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MSP430F6779IPEUR

Texas Instruments

MSP430F6779IPEUR by Texas Instruments

MSP430F6779IPEUR by Texas Instruments is a 16-bit microprocessor with 128 terminals, operating at a max frequency of 25 MHz. Ideal for industrial applications, it features 32KB RAM, 524288 ROM words, and supports I2C, SPI, UART bus compatibility.

Median Price

$16.140

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 3,980 parts In-Stock

1+ parts

$9.869

100+ parts

$8.620

1k+ parts

$5.945

10k+ parts

-

3,980

$9.869

$8.620

$5.945

-

DigiKey

USA . 1,470 parts In-Stock

1+ parts

$16.140

100+ parts

$11.035

1k+ parts

$10.201

10k+ parts

-

1,470

$16.140

$11.035

$10.201

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Mouser Electronics

USA . 1,227 parts In-Stock

1+ parts

$16.140

100+ parts

$11.030

1k+ parts

$10.190

10k+ parts

-

1,227

$16.140

$11.030

$10.190

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,819 parts In-Stock

1+ parts

$9.376

100+ parts

-

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4,819

$9.376

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Nova Conductors

Japan . 200 parts In-Stock

1+ parts

$10.560

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200

$10.560

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Vyrian

USA . 1,899 parts In-Stock

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1,899

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 2,221 parts In-Stock

1+ parts

$8.390

100+ parts

$8.180

1k+ parts

$8.138

10k+ parts

-

2,221

$8.390

$8.180

$8.138

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Ampacity Inc.

Singapore . 2,059 parts In-Stock

1+ parts

$8.390

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2,059

$8.390

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Corphita

USA . 2,834 parts In-Stock

1+ parts

$8.882

100+ parts

-

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2,834

$8.882

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Continental Prestige Electronics

USA . 4,725 parts In-Stock

1+ parts

$10.560

100+ parts

-

1k+ parts

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10k+ parts

$10.349

4,725

$10.560

-

-

$10.349

Corohmni

South Africa . 68 parts In-Stock

1+ parts

$11.493

100+ parts

-

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68

$11.493

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Parana Technologies

USA . 1,213 parts In-Stock

1+ parts

$71.016

100+ parts

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1,213

$71.016

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DigiPath Technology Company

USA . 924 parts In-Stock

1+ parts

$78.197

100+ parts

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924

$78.197

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ChromeModa Solutions

Germany . 3,943 parts In-Stock

1+ parts

$79.793

100+ parts

$65.430

1k+ parts

-

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3,943

$79.793

$65.430

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IDEA Electronic Components Group

UK . 1,573 parts In-Stock

1+ parts

$79.793

100+ parts

$75.803

1k+ parts

$71.814

10k+ parts

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1,573

$79.793

$75.803

$71.814

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Lixinc

USA . 16,171 parts In-Stock

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Authorized Procurement Solutions

USA . 3,500 parts In-Stock

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3,500

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Argo Parts USA

USA . 3,400 parts In-Stock

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Futuretech Components

Singapore . 1,500 parts In-Stock

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1,500

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Perfect Parts

USA . 1,057 parts In-Stock

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1,057

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Robosynatics

Brazil . 900 parts In-Stock

1+ parts

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900

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Lucentia Tech

USA . 900 parts In-Stock

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900

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Netroflash

USA . 100 parts In-Stock

1+ parts

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100+ parts

$10.349

1k+ parts

$10.032

10k+ parts

$9.821

100

-

$10.349

$10.032

$9.821

Overview

Unleash the power of cutting-edge technology with the MSP430F6779IPEUR by Texas Instruments. This innovative microprocessor circuit offers unparalleled performance and reliability for a wide range of applications. From industrial automation to consumer electronics, this versatile IC is designed to exceed your expectations. Experience seamless integration, high-speed processing, and low power consumption, all in a compact and durable package. Trust in Texas Instruments' renowned reputation for quality and innovation, and elevate your projects to new heights with the MSP430F6779IPEUR.

Feature Benefit Bullets

Package Body Material PLASTIC/EPOXY

Plastic/epoxy material makes the package durable and resistant to environmental factors, ensuring long-term reliability.

Surface Mount YES

Surface mount design allows for easy integration onto PCBs, saving space and simplifying the manufacturing process.

Maximum Supply Voltage 3.6 V

High maximum supply voltage allows for flexibility in power supply options and compatibility with various systems.

Package Shape RECTANGULAR

Rectangular shape makes the package easy to handle and integrate into standard PCB layouts.

Bit Size 16

16-bit architecture offers a good balance between processing power and energy efficiency for a wide range of applications.

Power Supplies (V) 2/3.3

Support for multiple power supply voltages allows for compatibility with different power systems and energy optimization.

No. of Terminals 128

Having a large number of terminals enables connectivity with various peripherals and external components for a versatile system design.

Package Style FLATPACK, LOW PROFILE, FINE PITCH

Flatpack design with low profile and fine pitch terminals allows for compact integration and efficient routing of signals on the PCB.

Minimum Supply Voltage 1.8 V

Low minimum supply voltage helps in achieving energy efficiency and extends battery life in portable devices.

Maximum Operating Temperature 85 °C

High maximum operating temperature range ensures reliability in harsh environmental conditions and industrial applications.

CPU Family MSP430

Being part of the MSP430 CPU family offers advanced features, low power consumption, and a wide range of peripherals for versatile applications.

Minimum Operating Temperature -40 °C

Low minimum operating temperature allows the product to operate in cold environments without performance degradation.

Terminal Finish NICKEL PALLADIUM GOLD

Nickel palladium gold terminal finish provides excellent conductivity, corrosion resistance, and solderability for reliable connections.

ADC Channels YES

Integrated ADC channels enable the product to interface with analog sensors and signals, expanding the range of applications it can support.

Terminal Position QUAD

Quad terminal position allows for easy and secure mounting on the PCB, ensuring stable connections and signal integrity.

ROM Words 524288

Large ROM capacity provides ample storage for program code and data, supporting complex algorithms and applications.

Maximum Seated Height 1.6 mm

Low maximum seated height allows for slim and compact device designs, especially useful in space-constrained applications.

RAM Words 32

Although small, the 32 RAM words provide fast access memory for temporary data storage and program execution, enhancing processing speed.

Width 14 mm

Narrow width enables space-efficient placement on the PCB, accommodating tight layouts and minimizing board real estate.

Maximum Clock Frequency 25 MHz

High maximum clock frequency offers fast processing speeds for time-sensitive applications and real-time control systems.

Maximum Time At Peak Reflow Temperature (s) 30

Long maximum time at peak reflow temperature allows for reliable soldering during manufacturing processes, ensuring strong connections.

Peak Reflow Temperature °C 260

High peak reflow temperature enables lead-free soldering and ensures durable connections that can withstand thermal stress.

Length 20 mm

Compact length facilitates easy placement on the PCB and supports overall space-efficient designs.

Temperature Grade INDUSTRIAL

Industrial temperature grade ensures reliable operation in harsh industrial environments with varying temperature conditions.

Peripheral IC Type MICROPROCESSOR CIRCUIT

Inclusion of a microprocessor circuit as a peripheral IC type enhances the product's processing capabilities and versatility for complex tasks.

RAM Bytes 32768

With a large amount of RAM space, the product can efficiently handle data processing and storage requirements for demanding applications.

Technology CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with various digital components for efficient operation.

Terminal Form GULL WING

Gull wing terminal form provides secure mechanical attachment to the PCB, ensuring stable connections and robust performance.

Maximum Supply Current 11.75 mA

Low maximum supply current consumption helps in reducing power usage and extends battery life, essential for portable and energy-efficient devices.

Nominal Supply Voltage 3.3 V

Having a stable nominal supply voltage of 3.3V ensures consistent performance and compatibility with standard power sources.

ROM Programmability FLASH

ROM programmability using flash memory technology allows for easy firmware updates and customization of program code without the need for external programming equipment.

Bus Compatibility I2C; SPI; UART

Support for multiple bus interfaces such as I2C, SPI, and UART enables seamless communication with a wide range of external devices and peripherals.

Terminal Pitch 0.5 mm

Fine terminal pitch of 0.5mm facilitates high-density mounting on the PCB, enabling compact designs and efficient signal routing.

Moisture Sensitivity Level (MSL) 3

Moisture sensitivity level of 3 indicates the product can withstand moderate exposure to moisture during handling and assembly processes.

Speed 25 rpm

High operating speed of 25 rpm ensures fast data processing and response times, making the product suitable for real-time applications and control systems.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MSP430F6779IPEUR attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

ADC Channels:

YES

Bit Size:

16

Bus Compatibility:

I2C; SPI; UART

CPU Family:

MSP430

Maximum Clock Frequency:

25 MHz

External Data Bus Width:

0

JESD-30 Code:

R-PQFP-G128

JESD-609 Code:

e4

Length:

20 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

128

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP128,.63X.87,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

32768

RAM Words:

32

ROM Words:

524288

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

11.75 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

MSP430F6779IPEUR Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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