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XC7Z100-2FFG1156I

Xilinx

XC7Z100-2FFG1156I by Xilinx

XC7Z100-2FFG1156I by Xilinx is a 1156-terminal, square-shaped GRID ARRAY package with a max supply voltage of 1.05V and a min operating temperature of -40°C. It is a CMOS-based SYSTEM ON CHIP (SoC) used in Other Function uPs,uCs & Peripheral ICs applications.

Median Price

$4,308.690

Lifecycle Status

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DigiKey

USA . 4 parts In-Stock

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Mouser Electronics

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Digiode

USA . 217 parts In-Stock

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$4,092.790

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VNN

France . 587 parts In-Stock

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Nova Conductors

Japan . 900 parts In-Stock

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Vyrian

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Touchstone Systems

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Cyclops Electronics Ltd

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AZTECH Wire

Italy . 292 parts In-Stock

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$14.703

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MARBEL Systems

Belgium . 12,273 parts In-Stock

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Texas Native Microelectronics

USA . 30 parts In-Stock

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$43.169

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$37.989

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Corohmni

South Africa . 151 parts In-Stock

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$44.771

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Kenton Components

USA . 1,716 parts In-Stock

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$51.803

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$45.586

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Aztec Data Supply Inc.

USA . 113 parts In-Stock

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$62.920

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Advanced Electronics

New Zealand . 500 parts In-Stock

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$83.485

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$79.310

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Modulus Dynamics

Lithuania . 1,027 parts In-Stock

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Qasali Group International

UK . 2,441 parts In-Stock

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$116.556

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$102.570

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One Stop Electronics

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$3,661.970

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Ampacity Inc.

Singapore . 4 parts In-Stock

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Semicontronic

India . 4 parts In-Stock

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$3,570.421

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$3,552.111

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Corphita

USA . 248 parts In-Stock

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$3,877.380

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Argo Parts USA

USA . 3,951 parts In-Stock

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$4,265.360

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$4,222.276

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$4,179.191

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Continental Prestige Electronics

USA . 3,384 parts In-Stock

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Netroflash

USA . 2,000 parts In-Stock

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$4,133.953

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Lixinc

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A-Z Elektronik GmbH

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Vigor

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Supply Digital

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Kepictronics

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Futuretech Components

Singapore . 12 parts In-Stock

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Overview

Discover the XC7Z100-2FFG1156I by Xilinx, a game-changing product in the field of Other Function uPs,uCs & Peripheral ICs. With its cutting-edge technology and superior quality, Xilinx stands out as a trusted manufacturer. This innovative system on chip offers countless possibilities for applications, providing customers with exceptional value, benefits, and advantages. From increased performance to enhanced efficiency, this product is designed to exceed expectations. Embrace the future of technology with the XC7Z100-2FFG1156I and unlock endless opportunities for success.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product easy to handle and resistant to damage.

Surface Mount: YES

Allows for easy and secure installation on circuit boards, saving time and effort during assembly.

Maximum Supply Voltage: 1.05 V

Provides flexibility in power supply options while ensuring safe operation within the specified range.

Package Shape: SQUARE

Helps optimize space on the circuit board, allowing for efficient layout and design.

No. of Terminals: 1156

Offers a wide range of connectivity options, allowing for various input/output configurations.

Package Style (Meter): GRID ARRAY

Facilitates high-density packaging, enabling the integration of multiple functions in a compact size.

Minimum Supply Voltage: 0.95 V

Ensures reliable operation even at lower voltage levels, improving efficiency and performance.

Maximum Operating Temperature: 100 °C

Ensures stable operation under harsh environmental conditions, suitable for a wide range of applications.

Minimum Operating Temperature: -40 °C

Maintains functionality in extreme cold temperatures, making the product suitable for various operating environments.

Terminal Position: BOTTOM

Facilitates easy connection to other components on the circuit board, enhancing overall system integration.

Maximum Seated Height: 3.1 mm

Allows for a low-profile design, reducing obstruction and interference with surrounding components.

Width: 35 mm

Provides a compact form factor, allowing for efficient use of space on the circuit board.

Length: 35 mm

Offers a square shape, contributing to a symmetrical layout and neat circuit board design.

Peripheral IC Type: SYSTEM ON CHIP

Integration of various functions on a single chip simplifies circuit design, reduces component count, and enhances overall system performance.

Technology: CMOS

Utilizes low power consumption, high noise immunity, and compatibility with various digital systems, ensuring reliable operation and energy efficiency.

Terminal Form: BALL

Facilitates soldering and connection to the circuit board, ensuring secure and reliable electrical contact.

Nominal Supply Voltage: 1 V

Provides a stable operating voltage, optimizing performance and ensuring compatibility with standard power sources.

Terminal Pitch: 1 mm

Allows for fine spacing between terminals, enhancing connectivity options and enabling high-density packaging.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs XC7Z100-2FFG1156I attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Xilinx

Specs

JESD-30 Code:

S-PBGA-B1156

Length:

35 mm

No. of Terminals:

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA1156,34X34,40

Package Shape:

Package Style (Meter):

GRID ARRAY

Maximum Seated Height:

3.1 mm

Maximum Supply Voltage:

1.05 V

Minimum Supply Voltage:

.95 V

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Width:

35 mm

Peripheral IC Type:

Trade Compliance

XC7Z100-2FFG1156I Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.D

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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