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TMS320DM365ZCED30

Texas Instruments

TMS320DM365ZCED30 by Texas Instruments

TMS320DM365ZCED30 by Texas Instruments is a 32-bit microprocessor with 338 terminals, operating at -40 to 85°C. It features a 32-bit external data bus width and supports I2C, SPI, UART, and USB buses. Ideal for industrial applications requiring a low-profile package style with a grid array layout.

Median Price

$34.100

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 165 parts In-Stock

1+ parts

$23.306

100+ parts

$20.717

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$15.233

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165

$23.306

$20.717

$15.233

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Chip1Stop

Japan . 160 parts In-Stock

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$34.100

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$34.100

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Mouser Electronics

USA . 257 parts In-Stock

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$42.040

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$32.430

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$30.140

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257

$42.040

$32.430

$30.140

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Distributors (In-Stock)

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Digiode

USA . 114 parts In-Stock

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$22.141

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114

$22.141

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Nova Conductors

Japan . 37 parts In-Stock

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$26.500

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Mobius Materials

USA . 20 parts In-Stock

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$31.250

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$25.000

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20

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Vyrian

USA . 5,253 parts In-Stock

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Chip Stock

USA . 4,655 parts In-Stock

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Cyclops Electronics Ltd

UK . 62 parts In-Stock

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Bristol Electronics

USA . 33 parts In-Stock

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Atlantic Semiconductor

USA . 33 parts In-Stock

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Semtec, LLC

USA . 10 parts In-Stock

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Prism Electronics

USA . 9 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 814 parts In-Stock

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$18.219

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$18.219

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Semicontronic

India . 251 parts In-Stock

1+ parts

$19.810

100+ parts

$19.315

1k+ parts

$19.216

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251

$19.810

$19.315

$19.216

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Ampacity Inc.

Singapore . 132 parts In-Stock

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$19.810

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$19.810

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Corphita

USA . 2,216 parts In-Stock

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$20.975

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$20.975

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Aranea Global

USA . 500 parts In-Stock

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$25.970

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$24.931

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500

$25.970

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$24.931

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Continental Prestige Electronics

USA . 4,236 parts In-Stock

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$26.500

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$25.970

4,236

$26.500

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$25.970

Corohmni

South Africa . 955 parts In-Stock

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$26.500

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$26.500

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Parana Technologies

USA . 2,157 parts In-Stock

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$66.695

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ChromeModa Solutions

Germany . 3,349 parts In-Stock

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$74.938

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$61.449

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3,349

$74.938

$61.449

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IDEA Electronic Components Group

UK . 1,720 parts In-Stock

1+ parts

$74.938

100+ parts

$71.191

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$67.444

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$74.938

$71.191

$67.444

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Lixinc

USA . 19,500 parts In-Stock

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iodParts Technologies Inc.

India . 16,000 parts In-Stock

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Argo Parts USA

USA . 3,547 parts In-Stock

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DigiPath Technology Company

USA . 2,352 parts In-Stock

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$67.564

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A-Z Elektronik GmbH

Germany . 192 parts In-Stock

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Formix International (Excess)

India . 75 parts In-Stock

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Overview

Unlock the power of cutting-edge technology with the TMS320DM365ZCED30 by Texas Instruments. As a trusted leader in the industry, Texas Instruments delivers unmatched quality and reliability in every product. The TMS320DM365ZCED30 falls under the category of Other Function uPs,uCs & Peripheral ICs, offering a wide range of applications for various industries. Experience the value and benefits of this innovative product, designed to enhance performance and efficiency. Trust Texas Instruments to provide you with the tools you need to succeed in today's fast-paced world. Elevate your projects with the TMS320DM365ZCED30 and experience the difference that quality makes.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - This material provides durability and reliability for the product.

Surface Mount:

YES - Allows for easy integration into circuit boards, saving time and effort during assembly.

Maximum Supply Voltage:

1.42 V - Provides a wide operating voltage range for flexibility in different applications.

Package Shape:

SQUARE - Helps in efficient placement and utilization of space on a circuit board.

Bit Size:

32 - Offers high processing capability and performance for complex tasks.

Power Supplies (V):

1.35,1.8,3.3 - Supports a variety of power supply options for versatile use.

No. of Terminals:

338 - Enables connection to multiple components and peripherals for enhanced functionality.

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH - Allows for a compact design and efficient heat dissipation.

Minimum Supply Voltage:

1.28 V - Ensures stable operation even at low power supply levels.

Maximum Operating Temperature:

85 °C - Suitable for industrial environments with higher temperature requirements.

Minimum Operating Temperature:

40 °C - Can withstand extreme cold conditions for reliable performance.

Terminal Finish:

TIN SILVER COPPER - Offers a strong and corrosion-resistant finish for long-term use.

Terminal Position:

BOTTOM - Facilitates easy connection to other components on the circuit board.

Maximum Seated Height:

1.3 mm - Low profile design for compact and space-saving applications.

RAM Words:

8192 - Provides ample memory for storing and processing data efficiently.

Width:

13 mm - Compact size for fitting into tight spaces within electronic devices.

External Data Bus Width:

32 - Allows for high-speed data transfer and processing capabilities.

Maximum Time At Peak Reflow Temperature (s):

30 - Ensures proper soldering during assembly for reliable connections.

Peak Reflow Temperature °C:

260 - Withstands high temperatures during manufacturing processes.

Length:

13 mm - Compact form factor for versatile placement in various electronic devices.

Temperature Grade:

INDUSTRIAL - Designed to operate reliably in harsh industrial environments.

Peripheral IC Type:

MICROPROCESSOR CIRCUIT - Integrates additional functions for enhanced performance and capabilities.

Technology:

CMOS - Low power consumption and high noise immunity for efficient operation.

Terminal Form:

BALL - Facilitates easy and reliable connections on the circuit board.

Nominal Supply Voltage:

1.35 V - Ensures stable operation within a specified voltage range.

Bus Compatibility:

I2C; SPI; UART; USB - Compatible with various communication protocols for versatile connectivity.

Terminal Pitch:

0.65 mm - Allows for precise and efficient connection to the circuit board.

Format:

FIXED POINT - Suitable for applications requiring fixed-point arithmetic operations.

Moisture Sensitivity Level (MSL):

3 - Suitable for devices exposed to moderate moisture levels without affecting performance.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs TMS320DM365ZCED30 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

Bit Size:

32

Bus Compatibility:

I2C; SPI; UART; USB

External Data Bus Width:

32

Format:

FIXED POINT

JESD-30 Code:

S-PBGA-B338

JESD-609 Code:

e1

Length:

13 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

338

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA338,19X19,25

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.35,1.8,3.3

Qualification:

Not Qualified

RAM Words:

8192

Maximum Seated Height:

1.3 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.42 V

Minimum Supply Voltage:

1.28 V

Nominal Supply Voltage:

1.35 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

13 mm

Peripheral IC Type:

Trade Compliance

TMS320DM365ZCED30 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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