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AM4377BZDNA80

Texas Instruments

AM4377BZDNA80 by Texas Instruments

AM4377BZDNA80 by Texas Instruments is a System on Chip with CMOS technology. It operates b/w -40 to 105°C, has 491 terminals in a low profile grid array package. Ideal for industrial applications requiring a supply voltage range of 1.21-1.326V and peak reflow temperature of 260°C.

Median Price

$20.627

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 446 parts In-Stock

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$20.627

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$18.018

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$12.426

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446

$20.627

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$12.426

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Distributors (In-Stock)

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Digiode

USA . 4,511 parts In-Stock

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$19.596

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Vyrian

USA . 5,253 parts In-Stock

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AZTECH Wire

Italy . 268 parts In-Stock

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$10.050

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Corphita

USA . 4,366 parts In-Stock

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$18.564

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Parana Technologies

USA . 1,149 parts In-Stock

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$46.416

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DigiPath Technology Company

USA . 1,753 parts In-Stock

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$51.110

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ChromeModa Solutions

Germany . 2,052 parts In-Stock

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$52.153

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$42.765

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IDEA Electronic Components Group

UK . 86 parts In-Stock

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$52.153

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$49.545

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$46.938

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86

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$46.938

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Native Components

USA . 650 parts In-Stock

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$84.950

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$81.552

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Northwest PG Solutions

USA . 1,206 parts In-Stock

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Lixinc

USA . 16,081 parts In-Stock

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Authorized Procurement Solutions

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Overview

Elevate your projects with the AM4377BZDNA80 by Texas Instruments, a top-tier manufacturer known for delivering cutting-edge solutions. This versatile chip falls under the category of Other Function uPs,uCs & Peripheral ICs, making it ideal for a wide range of applications. Offering unparalleled quality and reliability, this product boasts a multitude of benefits that will revolutionize your work. From its innovative technology to its industrial-grade temperature tolerance, the AM4377BZDNA80 is a game-changer in the world of electronics. Upgrade your designs today and experience the difference firsthand.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the product, ensuring longevity and reliability.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto circuit boards, saving time and reducing production costs.

Maximum Supply Voltage: 1.326 V

Operating within this voltage range ensures stable performance and prevents damage to the product.

Package Shape: SQUARE

The square shape of the package allows for efficient use of space on the circuit board and simplifies placement during assembly.

No. of Terminals: 491

Having a large number of terminals enables a wide range of connections and functionality for the product.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

This package style offers compactness, low profile design, and fine pitch connections, making it suitable for space-constrained applications.

Minimum Supply Voltage: 1.21 V

Ensuring a minimum supply voltage helps maintain proper functionality even under low power conditions.

Maximum Operating Temperature: 105 °C

With a high maximum operating temperature, the product can withstand elevated environmental conditions without performance degradation.

Minimum Operating Temperature: -40 °C

The product is designed to operate in extreme cold temperatures, making it suitable for a wide range of industrial applications.

Terminal Finish: TIN SILVER COPPER

This finish provides excellent conductivity and corrosion resistance, ensuring reliable connections for the product.

Terminal Position: BOTTOM

Bottom terminal position facilitates easy mounting and soldering onto the circuit board, simplifying the assembly process.

Maximum Seated Height: 1.3 mm

With a low seated height, the product can be used in compact devices or applications with limited vertical space.

Width: 17 mm

The compact width of the product allows for efficient use of space on the circuit board, ideal for densely populated designs.

Maximum Time At Peak Reflow Temperature (s): 30

The product can withstand peak reflow temperatures for a sufficient duration during the manufacturing process, ensuring proper soldering and reliability.

Peak Reflow Temperature °C: 260

The high peak reflow temperature capability enables the product to undergo efficient soldering processes, ensuring strong and lasting connections.

Length: 17 mm

The compact length of the product allows for efficient use of space on the circuit board, ideal for space-constrained applications.

Temperature Grade: INDUSTRIAL

Designed for industrial environments, the product can withstand harsh conditions and provide reliable performance in rugged settings.

Peripheral IC Type: SYSTEM ON CHIP

The integrated system-on-chip design combines multiple functions into a single package, simplifying design complexity and reducing component count.

Technology: CMOS

Using CMOS technology enables low power consumption, high noise immunity, and compatibility with a wide range of digital systems.

Terminal Form: BALL

Ball terminals offer reliable connections and are suitable for automated assembly processes, ensuring efficient production.

Nominal Supply Voltage: 1.26 V

Operating at a nominal supply voltage ensures consistent and stable performance, meeting the requirements of the product's specifications.

Terminal Pitch: 0.65 mm

Having a fine terminal pitch allows for high-density connections on the circuit board, enabling compact and space-efficient designs.

Moisture Sensitivity Level (MSL): 3

With a moderate moisture sensitivity level, the product can be handled and stored in typical factory conditions without facing moisture-related issues.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs AM4377BZDNA80 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PBGA-B491

JESD-609 Code:

e1

Length:

17 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

491

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA491,25X25,25

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.3 mm

Maximum Supply Voltage:

1.326 V

Minimum Supply Voltage:

1.21 V

Nominal Supply Voltage:

1.26 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

17 mm

Peripheral IC Type:

Trade Compliance

AM4377BZDNA80 Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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