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66AK2L06XCMSA2

Texas Instruments

66AK2L06XCMSA2 by Texas Instruments

The Texas Instruments 66AK2L06XCMSA2 is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 100 °C, with supply voltage range of 0.95V to 1.1V. Ideal for industrial applications requiring high performance and reliability in a compact GRID ARRAY package.

Median Price

$630.853

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$630.853

100+ parts

-

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50

$630.853

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Digiode

USA . 3,539 parts In-Stock

1+ parts

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3,539

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Vyrian

USA . 3,065 parts In-Stock

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3,065

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VNN

France . 1,011 parts In-Stock

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 630 parts In-Stock

1+ parts

$2.000

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630

$2.000

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Semicontronic

India . 1,277 parts In-Stock

1+ parts

$7.000

100+ parts

$6.825

1k+ parts

$6.790

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1,277

$7.000

$6.825

$6.790

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One Stop Electronics

USA . 1,322 parts In-Stock

1+ parts

$13.000

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1,322

$13.000

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AZTECH Wire

Italy . 424 parts In-Stock

1+ parts

$18.686

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424

$18.686

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Corohmni

South Africa . 582 parts In-Stock

1+ parts

$36.720

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582

$36.720

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Parana Technologies

USA . 1,078 parts In-Stock

1+ parts

$46.867

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1,078

$46.867

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DigiPath Technology Company

USA . 1,783 parts In-Stock

1+ parts

$51.606

100+ parts

$47.477

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1,783

$51.606

$47.477

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IDEA Electronic Components Group

UK . 1,373 parts In-Stock

1+ parts

$52.659

100+ parts

$50.026

1k+ parts

$47.393

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1,373

$52.659

$50.026

$47.393

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ChromeModa Solutions

Germany . 665 parts In-Stock

1+ parts

$52.659

100+ parts

$43.180

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665

$52.659

$43.180

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Microchip USA

USA . 1,996 parts In-Stock

1+ parts

$466.960

100+ parts

$449.980

1k+ parts

$441.490

10k+ parts

$433.000

1,996

$466.960

$449.980

$441.490

$433.000

Aranea Global

USA . 2,000 parts In-Stock

1+ parts

$618.236

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$593.506

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2,000

$618.236

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$593.506

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Argo Parts USA

USA . 3,260 parts In-Stock

1+ parts

$630.853

100+ parts

$624.544

1k+ parts

$618.236

10k+ parts

$611.927

3,260

$630.853

$624.544

$618.236

$611.927

Continental Prestige Electronics

USA . 700 parts In-Stock

1+ parts

$630.853

100+ parts

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$618.236

700

$630.853

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$618.236

Authorized Procurement Solutions

USA . 8,000 parts In-Stock

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8,000

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Robosynatics

Brazil . 5,000 parts In-Stock

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5,000

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Lucentia Tech

USA . 5,000 parts In-Stock

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$0.497

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$0.497

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$0.497

5,000

-

$0.497

$0.497

$0.497

Corphita

USA . 2,848 parts In-Stock

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2,848

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Perfect Parts

USA . 99 parts In-Stock

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99

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Overview

Experience the cutting-edge technology of the 66AK2L06XCMSA2 by Texas Instruments, a premium quality product in the category of Other Function uPs, uCs & Peripheral ICs. With its advanced features and top-tier manufacturer, this versatile microprocessor circuit offers unmatched performance for industrial applications. Trust in Texas Instruments' reputation for excellence and innovation, and discover the value and benefits that the 66AK2L06XCMSA2 can bring to your projects. Reach new heights with this exceptional product today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and reliable, providing a solid foundation for the product.

Surface Mount: YES

Surface mount technology allows for efficient and compact assembly, saving space and reducing manufacturing costs.

Maximum Supply Voltage: 1.1 V

The high maximum supply voltage ensures stable and reliable operation under varying conditions.

Package Shape: SQUARE

The square shape facilitates easier integration into circuit designs and layouts.

No. of Terminals: 900

Having a high number of terminals allows for versatile connectivity and functionality.

Package Style: GRID ARRAY, FINE PITCH

The grid array with fine pitch offers high density packaging, enabling more functionality in a smaller footprint.

Minimum Supply Voltage: 0.95 V

The low minimum supply voltage enables power-efficient operation and extends battery life.

Maximum Operating Temperature: 100 °C

The high maximum operating temperature ensures reliable performance in challenging environments.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows for operation in a wide range of temperature conditions.

Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)

The terminal finish provides corrosion resistance and ensures reliable electrical connections.

Terminal Position: BOTTOM

The bottom terminal position allows for easy and secure mounting onto a PCB.

Maximum Seated Height: 3.55 mm

The low seated height facilitates compact design and assembly in space-constrained applications.

Width: 25 mm

The compact width allows for efficient use of board space and layout flexibility.

Maximum Time At Peak Reflow Temperature (s): 30

The short time at peak reflow temperature minimizes the risk of thermal damage during assembly.

Peak Reflow Temperature °C: 245

The high peak reflow temperature ensures proper soldering and reliability in manufacturing processes.

Length: 25 mm

The compact length contributes to a space-saving design and efficient use of PCB real estate.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable operation in harsh industrial environments.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

The integration of a microprocessor circuit enhances the functionality and processing capabilities of the product.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with a wide range of applications.

Terminal Form: BALL

The ball terminal form provides secure and reliable contacts for efficient connectivity.

Nominal Supply Voltage: 1.05 V

The nominal supply voltage ensures stable and efficient power delivery for optimal performance.

Terminal Pitch: 0.8 mm

The fine terminal pitch enables high-density packaging and connectivity, enhancing functionality in a compact form factor.

Moisture Sensitivity Level (MSL): 4

The MSL 4 rating indicates the product's resistance to moisture absorption, ensuring long-term reliability in humid conditions.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs 66AK2L06XCMSA2 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PBGA-B900

JESD-609 Code:

e1

Length:

25 mm

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

900

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

245

Maximum Seated Height:

3.55 mm

Maximum Supply Voltage:

1.1 V

Minimum Supply Voltage:

.95 V

Nominal Supply Voltage:

1.05 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

25 mm

Peripheral IC Type:

Trade Compliance

66AK2L06XCMSA2 Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A002.A

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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