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XC7Z020-1CLG400C

Xilinx

XC7Z020-1CLG400C by Xilinx

The Xilinx XC7Z020-1CLG400C is a System on Chip with 400 terminals in a low profile, fine pitch grid array package. Operating b/w 0°C to 85°C, it has a supply voltage range of 0.95V to 1.05V. Ideal for applications requiring high-performance processing in compact spaces.

Median Price

$142.551

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DigiKey

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Farnell

UK . 315 parts In-Stock

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Mouser Electronics

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Element14

Singapore . 315 parts In-Stock

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Bristol Electronics

USA . 51 parts In-Stock

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IBS Electronics

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Digiode

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VNN

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Nova Conductors

Japan . 870 parts In-Stock

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DF Sales Co.

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DF Sales Co.

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Chip Stock

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Classic Components Corporation

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Touchstone Systems

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Vyrian

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ACDS - Activité Composants Distribution Service

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Dan-Mar Components

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Vigor

Singapore . 50 parts In-Stock

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$18.000

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Modulus Dynamics

Lithuania . 1,675 parts In-Stock

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Corohmni

South Africa . 248 parts In-Stock

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Aztec Data Supply Inc.

USA . 3,509 parts In-Stock

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Semicontronic

India . 281 parts In-Stock

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Continental Prestige Electronics

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One Stop Electronics

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Ampacity Inc.

Singapore . 315 parts In-Stock

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Texas Native Microelectronics

USA . 40 parts In-Stock

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Corphita

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Netroflash

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Microchip USA

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Advanced Electronics

New Zealand . 1,151 parts In-Stock

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A-Z Elektronik GmbH

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GreenTree Electronics

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Futuretech Components

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Lucentia Tech

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Lixinc

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Kenton Components

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Supply Digital

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Argo Parts USA

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XScomponents

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RC Electronics

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Qasali Group International

UK . 141 parts In-Stock

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Perfect Parts

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Overview

Elevate your projects with the XC7Z020-1CLG400C by Xilinx, a cutting-edge System on Chip designed to revolutionize the way you experience technology. Boasting top-notch quality and precision engineering from one of the leading manufacturers in the industry, this versatile component is perfect for various applications in the world of uPs, uCs & Peripheral ICs. Experience unparalleled performance, reliability, and efficiency while unlocking a whole new realm of possibilities for your creations. Upgrade to the XC7Z020-1CLG400C today and take your projects to new heights!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy package body material provides good protection and insulation for the internal components of the IC, ensuring reliability and durability.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly, saving time and cost in production.

Maximum Supply Voltage: 1.05 V

With a maximum supply voltage of 1.05V, this IC is suitable for low-power applications, helping to reduce energy consumption.

Package Shape: SQUARE

Square package shape offers efficient use of PCB space and allows for easy placement on the board.

No. of Terminals: 400

With 400 terminals, this IC provides a high level of connectivity and interfacing options, making it versatile for various applications.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

Grid array, low profile, and fine pitch package style ensures high density mounting, saving space on the PCB and enabling high-performance designs.

Minimum Supply Voltage: 0.95 V

Low minimum supply voltage of 0.95V allows for operation in low-power scenarios, contributing to energy efficiency.

Maximum Operating Temperature: 85 °C

High maximum operating temperature of 85°C ensures reliable performance even in demanding environmental conditions.

Minimum Operating Temperature: 0 °C

With a minimum operating temperature of 0°C, this IC can operate in a wide range of temperature conditions, making it versatile for different applications.

Terminal Finish: Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

Tin/Silver/Copper terminal finish provides excellent conductivity and corrosion resistance, ensuring reliable connections and longevity.

Terminal Position: BOTTOM

Bottom terminal position is convenient for PCB layout and assembly, simplifying the manufacturing process.

Maximum Seated Height: 1.6 mm

Low maximum seated height of 1.6mm allows for compact PCB designs, saving space and enabling sleek product form factors.

Width: 17 mm

With a width of 17mm, this IC is suitable for applications where space is a constraint, offering a compact solution.

Length: 17 mm

Length of 17mm ensures a balanced form factor for the IC, facilitating easy integration into PCB layouts.

Peripheral IC Type: SYSTEM ON CHIP

System on chip design integrates multiple functions on a single IC, reducing component count, PCB space, and power consumption, leading to cost-effective and efficient solutions.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and fast switching speeds, enhancing the performance and efficiency of the IC.

Terminal Form: BALL

Ball terminal form allows for easy and reliable soldering connections, ensuring robust electrical connections and ease of assembly.

Nominal Supply Voltage: 1 V

Nominal supply voltage of 1V provides a standard operating voltage level, making it compatible with a wide range of systems and applications.

Terminal Pitch: 0.8 mm

With a terminal pitch of 0.8mm, this IC offers fine pitch connections, enabling high-density PCB layouts and compact designs.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates that the IC is not highly sensitive to moisture during storage and handling, simplifying logistics and ensuring product reliability.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs XC7Z020-1CLG400C attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Xilinx

Specs

JESD-30 Code:

S-PBGA-B400

JESD-609 Code:

e1

Length:

17 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

400

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA400,20X20,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Maximum Seated Height:

1.6 mm

Maximum Supply Voltage:

1.05 V

Minimum Supply Voltage:

.95 V

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

17 mm

Peripheral IC Type:

Trade Compliance

XC7Z020-1CLG400C Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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