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XC7Z100-L2FFG1156I

Xilinx

XC7Z100-L2FFG1156I by Xilinx

XC7Z100-L2FFG1156I by Xilinx is a System on Chip with CMOS technology. It operates b/w -40 to 100°C, with supply voltage ranging from 0.95V to 1.05V. With 1156 terminals in a square grid array package, it's ideal for various applications requiring high-performance processing capabilities.

Median Price

$4,602.140

Lifecycle Status

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4

In-Stock Inventory

1k+

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Nova Conductors

Japan . 50 parts In-Stock

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Vyrian

USA . 3,341 parts In-Stock

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Digiode

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One Stop Electronics

USA . 1,236 parts In-Stock

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Semicontronic

India . 1,487 parts In-Stock

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$12.675

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AZTECH Wire

Italy . 847 parts In-Stock

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Ampacity Inc.

Singapore . 1,119 parts In-Stock

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Aztec Data Supply Inc.

USA . 3,793 parts In-Stock

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Modulus Dynamics

Lithuania . 377 parts In-Stock

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Corohmni

South Africa . 364 parts In-Stock

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Texas Native Microelectronics

USA . 125 parts In-Stock

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Kenton Components

USA . 22,271 parts In-Stock

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$189.652

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$182.066

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$176.376

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$166.893

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Qasali Group International

UK . 30 parts In-Stock

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$426.716

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Microchip USA

USA . 8,465 parts In-Stock

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$3,682.128

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Continental Prestige Electronics

USA . 3,176 parts In-Stock

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Netroflash

USA . 2,000 parts In-Stock

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Argo Parts USA

USA . 1,823 parts In-Stock

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$4,556.119

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$4,510.097

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$4,464.076

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QUARKTWIN TECHNOLOGY LTD

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Supply Digital

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Vigor

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Corphita

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MARBEL Systems

Belgium . 30 parts In-Stock

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Overview

Unlock a world of limitless possibilities with the XC7Z100-L2FFG1156I by Xilinx. Known for its top-notch quality and cutting-edge technology, Xilinx is a trusted manufacturer in the industry. This versatile product falls under the category of Other Function uPs, uCs & Peripheral ICs, making it perfect for a wide range of applications. Whether you're looking to enhance your system performance or streamline operations, this product offers unparalleled value and benefits. Experience seamless integration, superior efficiency, and unmatched reliability with the XC7Z100-L2FFG1156I - the ultimate choice for all your technological needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the product lightweight and durable, ideal for portable devices.

Surface Mount: YES

Surface mount technology allows for easy integration and space-saving on PCBs, making the product suitable for compact designs.

Maximum Supply Voltage: 1.05 V

The high maximum supply voltage tolerance provides flexibility in power supply options for the product.

Package Shape: SQUARE

The square package shape allows for efficient use of PCB space and easy alignment during assembly.

No. of Terminals: 1156

The high number of terminals allows for connectivity to multiple external components, enhancing the product's functionality.

Package Style (Meter): GRID ARRAY

The grid array package style offers excellent thermal performance and mechanical stability, ensuring reliable operation of the product.

Minimum Supply Voltage: 0.95 V

The low minimum supply voltage requirement ensures efficient power consumption and compatibility with various power sources.

Maximum Operating Temperature: 100 °C

The high maximum operating temperature tolerance makes the product suitable for industrial applications where temperature variations are common.

Minimum Operating Temperature: -40 °C

The wide range of minimum operating temperature allows the product to function reliably in extreme temperature conditions.

Terminal Position: BOTTOM

The bottom terminal position simplifies PCB layout and improves accessibility during assembly and maintenance.

Maximum Seated Height: 3.1 mm

The low maximum seated height profile enables a slim and compact design for the overall product.

Width: 35 mm

The standard width dimension allows for easy integration into various enclosure designs and PCB layouts.

Length: 35 mm

The standard length dimension provides compatibility with industry-standard design specifications, facilitating product integration.

Peripheral IC Type: SYSTEM ON CHIP

The inclusion of a system-on-chip peripheral IC enhances the product's functionality by integrating multiple functions into a single chip, reducing system complexity.

Technology: CMOS

The CMOS technology used in the product offers low power consumption and high noise immunity, making it suitable for battery-powered devices.

Terminal Form: BALL

The ball terminal form provides reliable electrical connections and ease of soldering during assembly, ensuring robust performance of the product.

Nominal Supply Voltage: 1 V

The nominal supply voltage of 1V ensures compatibility with common power sources, simplifying system design and integration.

Terminal Pitch: 1 mm

The small terminal pitch allows for high-density mounting of the product on the PCB, enabling compact and space-efficient system designs.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs XC7Z100-L2FFG1156I attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Xilinx

Specs

JESD-30 Code:

S-PBGA-B1156

Length:

35 mm

No. of Terminals:

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA1156,34X34,40

Package Shape:

Package Style (Meter):

GRID ARRAY

Maximum Seated Height:

3.1 mm

Maximum Supply Voltage:

1.05 V

Minimum Supply Voltage:

.95 V

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Width:

35 mm

Peripheral IC Type:

Trade Compliance

XC7Z100-L2FFG1156I Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.D

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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