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XC7Z030-1FBG676C

Xilinx

XC7Z030-1FBG676C by Xilinx

The Xilinx XC7Z030-1FBG676C is a System on Chip with CMOS technology. It operates b/w 0-85°C, with supply voltage ranging from 0.95V to 1.05V. With a package style of Grid Array and 676 terminals, it's ideal for various applications in Other Function uPs,uCs & Peripheral ICs.

Median Price

$338.995

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Farnell

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AZTECH Wire

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Modulus Dynamics

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MARBEL Systems

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Texas Native Microelectronics

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Aztec Data Supply Inc.

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Kenton Components

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Corohmni

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Advanced Electronics

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Ampacity Inc.

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Overview

Experience the cutting-edge technology of Xilinx with the XC7Z030-1FBG676C, a high-quality System on Chip designed for a wide range of applications. As a leading manufacturer in the industry, Xilinx delivers unmatched performance and reliability in their products. This versatile chip offers customers the value of seamless integration, superior functionality, and optimal efficiency. Whether you are looking to enhance your embedded system or streamline your digital design project, the XC7Z030-1FBG676C provides the perfect solution for all your processing needs. Elevate your projects to the next level with Xilinx's exceptional technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and cost-effective.

Surface Mount: YES

Surface mount technology allows for easier and more efficient PCB assembly.

Maximum Supply Voltage: 1.05 V

The maximum supply voltage of 1.05V provides flexibility in power supply options.

Package Shape: SQUARE

The square package shape allows for efficient use of PCB space and layout.

No. of Terminals: 676

Having a large number of terminals allows for a wide range of connectivity options with other components.

Package Style (Meter): GRID ARRAY

The grid array package style offers high reliability and ease of manufacturing.

Minimum Supply Voltage: 0.95 V

The low minimum supply voltage of 0.95V helps in reducing power consumption and heat dissipation.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, the product can withstand high temperature environments.

Minimum Operating Temperature: 0 °C

The product can operate efficiently in low-temperature conditions down to 0°C.

Terminal Position: BOTTOM

Bottom terminal position simplifies the PCB layout and improves thermal performance.

Maximum Seated Height: 2.54 mm

The low seated height of 2.54mm helps in reducing overall system profile and improving airflow.

Width: 27 mm

The compact width of 27mm allows for space-efficient PCB design and layout.

Length: 27 mm

The square shape and length of 27mm provide symmetrical layout options for the product.

Peripheral IC Type: SYSTEM ON CHIP

Being a System-on-Chip (SoC) device, it integrates multiple functions into a single chip, reducing complexity and cost.

Technology: CMOS

The CMOS technology offers low power consumption, high noise immunity, and compatibility with a wide range of applications.

Terminal Form: BALL

The ball terminal form provides good electrical and thermal performance, especially for high-frequency applications.

Nominal Supply Voltage: 1 V

The nominal supply voltage of 1V is ideal for stable operation and compatibility with various power sources.

Terminal Pitch: 1 mm

The tight terminal pitch of 1mm allows for high-density mounting and saves PCB space.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs XC7Z030-1FBG676C attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Xilinx

Specs

JESD-30 Code:

S-PBGA-B676

Length:

27 mm

No. of Terminals:

676

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA676,26X26,40

Package Shape:

Package Style (Meter):

GRID ARRAY

Maximum Seated Height:

2.54 mm

Maximum Supply Voltage:

1.05 V

Minimum Supply Voltage:

.95 V

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Width:

27 mm

Peripheral IC Type:

Trade Compliance

XC7Z030-1FBG676C Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.D

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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