Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
Featured manufacturers
NXP Semiconductors' MIMXRT1061CVL5B is a SoC with CMOS technology, featuring 196 terminals in a low-profile grid array package. Operating b/w -40 to 105°C, it has a supply voltage range of 1.15-1.26V and peak reflow temp of 260°C. Ideal for applications requiring high-performance microcontrollers in compact form factors.
Median Price
$12.190
Lifecycle Status
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19
In-Stock Inventory
1k+
Arrow
1+ parts
$7.564
100+ parts
$7.281
1k+ parts
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Farnell
$8.140
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Chip1Stop
$10.600
$7.100
Newark
$13.780
$8.910
$8.780
DigiKey
$14.350
$10.556
$8.975
Mouser Electronics
$9.340
$8.960
Element14
$20.800
$13.710
Verical
$7.075
Flip Electronics (Authorized)
Digiode
$6.479
Nova Conductors
$11.988
Sensible Micro Corp
IBS Electronics
$11.040
TME
$4.550
Anansix
Cyclops Electronics Ltd
NAC Semi
$10.290
Vyrian
Flip Electronics
Corphita
$6.138
Semicontronic
$6.430
$6.269
$6.237
Netroflash
$11.389
$11.149
Continental Prestige Electronics
$12.390
$8.310
Ampacity Inc.
$13.990
Corohmni
$22.803
Advanced Electronics
$45.297
$43.032
Aztec Data Supply Inc.
$50.980
Lixinc
Argo Parts USA
Robosynatics
Lucentia Tech
$30.374
$29.754
Epart123
$8.500
iodParts Technologies Inc.
UNI Independent Distributors
Computer Components Inc. - USA
The use of plastic/epoxy as the package body material provides durability and protection for the internal components of the product.
Being surface mount compatible allows for easier and more efficient assembly of the product onto circuit boards.
The product can operate efficiently within a specified voltage range, ensuring stable performance.
The square package shape helps in optimizing space utilization on circuit boards.
Having a high number of terminals allows for connectivity to multiple external devices, enhancing the product's functionality.
The specified minimum supply voltage ensures that the product can still operate within safe parameters, even at lower voltage levels.
With a high maximum operating temperature, the product can withstand elevated temperatures without compromising performance.
The terminal finish of tin silver copper provides good conductivity and corrosion resistance for the product's connections.
The System on Chip (SoC) design integrates multiple functions into a single chip, offering efficiency and compactness for the product.
A moisture sensitivity level of 3 indicates that the product has moderate sensitivity to moisture exposure, requiring appropriate handling during assembly and storage.
Other Function uPs,uCs & Peripheral ICs MIMXRT1061CVL5B attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from NXP Semiconductors
JESD-30 Code:
JESD-609 Code:
Length:
Moisture Sensitivity Level (MSL):
No. of Terminals:
Maximum Operating Temperature:
Minimum Operating Temperature:
Package Body Material:
Package Code:
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Maximum Seated Height:
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Technology:
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MIMXRT1061CVL5B Peripheral ICs trade compliance attributes, and parameters.
ECCN
5A992.C
ECCN Governance
EAR
HTS
8542.31.00.01
SB
8542.31.00.00
PCN Design/Specification - Datasheet Update 08/May/2021
PCN Assembly/Origin - Mult Dev A/T Chg 20/Apr/2021
PCN Other - Reference Manual 25/Nov/2021
NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.
Executive Director, President, CEO
Kurt Sievers
Executive VP, CFO
Bill Betz
Executive VP, Chief Sales Officer
Ron Martino
ICN8
Fabrication
Fab Initiation
1996
Netherlands
Nijmegen
Wafer Capacity
55,000
ATMC (Austin Tech & Mfg Center)
1995
USA
Austin
30,000
N/A
1989
Germany
Boeblingen
CHD
1993
Chandler
OHTC
1991
24,000
New Expansion Fab
2026
ECHO
2020
10,000
SMBJ18CA
Yangzhou Yangjie Electronics
TRANS VOLTAGE SUPPRESSOR DIODE; Surface Mount: YES; Maximum Clamping Voltage: 29.2 V; Nominal Breakdown Voltage: 21.05 V; Maximum Repetitive Peak Reverse Voltage: 18 V; Polarity: BIDIRECTIONAL;
BSS138
Fairchild Semiconductor
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Operating Mode: ENHANCEMENT MODE; Qualification: Not Qualified;
1N4148WT
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
2N2222A
Minilogic Device
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .625 W; Maximum Collector Current (IC): .001 A;
1N4148WS
Rectron
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
IRLML6402TRPBF
International Rectifier
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 1.3 W; Peak Reflow Temperature (C): 260; Package Style (Meter): SMALL OUTLINE;
Leshan Radio
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Goodwork Semiconductor
M39029/56-351
Carlisle Interconnect Technologies
CONNECTOR ACCESSORY; MIL Conformity: YES; Contact Type: CRIMP; Removal Tools: M81969/8-06, M81969/14-02; IEC Conformity: NO; Contact Gender: FEMALE;
RK73H2ATTD10R0F
Koa Speer Electronics
RK73H2ATTD10R0F by Koa Speer Electronics is a 0805 SMT fixed resistor with 10 ohm resistance, 1% tolerance, and 0.25 W power dissipation. Ideal for surface mount applications in automotive electronics due to its AEC-Q200 reference standard and operating voltage of 150 V.
NE555/D
General Electric Solid State
Analog Waveform Generation Functions; Temperature Grade: COMMERCIAL; Maximum Operating Temperature: 70 Cel; Technology: BIPOLAR; Package Equivalence Code: DIE OR CHIP; Qualification: Not Qualified;
1N4148
Shenzhen Yixinsemi Electronics
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
Silicon Standard
LL4148
Promax-johnton
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
2N7002
Inter F E T
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Maximum Drain-Source On Resistance: 7.5 ohm; Maximum Drain Current (Abs) (ID): .115 A;
Weitron Technology
RECTIFIER DIODE; Surface Mount: NO; Maximum Reverse Recovery Time: .004 us; Config: SINGLE; Maximum Output Current: .15 A; Terminal Finish: Tin/Lead (Sn/Pb);
Philips Semiconductors
RECTIFIER DIODE; Surface Mount: NO; Terminal Finish: MATTE TIN; Maximum Operating Temperature: 200 Cel; Maximum Output Current: .15 A; JESD-609 Code: e3;
Formosa Microsemi
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .225 W; Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR; Maximum Drain Current (Abs) (ID): .115 A;
2N7002,215
NXP Semiconductors
2N7002,215 by NXP Semiconductors is a small signal N-CHANNEL FET with a min DS breakdown voltage of 60V and max drain current of 0.3A. It is used for switching applications in enhancement mode, operates b/w -65 to 150 °C, and has a max power dissipation of 0.2W.
MCIMX356AJQ5C
MCIMX356AJQ5C by NXP Semiconductors is a SYSTEM ON CHIP with CMOS technology. It operates b/w -40 to 85 °C and has a supply voltage range of 1.33V to 1.47V, making it ideal for industrial applications requiring low profile, fine pitch ICs in a grid array package style.
EFR32MG12P432F1024IM48-CR
Silicon Labs
EFR32MG12P432F1024IM48-CR by Silicon Labs is a System on Chip with 48 terminals, operating at temperatures from -40 to 125°C. It has a supply voltage range of 1.8V to 3.8V and utilizes CMOS technology. This chip is ideal for applications requiring low-profile, surface-mount components in various electronic systems.
ESP32-S3-WROOM-1U-N4R2
Espressif Systems (Shanghai)
ESP32-S3-WROOM-1U-N4R2 by Espressif Systems is a 41-terminal SoC with CMOS technology. It operates b/w -40 to 85°C, with supply voltage range of 3-3.6V. Ideal for IoT applications due to its compact size and surface mount capability.
AM6442BSDGHAALV
Texas Instruments
AM6442BSDGHAALV by Texas Instruments is a CMOS system-on-chip with 441 terminals in a square grid array package. It operates at temperatures ranging from -40 to 105 °C and has a max supply voltage of 0.79 V. This IC is commonly used in applications requiring high-speed processing, such as data centers or telecommunications equipment.
FCM8531QY
Onsemi
FCM8531QY by Onsemi is a 32-terminal microprocessor circuit with CMOS technology. It operates b/w -40 to 85 °C, compatible with I2C, SPI, and UART buses. This low-profile flatpack IC is ideal for industrial applications requiring a supply voltage of 4.5-5.5 V.
MIMXRT1175CVM8A
The NXP MIMXRT1175CVM8A is a SoC peripheral IC with CMOS technology. It operates b/w -40 to 105 °C, with supply voltage range of 1.1-1.15 V. Its grid array package has 289 terminals and measures 14x14 mm, making it suitable for various embedded applications.
SCANSTA112SM/NOPB
SCANSTA112SM/NOPB by Texas Instruments is a MICROPROCESSOR CIRCUIT with 100 terminals in a GRID ARRAY package. It operates at temperatures from -40 to 85 °C and has a supply voltage of 3.3 V, making it ideal for INDUSTRIAL applications requiring high performance and reliability.
MCIMX6Y1CVM05AB
MCIMX6Y1CVM05AB by NXP Semiconductors is a low-profile, fine-pitch grid array SoC with 289 terminals. It operates b/w -40 to 105°C, with supply voltage ranging from 1.275V to 1.5V. Ideal for applications requiring high-performance computing in compact spaces.
MIMXRT1051CVL5A
The NXP Semiconductors MIMXRT1051CVL5A is a System on Chip with CMOS technology. It operates b/w -40 to 105°C, with supply voltage ranging from 1.15V to 1.26V. With a grid array package style and 196 terminals, it's ideal for industrial applications requiring low profile and fine pitch components.
NRF52832-QFAB-R7
Nordic Semiconductor Asa
NRF52832-QFAB-R7 by Nordic Semiconductor Asa is a 48-terminal SoC with CMOS technology. It operates b/w -40 to 85 °C and supports supply voltage range of 1.7V to 3.6V. Ideal for applications requiring low-profile, surface-mountable chips in various electronic devices.
EFR32MG12P432F1024GM48-CR
EFR32MG12P432F1024GM48-CR by Silicon Labs is a System on Chip with 48 terminals, operating b/w -40 to 85°C. It has a supply voltage range of 1.8V to 3.8V and utilizes CMOS technology. This chip carrier with a very thin profile is suitable for various applications requiring low power consumption and compact design.
BM94801KUT-Z
ROHM
ROHM's BM94801KUT-Z is a MICROPROCESSOR CIRCUIT with 128 terminals, operating from -40 to 85 °C. It features a thin profile FLATPACK package, 0.4 mm terminal pitch, and CMOS technology. Ideal for industrial applications requiring low voltage (1.5-1.65 V) and compact design with gull wing terminals.
CY8C4245PVI-DS402
Cypress Semiconductor
PROGRAMMABLE SoC; Terminal Form: GULL WING; No. of Terminals: 28; Package Code: SSOP; Package Shape: RECTANGULAR; Package Style (Meter): SMALL OUTLINE, SHRINK PITCH;
FT245RL-TUBE
FTDI
FTDI's FT245RL-TUBE is a CMOS microprocessor circuit with 28 terminals. It operates b/w -40 to 85 °C, with supply voltage range of 3.3V to 5.25V. Ideal for industrial applications requiring small outline package style and surface mount compatibility.
ESP32-C3-MINI-1-N4
ESP32-C3-MINI-1-N4 by Espressif Systems is a 53-terminal SoC with CMOS technology. It operates b/w -40 to 85 °C, with supply voltage range of 3-3.6 V. Ideal for IoT applications due to its compact size and surface mount capability.
MCIMX6Q6AVT10ACR
MCIMX6Q6AVT10ACR by NXP Semiconductors is a SYSTEM ON CHIP with 624 terminals, operating at -40 to 125 °C. It has a supply voltage range of 1.35V to 1.5V and uses BALL terminal form for automotive applications.
ATECC608B-MAHCZ-T
Microchip Technology
Microchip ATECC608B-MAHCZ-T is a cryptographic authenticator IC with 8 terminals, 1-Wire bus compatibility, and CMOS technology. It operates b/w -40 to 85 °C, suitable for industrial applications requiring secure authentication. Package style: Small Outline, Heat Sink/Slug, Very Thin Profile.
MIMX8MN5DVPIZAA
The NXP Semiconductors MIMX8MN5DVPIZAA is a SoC with CMOS technology, featuring 306 terminals in a grid array package. It operates b/w 0-95°C, with supply voltage ranging from 0.9-1V. Ideal for applications requiring high performance and low power consumption.
MCIMX536AVV8C
MCIMX536AVV8C by NXP Semiconductors is a SYSTEM ON CHIP with 529 terminals, operating at -40 to 125 °C. It has a supply voltage range of 1.05-1.8/3.3 V and is AEC-Q100 compliant for automotive applications. The package style is GRID ARRAY, FINE PITCH in PLASTIC/EPOXY material, suitable for surface mount assembly.
XC7Z100-L2FFG1156I
Xilinx
XC7Z100-L2FFG1156I by Xilinx is a System on Chip with CMOS technology. It operates b/w -40 to 100°C, with supply voltage ranging from 0.95V to 1.05V. With 1156 terminals in a square grid array package, it's ideal for various applications requiring high-performance processing capabilities.
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MIMXRT1062CVL5B
The NXP Semiconductors MIMXRT1062CVL5B is a low-profile, fine-pitch grid array SoC with 196 terminals. It operates b/w -40 to 105°C and has a supply voltage range of 1.15-1.26V. Ideal for applications requiring high-performance microcontrollers in compact designs.
MIMXRT1062CVL5A
The NXP Semiconductors MIMXRT1062CVL5A is a SoC with CMOS technology, featuring 196 terminals in a low profile grid array package. It operates b/w -40 to 105 °C and has a supply voltage range of 1.15V to 1.26V. Ideal for industrial applications requiring high performance uPs/uCs & peripheral ICs in compact form factors.
MIMXRT1062CVJ5A
MIMXRT1062CVJ5A by NXP Semiconductors is a CMOS SoC with 196 terminals in a low profile, fine pitch grid array package. It operates in industrial temperature range (-40 to 105 °C) and has a max supply voltage of 1.26 V. This IC is suitable for various applications requiring high-performance microcontrollers.
MIMXRT1062CVJ5B
The NXP MIMXRT1062CVJ5B is a SoC with CMOS technology. It operates b/w -40 to 105°C, with a supply voltage range of 1.15-1.26V. With 196 terminals in a low-profile grid array package, it's ideal for applications requiring high performance and compact design.
MIMXRT1176CVM8A
The NXP MIMXRT1176CVM8A is a SoC with CMOS technology, featuring 289 terminals in a low-profile grid array package. Operating b/w -40 to 105°C, it has a supply voltage range of 1.1-1.15V and peak reflow temp of 260°C. Ideal for applications requiring high-performance microcontrollers in compact form factors.
MIMX8MM6DVTLZAA
MIMX8MM6DVTLZAA by NXP Semiconductors is a low-profile, fine-pitch SoC with 486 terminals. It operates at a voltage range of 0.95V to 1.05V and can withstand temperatures up to 95°C. This versatile chip is commonly used in various applications requiring high-performance microcontrollers and peripheral ICs.
MIMX8MQ6DVAJZAB
SoC; JESD-609 Code: e2; Maximum Time At Peak Reflow Temperature (s): 40; Peak Reflow Temperature (C): 260; Terminal Finish: TIN SILVER; Moisture Sensitivity Level (MSL): 3;
MIMXRT1064CVJ5B
MIMXRT1064CVJ5B by NXP Semiconductors is a CMOS SoC with 196 terminals in a low profile, fine pitch grid array package. It operates at temperatures ranging from -40 to 105 °C and has a max supply voltage of 1.26 V. This IC is commonly used in industrial applications requiring high-performance microcontrollers.
MIMXRT1064CVL5B
SoC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 196; Package Code: LFBGA; Package Shape: SQUARE;
MIMXRT1173CVM8A
NXP Semiconductors' MIMXRT1173CVM8A is a low-profile, fine-pitch SoC with 289 terminals in a grid array package. It operates b/w -40 to 105°C, with supply voltage ranging from 1.1V to 1.15V. Ideal for applications requiring high-performance uPs and uCs in compact designs.
MIMXRT1171CVM8A
The NXP Semiconductors MIMXRT1171CVM8A is a SoC with CMOS technology, featuring 289 terminals in a low-profile grid array package. Operating b/w -40 to 105°C, it has a supply voltage range of 1.1-1.15V and peak reflow temperature of 260°C. Ideal for applications requiring high-performance microcontrollers in compact form factors.
MIMXRT1052CVL5B
SYSTEM ON CHIP; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 196; Package Code: LFBGA; Package Shape: SQUARE;
MIMX8MM6DVTLZAAR
The NXP Semiconductors MIMX8MM6DVTLZAAR is a low-profile, fine-pitch SoC with 486 terminals. Operating b/w 0-95°C, it has a supply voltage range of 0.95-1.05V and uses CMOS technology. Ideal for applications requiring high processing power in compact spaces.
MIMXRT1021CAG4A
The NXP Semiconductors MIMXRT1021CAG4A is an SoC with a peak reflow temperature of 260°C and industrial-grade temperature tolerance. It has a max time at peak reflow temperature of 40s, making it suitable for applications requiring high-performance processing in harsh environments.
MIMX8MQ6DVAJZAA
SoC; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 3;
MIMXRT117FCVM8A
SoC; Terminal Form: BALL; No. of Terminals: 289; Package Code: LFBGA; Package Shape: SQUARE; Maximum Seated Height: 1.52 mm;
MIMXRT1064CVL5A
The NXP MIMXRT1064CVL5A is a SoC with CMOS technology, featuring 196 terminals in a low profile grid array package. It operates b/w -40 to 105 °C, with supply voltage ranging from 1.15V to 1.26V. Ideal for industrial applications requiring high performance and compact design.
MIMX8QX6AVLFZAC
The NXP Semiconductors MIMX8QX6AVLFZAC is a System on Chip with 609 terminals, operating at -40 to 125 °C. It features a supply voltage range of 1.05V to 1.15V and uses CMOS technology. Ideal for automotive applications requiring high performance in a compact grid array package style.
MIMXRT1052CVJ5B
The NXP Semiconductors MIMXRT1052CVJ5B is a System on Chip with CMOS technology, featuring 196 terminals in a low profile grid array package. It operates b/w -40 to 105°C, with supply voltage ranging from 1.15V to 1.26V. Ideal for industrial applications requiring high performance and reliability.
MIMX8MN6DVTJZAA
The NXP Semiconductors MIMX8MN6DVTJZAA is a low-profile, fine-pitch grid array SoC with 486 terminals. Operating b/w 0-95°C, it has a supply voltage range of 0.95-1.05V and peak reflow temperature of 260°C. Ideal for applications requiring high-performance computing in compact spaces.
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