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AM6422BSDGHAALV

Texas Instruments

AM6422BSDGHAALV by Texas Instruments

AM6422BSDGHAALV by Texas Instruments is a SYSTEM ON CHIP with a max supply voltage of 0.79 V and a min operating temperature of -40 °C. It is used in applications requiring high speed and low power consumption.

Median Price

$26.410

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 19,791 parts In-Stock

1+ parts

$18.459

100+ parts

$16.124

1k+ parts

$11.120

10k+ parts

-

19,791

$18.459

$16.124

$11.120

-

DigiKey

USA . 286 parts In-Stock

1+ parts

$26.410

100+ parts

$18.715

1k+ parts

$17.483

10k+ parts

-

286

$26.410

$18.715

$17.483

-

Mouser Electronics

USA . 239 parts In-Stock

1+ parts

$29.860

100+ parts

$20.680

1k+ parts

-

10k+ parts

-

239

$29.860

$20.680

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,536 parts In-Stock

1+ parts

$17.536

100+ parts

-

1k+ parts

-

10k+ parts

-

1,536

$17.536

-

-

-

Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$18.415

100+ parts

-

1k+ parts

-

10k+ parts

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100

$18.415

-

-

-

Vyrian

USA . 8,716 parts In-Stock

1+ parts

-

100+ parts

-

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8,716

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-

-

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VNN

France . 3,127 parts In-Stock

1+ parts

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3,127

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-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 751 parts In-Stock

1+ parts

$6.311

100+ parts

-

1k+ parts

-

10k+ parts

-

751

$6.311

-

-

-

Semicontronic

India . 6,232 parts In-Stock

1+ parts

$15.690

100+ parts

$15.298

1k+ parts

$15.219

10k+ parts

-

6,232

$15.690

$15.298

$15.219

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Corphita

USA . 3,855 parts In-Stock

1+ parts

$16.613

100+ parts

-

1k+ parts

-

10k+ parts

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3,855

$16.613

-

-

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Bastille Electronics

Australia . 450 parts In-Stock

1+ parts

$18.410

100+ parts

$17.490

1k+ parts

-

10k+ parts

$16.385

450

$18.410

$17.490

-

$16.385

Continental Prestige Electronics

USA . 4,462 parts In-Stock

1+ parts

$18.415

100+ parts

-

1k+ parts

-

10k+ parts

$18.046

4,462

$18.415

-

-

$18.046

Ampacity Inc.

Singapore . 6,582 parts In-Stock

1+ parts

$34.150

100+ parts

-

1k+ parts

-

10k+ parts

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6,582

$34.150

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-

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Argo Parts USA

USA . 4,742 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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4,742

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Robosynatics

Brazil . 350 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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350

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Lucentia Tech

USA . 350 parts In-Stock

1+ parts

-

100+ parts

$4.885

1k+ parts

$4.885

10k+ parts

$4.885

350

-

$4.885

$4.885

$4.885

Overview

Discover the AM6422BSDGHAALV by Texas Instruments, a cutting-edge product that delivers unbeatable quality and performance. As a leading manufacturer in the industry, Texas Instruments is known for its exceptional expertise and innovation. The AM6422BSDGHAALV falls under the category of Other Function uPs,uCs & Peripheral ICs, offering a world of possibilities in various applications. Now, imagine the incredible value this product brings to the table - with its advanced features, seamless integration, and unmatched reliability, customers can expect nothing but the best. Embrace the future with the AM6422BSDGHAALV and experience the countless benefits and advantages it has to offer.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and resistance to heat, making the product suitable for a wide range of operating conditions.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on circuit boards, saving time and effort during assembly.

Maximum Supply Voltage: 0.79 V

Having a maximum supply voltage of 0.79V ensures safe operation and protection of the IC from overvoltage conditions.

Package Shape: SQUARE

Square package shape allows for efficient use of space on the circuit board, enabling compact and streamlined designs.

No. of Terminals: 441

Having 441 terminals provides a high level of connectivity and functionality, allowing for versatile applications and integration with other components.

Package Style (Meter): GRID ARRAY, FINE PITCH

Grid array fine pitch package style offers precise alignment and compact layout, enabling high-density mounting and improved signal integrity.

Minimum Supply Voltage: 0.715 V

With a minimum supply voltage of 0.715V, the IC can operate efficiently even at lower power levels, enhancing energy efficiency and performance.

Maximum Operating Temperature: 105 °C

Operating at a maximum temperature of 105 °C ensures stable performance even under high temperature environments, making it suitable for industrial applications.

Minimum Operating Temperature: -40 °C

Operating at a minimum temperature of -40 °C allows for reliable performance in cold conditions, expanding the range of possible applications for the product.

Terminal Position: BOTTOM

Bottom terminal position facilitates easy and secure connection to the circuit board, ensuring stability and reducing the risk of signal interference.

Maximum Seated Height: 2.652 mm

Having a maximum seated height of 2.652mm allows for low-profile installation, saving space and enabling slim designs.

Width: 17.2 mm

A width of 17.2mm provides a compact form factor, making the IC suitable for applications where space is limited.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time allowed at peak reflow temperature of 250 °C for 30 seconds ensures proper soldering and component reliability during assembly.

Peak Reflow Temperature °C: 250

Peak reflow temperature of 250 °C enables efficient soldering and component mounting, ensuring strong and reliable connections.

Length: 17.2 mm

A length of 17.2mm complements the compact width, providing a balanced form factor suitable for various application requirements.

Peripheral IC Type: SYSTEM ON CHIP

Being a System on Chip (SoC) peripheral IC type consolidates multiple functions into a single integrated circuit, reducing complexity and improving overall system efficiency.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the IC energy-efficient and reliable in noisy environments.

Terminal Form: BALL

Ball terminal form provides secure and reliable connections, ensuring stable performance and minimizing the risk of signal loss or interference.

Nominal Supply Voltage: 0.75 V

Having a nominal supply voltage of 0.75V allows for consistent and reliable operation, ensuring stable performance across different operating conditions.

Terminal Pitch: 0.8 mm

With a terminal pitch of 0.8mm, the IC offers precise and compact connectivity, enabling high-density mounting and efficient signal transmission.

Moisture Sensitivity Level (MSL): 3

Moisture sensitivity level of 3 indicates moderate sensitivity to moisture, requiring proper handling and storage to prevent damage or performance degradation.

Speed: 1000 rpm

Operating at a speed of 1000rpm, the IC provides fast and reliable processing capabilities, ensuring responsive performance in demanding applications.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs AM6422BSDGHAALV attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

Additional Features:

ALSO OPERATES AT 0.85V NOMINAL SUPPLY

JESD-30 Code:

S-PBGA-B441

Length:

17.2 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

441

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA441,21X21,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

250

Maximum Seated Height:

2.652 mm

Speed:

1000 rpm

Maximum Supply Voltage:

.79 V

Minimum Supply Voltage:

.715 V

Nominal Supply Voltage:

.75 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

17.2 mm

Peripheral IC Type:

Trade Compliance

AM6422BSDGHAALV Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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