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AM6441BSFGHAALV

Texas Instruments

AM6441BSFGHAALV by Texas Instruments

AM6441BSFGHAALV by Texas Instruments is a SYSTEM ON CHIP with 441 terminals in a GRID ARRAY, FINE PITCH package. It operates b/w -40 to 105 °C with supply voltage range of 0.715V to 0.79V. Ideal for applications requiring high integration and low power consumption.

Median Price

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Lifecycle Status

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4

In-Stock Inventory

1k+

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Vyrian

USA . 8,561 parts In-Stock

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Digiode

USA . 2,528 parts In-Stock

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Nova Conductors

Japan . 40 parts In-Stock

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VNN

France . 30 parts In-Stock

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AZTECH Wire

Italy . 480 parts In-Stock

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$6.090

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480

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Ampacity Inc.

Singapore . 1,592 parts In-Stock

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$9.000

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One Stop Electronics

USA . 793 parts In-Stock

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Semicontronic

India . 700 parts In-Stock

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$25.000

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$24.375

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$24.250

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Corohmni

South Africa . 245 parts In-Stock

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$44.848

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Corphita

USA . 4,175 parts In-Stock

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Argo Parts USA

USA . 1,785 parts In-Stock

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Bastille Electronics

Australia . 450 parts In-Stock

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Continental Prestige Electronics

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Overview

Experience unparalleled performance and reliability with the AM6441BSFGHAALV by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers exceptional quality and innovation in every product. This versatile IC falls under the category of Other Function uPs, uCs & Peripheral ICs, making it suitable for a wide range of applications. With a maximum supply voltage of 0.79 V and a package style of GRID ARRAY, FINE PITCH, this product offers superior value and benefits to customers looking for cutting-edge technology. Upgrade your electronic devices with the AM6441BSFGHAALV and elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material provides durability and protects the internal components, making this product a reliable choice.

Surface Mount: YES

Being surface mountable allows for easy and efficient installation, making this product suitable for automated assembly processes.

Maximum Supply Voltage: 0.79 V

With a maximum supply voltage of 0.79 V, this product offers safe operation within the specified voltage range.

Package Shape: SQUARE

The square package shape allows for efficient use of space on a circuit board, making this product ideal for compact designs.

No. of Terminals: 441

With a high number of terminals, this product offers versatile connectivity options for various applications.

Package Style (Meter): GRID ARRAY, FINE PITCH

The grid array, fine pitch package style offers high density mounting, suitable for applications where space is a constraint.

Minimum Supply Voltage: 0.715 V

The low minimum supply voltage requirement makes this product energy efficient and suitable for low power applications.

Maximum Operating Temperature: 105 °C

With a maximum operating temperature of 105°C, this product can withstand high temperature environments, ensuring reliability under challenging conditions.

Minimum Operating Temperature: -40 °C

The ability to operate at temperatures as low as -40°C makes this product suitable for use in various environmental conditions.

Terminal Position: BOTTOM

Bottom terminal position facilitates easy connection and installation, making this product convenient for assembly.

Maximum Seated Height: 2.652 mm

The low maximum seated height allows for a slim profile, making this product suitable for space-constrained designs.

Width: 17.2 mm

The width of 17.2 mm provides a compact footprint, making this product ideal for applications where space is limited.

Length: 17.2 mm

The length of 17.2 mm offers a square form factor, enabling efficient placement on a PCB.

Peripheral IC Type: SYSTEM ON CHIP

The system on chip peripheral IC type integrates multiple functions into a single chip, offering cost savings and enhanced performance.

Technology: CMOS

The CMOS technology used in this product ensures low power consumption and high-speed operation, making it an efficient choice for various applications.

Terminal Form: BALL

The ball terminal form provides reliable connections and ensures secure mounting, making this product suitable for rugged environments.

Nominal Supply Voltage: 0.75 V

The nominal supply voltage of 0.75 V ensures compatibility with standard power sources, making this product easy to integrate into existing systems.

Terminal Pitch: 0.8 mm

The small terminal pitch of 0.8 mm offers high-density connectivity, making this product suitable for applications requiring compact designs.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs AM6441BSFGHAALV attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

Additional Features:

ALSO OPERATES AT 0.85V NOMINAL SUPPLY

JESD-30 Code:

S-PBGA-B441

Length:

17.2 mm

No. of Terminals:

441

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA441,21X21,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Maximum Seated Height:

2.652 mm

Maximum Supply Voltage:

.79 V

Minimum Supply Voltage:

.715 V

Nominal Supply Voltage:

.75 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

17.2 mm

Peripheral IC Type:

Trade Compliance

AM6441BSFGHAALV Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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