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MSP430F67641AIPZ

Texas Instruments

MSP430F67641AIPZ by Texas Instruments

MSP430F67641AIPZ by Texas Instruments is a 100-terminal microprocessor circuit with 8192 bytes of RAM. Operating at -40 to 85°C, it supports I2C, SPI, and UART bus compatibility for industrial applications requiring a low-profile package style with a max seated height of 1.6mm.

Median Price

$6.707

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 3,156 parts In-Stock

1+ parts

$6.707

100+ parts

$5.468

1k+ parts

$3.645

10k+ parts

-

3,156

$6.707

$5.468

$3.645

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 1,000 parts In-Stock

1+ parts

$5.715

100+ parts

-

1k+ parts

-

10k+ parts

-

1,000

$5.715

-

-

-

Digiode

USA . 1,827 parts In-Stock

1+ parts

$6.372

100+ parts

-

1k+ parts

-

10k+ parts

-

1,827

$6.372

-

-

-

Vyrian

USA . 4,736 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,736

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 2,948 parts In-Stock

1+ parts

$5.700

100+ parts

$5.558

1k+ parts

$5.529

10k+ parts

-

2,948

$5.700

$5.558

$5.529

-

Ampacity Inc.

Singapore . 2,754 parts In-Stock

1+ parts

$5.700

100+ parts

-

1k+ parts

-

10k+ parts

-

2,754

$5.700

-

-

-

Continental Prestige Electronics

USA . 6,215 parts In-Stock

1+ parts

$5.715

100+ parts

-

1k+ parts

-

10k+ parts

$5.601

6,215

$5.715

-

-

$5.601

Netroflash

USA . 1,000 parts In-Stock

1+ parts

$5.715

100+ parts

-

1k+ parts

$5.430

10k+ parts

$5.315

1,000

$5.715

-

$5.430

$5.315

Advanced Electronics

New Zealand . 600 parts In-Stock

1+ parts

$5.830

100+ parts

$5.830

1k+ parts

$5.830

10k+ parts

-

600

$5.830

$5.830

$5.830

-

Corphita

USA . 3,757 parts In-Stock

1+ parts

$6.036

100+ parts

-

1k+ parts

-

10k+ parts

-

3,757

$6.036

-

-

-

AZTECH Wire

Italy . 764 parts In-Stock

1+ parts

$11.520

100+ parts

-

1k+ parts

-

10k+ parts

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764

$11.520

-

-

-

Microchip USA

USA . 1,637 parts In-Stock

1+ parts

$18.350

100+ parts

$18.090

1k+ parts

$17.960

10k+ parts

$17.820

1,637

$18.350

$18.090

$17.960

$17.820

Parana Technologies

USA . 1,700 parts In-Stock

1+ parts

$31.528

100+ parts

$2,927.876

1k+ parts

$28.375

10k+ parts

-

1,700

$31.528

$2,927.876

$28.375

-

DigiPath Technology Company

USA . 582 parts In-Stock

1+ parts

$34.716

100+ parts

$31.939

1k+ parts

-

10k+ parts

-

582

$34.716

$31.939

-

-

ChromeModa Solutions

Germany . 5,962 parts In-Stock

1+ parts

$35.425

100+ parts

$29.048

1k+ parts

-

10k+ parts

-

5,962

$35.425

$29.048

-

-

IDEA Electronic Components Group

UK . 1,611 parts In-Stock

1+ parts

$35.425

100+ parts

$33.654

1k+ parts

$31.882

10k+ parts

-

1,611

$35.425

$33.654

$31.882

-

Corohmni

South Africa . 5,228 parts In-Stock

1+ parts

$55.280

100+ parts

-

1k+ parts

-

10k+ parts

-

5,228

$55.280

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 10,675 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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10,675

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-

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Argo Parts USA

USA . 4,044 parts In-Stock

1+ parts

-

100+ parts

-

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-

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4,044

-

-

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Computer Components Inc. - USA

USA . 7 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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7

-

-

-

-

Overview

Unlock the power of innovation with the Texas Instruments MSP430F67641AIPZ. This cutting-edge microprocessor circuit offers unparalleled quality and reliability, designed by a trusted manufacturer in the industry. Ideal for a wide range of applications, this versatile product provides customers with unmatched value and benefits. From its advanced technology to its efficient performance, the MSP430F67641AIPZ delivers the perfect solution for all your electronic needs. Experience the difference today and take your projects to new heights with this exceptional product.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material makes the package lightweight and durable, enhancing the overall reliability of the product.

Surface Mount: YES

Allows for easy and efficient integration onto PCBs, saving space and simplifying assembly processes.

Maximum Supply Voltage: 3.6 V

Provides flexibility in power supply options and supports a wide range of applications.

Package Shape: SQUARE

Square shape helps in efficient utilization of space on the PCB, especially in compact designs.

No. of Terminals: 100

Sufficient number of terminals allow for connectivity with other components and peripherals, enabling versatile functionality.

Minimum Supply Voltage: 1.8 V

Low minimum supply voltage helps in power efficiency and extends battery life in portable devices.

Maximum Operating Temperature: 85 °C

Wide operating temperature range ensures reliable performance under various environmental conditions.

CPU Family: MSP430

Belonging to the MSP430 family indicates high performance, low power consumption, and advanced features for embedded applications.

ADC Channels: YES

Integrated ADC channels enhance the device's ability to interface with analog signals and sensors.

RAM Bytes: 8192

High RAM capacity enables efficient data processing and multitasking capabilities.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MSP430F67641AIPZ attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

ADC Channels:

YES

Bus Compatibility:

I2C; SPI; UART

CPU Family:

MSP430

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

8192

RAM Words:

8

Maximum Seated Height:

1.6 mm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

MSP430F67641AIPZ Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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