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AM4377BZDNA100

Texas Instruments

AM4377BZDNA100 by Texas Instruments

AM4377BZDNA100 by Texas Instruments is a System on Chip with 491 terminals in a low profile, fine pitch grid array package. It operates b/w -40 to 105°C, with supply voltage range of 1.272V to 1.378V. Ideal for industrial applications requiring high performance and compact design.

Median Price

$36.340

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,617 parts In-Stock

1+ parts

$21.919

100+ parts

$19.483

1k+ parts

$14.326

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1,617

$21.919

$19.483

$14.326

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DigiKey

USA . 24 parts In-Stock

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$36.340

100+ parts

$26.105

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$25.034

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24

$36.340

$26.105

$25.034

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Mouser Electronics

USA . 1,009 parts In-Stock

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$37.960

100+ parts

$27.820

1k+ parts

$26.550

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1,009

$37.960

$27.820

$26.550

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,656 parts In-Stock

1+ parts

$20.823

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2,656

$20.823

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Nova Conductors

Japan . 98 parts In-Stock

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$26.120

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$26.120

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Chip Stock

USA . 3,880 parts In-Stock

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3,880

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Vyrian

USA . 1,098 parts In-Stock

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VNN

France . 913 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 896 parts In-Stock

1+ parts

$18.630

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-

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$18.630

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Corphita

USA . 2,456 parts In-Stock

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$19.727

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$19.727

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Parana Technologies

USA . 331 parts In-Stock

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$25.055

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$25.737

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$25.055

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Continental Prestige Electronics

USA . 4,604 parts In-Stock

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$26.120

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$25.598

4,604

$26.120

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$25.598

Component Stockers USA

USA . 3,295 parts In-Stock

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$27.010

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$21.270

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$21.700

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3,295

$27.010

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$21.700

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DigiPath Technology Company

USA . 1,130 parts In-Stock

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$27.589

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$27.589

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ChromeModa Solutions

Germany . 3,352 parts In-Stock

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$28.152

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$23.085

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$28.152

$23.085

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IDEA Electronic Components Group

UK . 1 parts In-Stock

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$28.152

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$26.744

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$25.337

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$28.152

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Lixinc

USA . 18,657 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,998 parts In-Stock

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Argo Parts USA

USA . 4,590 parts In-Stock

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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Kepictronics

USA . 2,000 parts In-Stock

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Netroflash

USA . 500 parts In-Stock

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$25.598

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$24.814

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$24.292

500

-

$25.598

$24.814

$24.292

Overview

Experience the cutting-edge technology and reliability of Texas Instruments with the AM4377BZDNA100. This versatile System on Chip peripheral IC offers endless possibilities for innovation in various applications. With a maximum supply voltage of 1.378V and a wide operating temperature range, this product ensures consistent performance in industrial settings. Its low profile package design and fine pitch grid array make it easy to integrate into your projects. Trust Texas Instruments to deliver quality and value with the AM4377BZDNA100.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy body material ensures durability and protection for the internal components of the product.

Surface Mount: YES

Surface mount capability allows for easy and space-efficient installation on circuit boards.

Maximum Supply Voltage: 1.378 V

The high maximum supply voltage of 1.378 V provides flexibility in power requirements for various applications.

Package Shape: SQUARE

Square package shape helps in efficient utilization of space on the circuit board.

No. of Terminals: 491

With 491 terminals, this product offers a wide range of connectivity options for different functionalities.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

This package style ensures high density and efficient layout on the circuit board.

Minimum Supply Voltage: 1.272 V

The low minimum supply voltage of 1.272 V helps in reducing power consumption and improving efficiency.

Maximum Operating Temperature: 105 °C

With a high maximum operating temperature of 105°C, this product can withstand demanding industrial environments.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C allows the product to operate in extreme cold conditions.

Terminal Finish: TIN SILVER COPPER

The terminal finish of Tin Silver Copper ensures good conductivity and corrosion resistance.

Terminal Position: BOTTOM

Bottom terminal position facilitates easy and secure soldering connections on the circuit board.

Maximum Seated Height: 1.3 mm

Low maximum seated height of 1.3 mm allows for a compact and slim profile of the product.

Width: 17 mm

The 17 mm width enables efficient layout and integration of the product in various designs.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time at peak reflow temperature of 30 seconds ensures safe and reliable soldering during manufacturing processes.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260°C allows for secure and effective soldering of the product onto the circuit board.

Length: 17 mm

The 17 mm length complements the width and squared shape for optimized space utilization.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable performance in harsh operating conditions typical of industrial settings.

Peripheral IC Type: SYSTEM ON CHIP

System on Chip technology integrates multiple functionalities into a single chip, leading to reduced footprint and optimized performance.

Technology: CMOS

CMOS technology offers low power consumption and high speed operation, making the product energy-efficient and responsive.

Terminal Form: BALL

Ball terminal form provides secure connections and ensures reliable performance in various applications.

Nominal Supply Voltage: 1.325 V

The nominal supply voltage of 1.325 V sets the standard operating voltage level for consistent and stable performance.

Terminal Pitch: 0.65 mm

The fine terminal pitch of 0.65 mm enables high-density packaging and efficient routing of signals on the circuit board.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates that the product can withstand moderate exposure to moisture during storage and handling.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs AM4377BZDNA100 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PBGA-B491

JESD-609 Code:

e1

Length:

17 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

491

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA491,25X25,25

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.3 mm

Maximum Supply Voltage:

1.378 V

Minimum Supply Voltage:

1.272 V

Nominal Supply Voltage:

1.325 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

17 mm

Peripheral IC Type:

Trade Compliance

AM4377BZDNA100 Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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