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MPFS250T-FCSG536I

Microchip Technology

MPFS250T-FCSG536I by Microchip Technology

MPFS250T-FCSG536I by Microchip: 536 terminals, 1.03V max supply voltage, -40 to 100°C operating temp range. Ideal for applications requiring a low profile, fine pitch grid array package style with programmable SoC technology.

Median Price

$353.690

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 4 parts In-Stock

1+ parts

$346.490

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4

$346.490

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Microchip Technology

USA . 5,265 parts In-Stock

1+ parts

$353.690

100+ parts

$321.530

1k+ parts

$223.380

10k+ parts

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5,265

$353.690

$321.530

$223.380

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DigiKey

USA . 41 parts In-Stock

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$353.690

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41

$353.690

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Distributors (In-Stock)

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Nova Conductors

Japan . 700 parts In-Stock

1+ parts

$490.525

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700

$490.525

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Vyrian

USA . 4,270 parts In-Stock

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4,270

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Distributors (Availability)

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AZTECH Wire

Italy . 351 parts In-Stock

1+ parts

$19.493

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351

$19.493

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Aztec Data Supply Inc.

USA . 2,720 parts In-Stock

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$26.740

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2,720

$26.740

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Corohmni

South Africa . 982 parts In-Stock

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$66.079

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982

$66.079

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Ampacity Inc.

Singapore . 66 parts In-Stock

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$389.360

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66

$389.360

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Continental Prestige Electronics

USA . 5,155 parts In-Stock

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$490.525

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$480.715

5,155

$490.525

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$480.715

Netroflash

USA . 1,000 parts In-Stock

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$490.525

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$480.715

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1,000

$490.525

$480.715

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Argo Parts USA

USA . 140 parts In-Stock

1+ parts

$490.525

100+ parts

$485.620

1k+ parts

$480.715

10k+ parts

$475.809

140

$490.525

$485.620

$480.715

$475.809

Microchip USA

USA . 1,797 parts In-Stock

1+ parts

$745.995

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LOOK Integrated Logistics

Peru . 6,760 parts In-Stock

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NIA Electronics

USA . 5,348 parts In-Stock

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Ledger Components

France . 5,348 parts In-Stock

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Montano Global Distributors

Canada . 2,370 parts In-Stock

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2,370

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LMD Electronica

Estonia . 1,756 parts In-Stock

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1,756

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Overview

Elevate your projects with the MPFS250T-FCSG536I by Microchip Technology, a top-tier manufacturer known for delivering cutting-edge solutions. This versatile peripheral IC offers unmatched reliability and performance in various applications. With a compact package body material and low profile design, this programmable SoC boasts a wide operating temperature range and optimal supply voltage, ensuring seamless integration and high efficiency. Experience the value and benefits of superior technology with Microchip's MPFS250T-FCSG536I. Elevate your projects with the MPFS250T-FCSG536I by Microchip Technology, a top-tier manufacturer known for delivering cutting-edge solutions. This versatile peripheral IC offers unmatched reliability and performance in various applications. With a compact package body material and low profile design, this programmable SoC boasts a wide operating temperature range and optimal supply voltage, ensuring seamless integration and high efficiency. Experience the value and benefits of superior technology with Microchip's MPFS250T-FCSG536I.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and resistance against environmental factors, making the product reliable for long-term use.

Surface Mount: YES

Surface mount capability enables easy and efficient assembly onto circuit boards, saving time and labor costs during production.

Maximum Supply Voltage: 1.03 V

Higher maximum supply voltage allows for flexibility in power input, accommodating a wider range of voltage requirements for different applications.

Package Shape: SQUARE

Square package shape helps save space on the circuit board, allowing for more efficient layout and potentially reducing overall system size.

No. of Terminals: 536

Large number of terminals provide ample connections for various functions and peripherals, making the product versatile and suitable for complex designs.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

Grid array, low profile, and fine pitch package style offers high density and connectivity, enhancing performance and functionality in a compact form factor.

Minimum Supply Voltage: 0.97 V

Low minimum supply voltage ensures efficient power consumption and compatibility with low power devices, enhancing energy efficiency and prolonging battery life.

Maximum Operating Temperature: 100 °C

High maximum operating temperature range allows for reliable performance in harsh environments and under demanding conditions, ensuring stability and durability.

Minimum Operating Temperature: -40 °C

Wide minimum operating temperature range enables the product to function in extreme cold temperatures, making it suitable for a variety of applications in different climates.

Terminal Position: BOTTOM

Bottom terminal position facilitates easy and secure connection to the circuit board, ensuring stable and reliable electrical contact for optimal performance.

Maximum Seated Height: 1.4 mm

Low maximum seated height allows for a slim profile and compact design, making the product suitable for space-constrained applications or designs with height limitations.

Width: 16 mm

Compact width dimension enables efficient placement on the circuit board, optimizing space utilization and allowing for denser integration of components in the system.

Length: 16 mm

Square package shape with matching length dimension ensures symmetrical layout and balanced distribution of components on the circuit board, enhancing overall aesthetics and design functionality.

Peripheral IC Type: PROGRAMMABLE SoC

Programmable System-on-Chip design offers customizable functionality and versatility, allowing for adaptable and tailored solutions to meet specific requirements or enable future upgrades.

Technology: CMOS

CMOS technology provides low power consumption, high noise immunity, and fast switching speeds, making the product energy efficient, reliable, and suitable for high-speed operations.

Terminal Form: BALL

Ball terminal form ensures secure and reliable connections, enabling easy soldering and preventing damage or disconnection during operation or handling.

Nominal Supply Voltage: 1 V

Stable nominal supply voltage provides consistent and regulated power input, ensuring reliable performance and preventing voltage fluctuations that may affect the product's operation.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for high-density packaging and close proximity of terminals, enhancing connectivity and signal integrity for optimized performance and functionality.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MPFS250T-FCSG536I attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Microchip Technology

Specs

Additional Features:

ALSO OPERATES AT 1.05V NOMINAL SUPPLY

JESD-30 Code:

S-PBGA-B536

Length:

16 mm

No. of Terminals:

536

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA536,30X30,20

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Maximum Seated Height:

1.4 mm

Maximum Supply Voltage:

1.03 V

Minimum Supply Voltage:

.97 V

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Width:

16 mm

Peripheral IC Type:

Trade Compliance

MPFS250T-FCSG536I Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

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Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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