efficient data storage and processing in a wide range of applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable.

Terminal Form: GULL WING

Gull wing terminals provide secure solder joints and easy PCB assembly.

Maximum Supply Current: 11.75 mA

The low supply current ensures energy efficiency and extended battery life in portable devices.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage of 3.3V is a standard in many electronic systems, ensuring compatibility with existing designs.

ROM Programmability: FLASH

Flash programmable ROM allows for easy updates and customization of firmware without the need for special programming tools.

Bus Compatibility: I2C; SPI; UART

Multiple bus interfaces provide flexibility in connecting to various peripherals and sensors.

Terminal Pitch: 0.5 mm

The fine terminal pitch allows for dense packing of terminals on the PCB, saving space and enabling compact designs.

Moisture Sensitivity Level (MSL): 3

MSL 3 rating indicates that the product can withstand moderate levels of moisture during storage and assembly.

Speed: 25 rpm

The high speed capability of 25 rpm enables fast data processing and real-time response in time-sensitive applications.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MSP430F6779IPZR attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

ADC Channels:

YES

Bit Size:

16

Bus Compatibility:

I2C; SPI; UART

CPU Family:

MSP430

Maximum Clock Frequency:

25 MHz

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

32768

RAM Words:

32

ROM Words:

524288

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

11.75 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

MSP430F6779IPZR Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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