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MIMX8MN6DVTJZAA

NXP Semiconductors

MIMX8MN6DVTJZAA by NXP Semiconductors

The NXP Semiconductors MIMX8MN6DVTJZAA is a low-profile, fine-pitch grid array SoC with 486 terminals. Operating b/w 0-95°C, it has a supply voltage range of 0.95-1.05V and peak reflow temperature of 260°C. Ideal for applications requiring high-performance computing in compact spaces.

Median Price

$25.980

Lifecycle Status

Suppliers In-Stock

15

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 152 parts In-Stock

1+ parts

$16.800

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-

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152

$16.800

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Arrow

USA . 4,675 parts In-Stock

1+ parts

$25.980

100+ parts

$18.600

1k+ parts

$16.570

10k+ parts

-

4,675

$25.980

$18.600

$16.570

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Verical

USA . 4,675 parts In-Stock

1+ parts

$25.980

100+ parts

$18.600

1k+ parts

$16.570

10k+ parts

-

4,675

$25.980

$18.600

$16.570

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DigiKey

USA . 229 parts In-Stock

1+ parts

$26.530

100+ parts

$20.028

1k+ parts

$17.797

10k+ parts

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229

$26.530

$20.028

$17.797

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Mouser Electronics

USA . 99 parts In-Stock

1+ parts

$26.530

100+ parts

$18.270

1k+ parts

$17.790

10k+ parts

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99

$26.530

$18.270

$17.790

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Rochester

USA . 145 parts In-Stock

1+ parts

-

100+ parts

$15.230

1k+ parts

$13.630

10k+ parts

$12.820

145

-

$15.230

$13.630

$12.820

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,793 parts In-Stock

1+ parts

$16.074

100+ parts

-

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1,793

$16.074

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Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$25.695

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100

$25.695

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Maritex

Poland . 304 parts In-Stock

1+ parts

$34.907

100+ parts

$20.560

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304

$34.907

$20.560

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Vyrian

USA . 6,345 parts In-Stock

1+ parts

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6,345

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Martec Srl

Italy . 3,656 parts In-Stock

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3,656

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Anansix

USA . 2,668 parts In-Stock

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2,668

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Cyclops Electronics Ltd

UK . 2,600 parts In-Stock

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2,600

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NAC Semi

USA . 304 parts In-Stock

1+ parts

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$23.750

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304

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$23.750

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IBS Electronics

USA . 152 parts In-Stock

1+ parts

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100+ parts

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$20.072

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152

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$20.072

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 671 parts In-Stock

1+ parts

$14.380

100+ parts

$14.020

1k+ parts

$13.949

10k+ parts

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671

$14.380

$14.020

$13.949

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Ampacity Inc.

Singapore . 657 parts In-Stock

1+ parts

$14.380

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657

$14.380

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Corphita

USA . 3,400 parts In-Stock

1+ parts

$15.228

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3,400

$15.228

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Continental Prestige Electronics

USA . 284 parts In-Stock

1+ parts

$17.550

100+ parts

$13.170

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284

$17.550

$13.170

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Netroflash

USA . 2,000 parts In-Stock

1+ parts

$25.695

100+ parts

$25.181

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2,000

$25.695

$25.181

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Advanced Electronics

New Zealand . 1,000 parts In-Stock

1+ parts

$49.672

100+ parts

$45.202

1k+ parts

$40.731

10k+ parts

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1,000

$49.672

$45.202

$40.731

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Corohmni

South Africa . 823 parts In-Stock

1+ parts

$52.654

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823

$52.654

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Modulus Dynamics

Lithuania . 4,279 parts In-Stock

1+ parts

$55.701

100+ parts

$55.701

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$55.701

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4,279

$55.701

$55.701

$55.701

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Aztec Data Supply Inc.

USA . 3,511 parts In-Stock

1+ parts

$58.120

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3,511

$58.120

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Microchip USA

USA . 2,665 parts In-Stock

1+ parts

$79.790

100+ parts

$78.400

1k+ parts

$77.710

10k+ parts

$77.010

2,665

$79.790

$78.400

$77.710

$77.010

Lixinc

USA . 18,510 parts In-Stock

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UNI Independent Distributors

Spain . 6,411 parts In-Stock

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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GreenTree Electronics

Israel . 3,656 parts In-Stock

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Argo Parts USA

USA . 2,366 parts In-Stock

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Futuretech Components

Singapore . 2,280 parts In-Stock

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2,280

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A-Z Elektronik GmbH

Germany . 2,000 parts In-Stock

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2,000

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Overview

Experience the next level of performance and efficiency with the MIMX8MN6DVTJZAA by NXP Semiconductors. This cutting-edge product falls under the category of Other Function uPs,uCs & Peripheral ICs, showcasing the unparalleled quality and innovation that NXP is known for. The applications for this device are vast, offering endless possibilities for your projects. With a focus on value and customer benefits, this product provides unmatched advantages in terms of reliability, functionality, and overall performance. Trust NXP to deliver the solutions you need to succeed in today's competitive market.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection for the IC, making it suitable for a wide range of applications.

Surface Mount: YES

Surface Mount capability allows for easy integration onto circuit boards, saving space and simplifying assembly process.

Maximum Supply Voltage: 1.05 V

With a high maximum supply voltage, this IC can handle varying power inputs without risk of damage.

Package Shape: SQUARE

Square package shape ensures a compact design and efficient use of space on the PCB.

No. of Terminals: 486

Large number of terminals enables versatile connections and functions, suitable for complex circuit designs.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

Grid Array package style with low profile and fine pitch allows for high-density mounting, ideal for compact electronic devices.

Minimum Supply Voltage: 0.95 V

Low minimum supply voltage ensures efficient power consumption and compatibility with various power sources.

Maximum Operating Temperature: 95 °C

High maximum operating temperature ensures reliable performance in harsh environments with elevated temperatures.

Minimum Operating Temperature: 0 °C

Wide operating temperature range allows for use in both cold and hot conditions, increasing the product's versatility.

Terminal Finish: TIN SILVER

Tin silver terminal finish provides good conductivity and corrosion resistance, ensuring long-term reliability of the connections.

Terminal Position: BOTTOM

Bottom terminal position simplifies soldering process and allows for efficient heat dissipation, enhancing overall performance.

Maximum Seated Height: 1.25 mm

Low maximum seated height contributes to the compact design and enables thinner electronic devices.

Width: 14 mm

Optimal width dimension allows for easy integration onto the PCB while maintaining space efficiency.

Maximum Time At Peak Reflow Temperature (s): 40

High maximum time at peak reflow temperature ensures proper soldering and reliability during assembly process.

Peak Reflow Temperature °C: 260

Peak reflow temperature of 260°C guarantees secure solder joints and stable connections for the IC.

Length: 14 mm

Compact length dimension facilitates efficient layout on the PCB and contributes to the overall space-saving design.

Peripheral IC Type: SoC

System on Chip (SoC) design integrates multiple functions into a single chip, reducing overall system complexity and enhancing performance.

Technology: CMOS

CMOS technology offers low power consumption, high speed, and reliable performance, making it suitable for various applications.

Terminal Form: BALL

Ball terminal form provides reliable and stable connections, ensuring high-quality performance and durability.

Nominal Supply Voltage: 1 V

Stable nominal supply voltage of 1V ensures consistent and reliable operation of the IC in a wide range of applications.

Terminal Pitch: 0.5 mm

Narrow terminal pitch allows for high-density mounting and compact design, suitable for space-constrained applications.

Moisture Sensitivity Level (MSL): 3

Moisture Sensitivity Level of 3 indicates that the IC is moderately sensitive to moisture, requiring proper handling and storage to maintain quality.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MIMX8MN6DVTJZAA attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

S-PBGA-B486

JESD-609 Code:

e2

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

486

Maximum Operating Temperature:

95 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA486,27X27,20

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.25 mm

Maximum Supply Voltage:

1.05 V

Minimum Supply Voltage:

.95 V

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

14 mm

Peripheral IC Type:

SoC

Trade Compliance

MIMX8MN6DVTJZAA Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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