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TMS320DM335ZCEA135

Texas Instruments

TMS320DM335ZCEA135 by Texas Instruments

TMS320DM335ZCEA135 by Texas Instruments is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 100 °C, with supply voltage range of 1.235V to 1.365V. Ideal for industrial applications requiring low profile and fine pitch package style.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,578 parts In-Stock

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4,578

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Digiode

USA . 1,378 parts In-Stock

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1,378

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Distributors (Availability)

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AZTECH Wire

Italy . 643 parts In-Stock

1+ parts

$5.149

100+ parts

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643

$5.149

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One Stop Electronics

USA . 588 parts In-Stock

1+ parts

$21.000

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588

$21.000

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Corohmni

South Africa . 143 parts In-Stock

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$30.268

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143

$30.268

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Parana Technologies

USA . 1,682 parts In-Stock

1+ parts

$45.786

100+ parts

$4,251.929

1k+ parts

$41.207

10k+ parts

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1,682

$45.786

$4,251.929

$41.207

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DigiPath Technology Company

USA . 1,335 parts In-Stock

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$50.416

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1,335

$50.416

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ChromeModa Solutions

Germany . 2,398 parts In-Stock

1+ parts

$51.445

100+ parts

$42.185

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2,398

$51.445

$42.185

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IDEA Electronic Components Group

UK . 2,141 parts In-Stock

1+ parts

$51.445

100+ parts

$48.873

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$46.300

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2,141

$51.445

$48.873

$46.300

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Corphita

USA . 3,866 parts In-Stock

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3,866

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Overview

Unlock the power of cutting-edge technology with the TMS320DM335ZCEA135 by Texas Instruments. Designed for maximum performance and reliability, this MICROPROCESSOR CIRCUIT offers unparalleled quality and precision in a compact SQUARE package. Whether you're working on industrial automation, robotics, or embedded systems, this innovative solution guarantees seamless integration and optimal efficiency. Trust Texas Instruments to deliver superior products that exceed your expectations every time. Experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the product.

Surface Mount: YES

Allows for easy and efficient installation on circuit boards.

Maximum Supply Voltage: 1.365 V

Suitable for a wide range of applications without risking damage from high voltage.

Package Shape: SQUARE

Optimizes space on the circuit board for efficient use of real estate.

No. of Terminals: 337

Provides ample connectivity options for various external components and peripherals.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

Enhances the overall performance and functionality of the product by optimizing signal transmission.

Minimum Supply Voltage: 1.235 V

Allows for operation at lower voltage levels for energy efficiency.

Maximum Operating Temperature: 100 °C

Ensures reliable performance even in high-temperature environments.

Minimum Operating Temperature: -40 °C

Ensures functionality in extreme cold conditions.

Terminal Position: BOTTOM

Facilitates easy access and connection with other components on the circuit board.

Maximum Seated Height: 1.3 mm

Allows for compact and low-profile design of the product.

Width: 13 mm

Optimizes space utilization on the circuit board and ensures a streamlined design.

Length: 13 mm

Optimizes space utilization on the circuit board and ensures a streamlined design.

Temperature Grade: INDUSTRIAL

Meets the standards for industrial-grade performance and reliability.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Provides advanced processing capabilities for enhanced functionality and performance.

Technology: CMOS

Utilizes Complementary Metal-Oxide-Semiconductor technology for low power consumption and high efficiency.

Terminal Form: BALL

Ensures secure and reliable connections with other components on the circuit board.

Nominal Supply Voltage: 1.3 V

Optimal voltage level for efficient and reliable operation.

Terminal Pitch: 0.65 mm

Allows for precise and compact layout on the circuit board for enhanced performance.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs TMS320DM335ZCEA135 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PBGA-B337

Length:

13 mm

No. of Terminals:

337

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Qualification:

Not Qualified

Maximum Seated Height:

1.3 mm

Maximum Supply Voltage:

1.365 V

Minimum Supply Voltage:

1.235 V

Nominal Supply Voltage:

1.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Width:

13 mm

Peripheral IC Type:

Trade Compliance

TMS320DM335ZCEA135 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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