Loading...

MCIMX6S8DVM10AB

NXP Semiconductors

MCIMX6S8DVM10AB by NXP Semiconductors

MCIMX6S8DVM10AB by NXP Semiconductors is a SYSTEM ON CHIP with CMOS technology. It operates b/w 0-95 °C and has a supply voltage range of 1.35-1.5 V, making it ideal for low-power applications in various electronic devices.

Median Price

$33.470

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 398 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

398

-

-

-

-

Flip Electronics (Authorized)

USA . 398 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

398

-

-

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 53 parts In-Stock

1+ parts

$33.470

100+ parts

-

1k+ parts

-

10k+ parts

-

53

$33.470

-

-

-

Digiode

USA . 4,123 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,123

-

-

-

-

Anansix

USA . 1,280 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,280

-

-

-

-

Flip Electronics

USA . 398 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

398

-

-

-

-

DigiKey Marketplace

USA . 398 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

398

-

-

-

-

Vyrian

USA . 143 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

143

-

-

-

-

ACDS - Activité Composants Distribution Service

France . 1 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 195 parts In-Stock

1+ parts

$2.000

100+ parts

-

1k+ parts

-

10k+ parts

-

195

$2.000

-

-

-

AZTECH Wire

Italy . 391 parts In-Stock

1+ parts

$17.762

100+ parts

-

1k+ parts

-

10k+ parts

-

391

$17.762

-

-

-

Semicontronic

India . 209 parts In-Stock

1+ parts

$21.000

100+ parts

$20.475

1k+ parts

$20.370

10k+ parts

-

209

$21.000

$20.475

$20.370

-

One Stop Electronics

USA . 394 parts In-Stock

1+ parts

$28.000

100+ parts

-

1k+ parts

-

10k+ parts

-

394

$28.000

-

-

-

Aranea Global

USA . 1,000 parts In-Stock

1+ parts

$32.801

100+ parts

-

1k+ parts

$31.489

10k+ parts

-

1,000

$32.801

-

$31.489

-

Continental Prestige Electronics

USA . 3,061 parts In-Stock

1+ parts

$33.470

100+ parts

-

1k+ parts

-

10k+ parts

$32.801

3,061

$33.470

-

-

$32.801

Corohmni

South Africa . 2,948 parts In-Stock

1+ parts

$41.358

100+ parts

-

1k+ parts

-

10k+ parts

-

2,948

$41.358

-

-

-

Microchip USA

USA . 2,146 parts In-Stock

1+ parts

$70.286

100+ parts

-

1k+ parts

-

10k+ parts

-

2,146

$70.286

-

-

-

Component Stockers USA

USA . 334 parts In-Stock

1+ parts

$397.460

100+ parts

-

1k+ parts

-

10k+ parts

-

334

$397.460

-

-

-

UNI Independent Distributors

Spain . 8,385 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,385

-

-

-

-

Corphita

USA . 3,941 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,941

-

-

-

-

Authorized Procurement Solutions

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,000

-

-

-

-

Argo Parts USA

USA . 1,022 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,022

-

-

-

-

Perfect Parts

USA . 77 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

77

-

-

-

-

Cyclops Electronics Ltd (Excess)

UK . 1 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1

-

-

-

-

Overview

Unleash the power of innovation with the MCIMX6S8DVM10AB by NXP Semiconductors. This cutting-edge System on Chip offers unmatched performance and reliability, perfect for a wide range of applications in the field of Other Function uPs,uCs & Peripheral ICs. With a focus on quality and precision, NXP Semiconductors has crafted a product that exceeds expectations. Experience seamless integration, enhanced functionality, and unparalleled value with the MCIMX6S8DVM10AB. Elevate your projects to new heights with this exceptional solution.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and resistance to environmental factors, ensuring the product remains reliable in various conditions.

Surface Mount: YES

Facilitates easy installation on circuit boards, saving time and effort during assembly.

Maximum Supply Voltage: 1.5 V

Suitable for low power applications, helping to optimize energy efficiency.

Package Shape: SQUARE

Allows for efficient use of space on the PCB, especially in compact designs.

No. of Terminals: 624

Offers a high level of connectivity options for various components, enhancing versatility in circuit design.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

Enables a compact footprint and precise alignment on the PCB, enhancing overall system integration.

Minimum Supply Voltage: 1.35 V

Provides flexibility in power supply requirements, accommodating a wide range of voltage inputs.

Maximum Operating Temperature: 95 °C

Ensures stable performance even in high-temperature environments, enhancing reliability.

Minimum Operating Temperature: 0 °C

Allows for operation in diverse temperature conditions, making the product suitable for different applications.

Terminal Finish: TIN SILVER COPPER

Enhances conductivity and corrosion resistance, extending the lifespan of the product.

Terminal Position: BOTTOM

Facilitates easy connections during PCB assembly, streamlining the manufacturing process.

Maximum Seated Height: 1.6 mm

Contributes to a slim profile, ideal for applications with space constraints.

Width: 21 mm

Suits various PCB layouts and designs, offering compatibility with different board sizes.

Maximum Time At Peak Reflow Temperature (s): 40

Ensures proper soldering and reflow processes, maintaining the integrity of the connections.

Peak Reflow Temperature °C: 260

Withstands high-temperature reflow processes, ensuring reliable solder joints.

Length: 21 mm

Contributes to a compact form factor, suitable for space-constrained applications.

Peripheral IC Type: SYSTEM ON CHIP

Integrates multiple functions into a single chip, reducing complexity and enhancing performance.

Technology: CMOS

Offers low power consumption and high noise immunity, suitable for energy-efficient designs.

Terminal Form: BALL

Facilitates easy soldering and reliable electrical connections, enhancing overall product quality.

Terminal Pitch: 0.8 mm

Provides precise spacing for connections, ensuring compatibility with standard PCB layouts.

Moisture Sensitivity Level (MSL): 3

Allows for safe handling and storage in standard manufacturing environments, preventing moisture-related damage.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MCIMX6S8DVM10AB attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

S-PBGA-B624

JESD-609 Code:

e1

Length:

21 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

624

Maximum Operating Temperature:

95 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA624,25X25,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.6 mm

Maximum Supply Voltage:

1.5 V

Minimum Supply Voltage:

1.35 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

21 mm

Peripheral IC Type:

Trade Compliance

MCIMX6S8DVM10AB Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20