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XCZU7EG-3FFVF1517E

Xilinx

XCZU7EG-3FFVF1517E by Xilinx

XCZU7EG-3FFVF1517E by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It has 1517 terminals in a GRID ARRAY package style, suitable for applications requiring high performance at temperatures ranging from 0 to 100 °C. Operating voltage ranges from 0.873V to 0.927V, making it ideal for various electronic systems.

Median Price

$6,183.740

Lifecycle Status

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1k+

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Nova Conductors

Japan . 900 parts In-Stock

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Vyrian

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AZTECH Wire

Italy . 812 parts In-Stock

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$10.569

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Ampacity Inc.

Singapore . 351 parts In-Stock

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One Stop Electronics

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Semicontronic

India . 1,333 parts In-Stock

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$32.175

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$32.010

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Modulus Dynamics

Lithuania . 705 parts In-Stock

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$62.031

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MARBEL Systems

Belgium . 1,527 parts In-Stock

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$62.488

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$59.988

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Texas Native Microelectronics

USA . 10 parts In-Stock

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Corohmni

South Africa . 5,062 parts In-Stock

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Kenton Components

USA . 100 parts In-Stock

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Microchip USA

USA . 1,366 parts In-Stock

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Continental Prestige Electronics

USA . 6,931 parts In-Stock

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Argo Parts USA

USA . 2,284 parts In-Stock

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$6,010.250

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$5,949.541

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$5,888.831

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Supply Digital

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Authorized Procurement Solutions

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Vigor

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Bastille Electronics

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Qasali Group International

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$186.170

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$170.656

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Overview

Unlock the endless possibilities of advanced computing with the XCZU7EG-3FFVF1517E by Xilinx. As a leading manufacturer in the industry, Xilinx delivers top-quality products that redefine innovation. This cutting-edge microprocessor circuit offers unparalleled performance and reliability, making it ideal for various applications. Experience seamless operation and enhanced functionality with this versatile solution. Elevate your projects to new heights with the XCZU7EG-3FFVF1517E from Xilinx.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product easy to handle and long-lasting.

Surface Mount: YES

Surface mount technology allows for a smaller overall footprint on circuit boards, saving space and enhancing efficiency.

Maximum Supply Voltage: 0.927 V

The high maximum supply voltage ensures reliable operation and performance.

Package Shape: RECTANGULAR

The rectangular shape makes it easy to integrate into various electronic devices and systems.

No. of Terminals: 1517

The high number of terminals provides flexibility in connectivity and functionality.

Package Style (Meter): GRID ARRAY

The grid array package style allows for efficient heat dissipation and electrical connectivity.

Minimum Supply Voltage: 0.873 V

The low minimum supply voltage helps in reducing power consumption and extending battery life.

Maximum Operating Temperature: 100 °C

The high maximum operating temperature ensures the product can operate in a wide range of environments.

Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)

This terminal finish provides good conductivity and corrosion resistance for long-lasting performance.

Terminal Position: BOTTOM

Bottom terminal position facilitates easy soldering and maintenance of the product.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

The inclusion of a microprocessor circuit enhances the product's processing capabilities and functionality.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity for efficient operation.

Terminal Form: BALL

Ball terminal form provides reliable electrical connections and simplifies the assembly process.

Nominal Supply Voltage: 0.9 V

The nominal supply voltage ensures stable and consistent performance of the product.

Moisture Sensitivity Level (MSL): 4

MSL 4 indicates that the product can withstand extended exposure to moderate humidity levels, increasing its reliability in various environments.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs XCZU7EG-3FFVF1517E attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Xilinx

Specs

JESD-30 Code:

R-PBGA-B1517

JESD-609 Code:

e1

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

245

Maximum Supply Voltage:

.927 V

Minimum Supply Voltage:

.873 V

Nominal Supply Voltage:

.9 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Peripheral IC Type:

Trade Compliance

XCZU7EG-3FFVF1517E Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A002.A.4

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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