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66AK2G12ABYA60E

Texas Instruments

66AK2G12ABYA60E by Texas Instruments

The Texas Instruments 66AK2G12ABYA60E is a System on Chip with CMOS technology. It operates b/w -40 to 105 °C and has a supply voltage range of 0.855V to 0.945V. With 625 terminals in a low profile grid array package, it's ideal for industrial applications requiring high performance and compact design.

Median Price

$69.562

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 121 parts In-Stock

1+ parts

$57.484

100+ parts

$51.097

1k+ parts

$37.571

10k+ parts

-

121

$57.484

$51.097

$37.571

-

Mouser Electronics

USA . 4 parts In-Stock

1+ parts

$81.640

100+ parts

$61.760

1k+ parts

$60.880

10k+ parts

-

4

$81.640

$61.760

$60.880

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,712 parts In-Stock

1+ parts

$54.610

100+ parts

-

1k+ parts

-

10k+ parts

-

2,712

$54.610

-

-

-

Vyrian

USA . 3,517 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,517

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 660 parts In-Stock

1+ parts

$19.166

100+ parts

-

1k+ parts

-

10k+ parts

-

660

$19.166

-

-

-

Northwest PG Solutions

USA . 1,080 parts In-Stock

1+ parts

$21.083

100+ parts

$18.974

1k+ parts

-

10k+ parts

-

1,080

$21.083

$18.974

-

-

Ampacity Inc.

Singapore . 63 parts In-Stock

1+ parts

$48.860

100+ parts

-

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-

10k+ parts

-

63

$48.860

-

-

-

Corphita

USA . 4,152 parts In-Stock

1+ parts

$51.736

100+ parts

-

1k+ parts

-

10k+ parts

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4,152

$51.736

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-

-

Parana Technologies

USA . 2,290 parts In-Stock

1+ parts

$58.331

100+ parts

-

1k+ parts

-

10k+ parts

-

2,290

$58.331

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-

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Corohmni

South Africa . 10 parts In-Stock

1+ parts

$62.119

100+ parts

-

1k+ parts

-

10k+ parts

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10

$62.119

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-

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DigiPath Technology Company

USA . 2,329 parts In-Stock

1+ parts

$64.230

100+ parts

$59.092

1k+ parts

-

10k+ parts

-

2,329

$64.230

$59.092

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IDEA Electronic Components Group

UK . 1,121 parts In-Stock

1+ parts

$65.541

100+ parts

$62.264

1k+ parts

$58.987

10k+ parts

-

1,121

$65.541

$62.264

$58.987

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ChromeModa Solutions

Germany . 135 parts In-Stock

1+ parts

$65.541

100+ parts

$53.744

1k+ parts

-

10k+ parts

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135

$65.541

$53.744

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-

Microchip USA

USA . 4,484 parts In-Stock

1+ parts

$123.730

100+ parts

$121.570

1k+ parts

$120.500

10k+ parts

$119.420

4,484

$123.730

$121.570

$120.500

$119.420

Overview

Unleash the power of innovation with the Texas Instruments 66AK2G12ABYA60E. As a leader in the industry, Texas Instruments delivers exceptional quality and reliability in their products. This versatile system on chip offers endless possibilities for applications in various industries, providing customers with unmatched value and performance. Experience the benefits of cutting-edge technology and enhance your projects with the 66AK2G12ABYA60E by Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material makes the package lightweight and durable, making it ideal for portable devices.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving time and costs in manufacturing.

Maximum Supply Voltage: 0.945 V

The maximum supply voltage of 0.945V ensures safe operation and protects the device from overvoltage.

Package Shape: SQUARE

Square package shape allows for easier placement and alignment on the PCB, optimizing space usage and design aesthetics.

No. of Terminals: 625

With 625 terminals, this product offers a high level of connectivity, suitable for complex electronic systems.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

Grid array, low profile, and fine pitch package style provides high density integration, enabling compact and space-efficient designs.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40°C, this product can withstand harsh environmental conditions, making it versatile for various applications.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature of 105°C ensures reliability and stability of the product even under extreme heat conditions.

Width: 21 mm

The 21mm width offers a compact form factor, suitable for space-constrained applications and designs.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures that the product can operate consistently and reliably in industrial environments with temperature fluctuations.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs 66AK2G12ABYA60E attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PBGA-B625

JESD-609 Code:

e1

Length:

21 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

625

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA625,25X25,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.56 mm

Maximum Supply Voltage:

.945 V

Minimum Supply Voltage:

.855 V

Nominal Supply Voltage:

.9 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

21 mm

Peripheral IC Type:

Trade Compliance

66AK2G12ABYA60E Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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