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TMS320DM368ZCEF

Texas Instruments

TMS320DM368ZCEF by Texas Instruments

TMS320DM368ZCEF by Texas Instruments is a 32-bit microprocessor with 8192 RAM words, operating b/w 0-85 °C. It supports I2C, SPI, UART, USB buses and has a terminal pitch of 0.65 mm. Ideal for applications requiring low profile, fine pitch package style in CMOS technology.

Median Price

$50.140

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 460 parts In-Stock

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$31.024

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$27.577

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$20.277

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460

$31.024

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$20.277

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Mouser Electronics

USA . 159 parts In-Stock

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$50.140

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$39.250

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$39.250

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DigiKey

USA . 6 parts In-Stock

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$50.140

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6

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Distributors (In-Stock)

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Digiode

USA . 62 parts In-Stock

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$29.473

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$29.473

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Nova Conductors

Japan . 74 parts In-Stock

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$35.280

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Vyrian

USA . 7,519 parts In-Stock

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Chip Stock

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265

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Connector Distribution Corp

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10

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LIBRA Elektronik GmbH

Germany . 10 parts In-Stock

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Right Parts Inc.

USA . 10 parts In-Stock

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Cyclops Electronics Ltd

UK . 2 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 787 parts In-Stock

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$18.325

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Ampacity Inc.

Singapore . 209 parts In-Stock

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$26.370

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$26.370

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Semicontronic

India . 151 parts In-Stock

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$26.370

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$25.711

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$25.579

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$26.370

$25.711

$25.579

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Corphita

USA . 2,631 parts In-Stock

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$27.922

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$27.922

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Aranea Global

USA . 1,000 parts In-Stock

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$34.574

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$33.191

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$34.574

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Continental Prestige Electronics

USA . 6,430 parts In-Stock

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$35.280

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$34.574

6,430

$35.280

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$34.574

Corohmni

South Africa . 1,148 parts In-Stock

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$36.458

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Parana Technologies

USA . 1,891 parts In-Stock

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$70.225

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DigiPath Technology Company

USA . 822 parts In-Stock

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$77.327

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ChromeModa Solutions

Germany . 3,439 parts In-Stock

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$78.905

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$64.702

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$78.905

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IDEA Electronic Components Group

UK . 2,036 parts In-Stock

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$78.905

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$74.960

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$71.014

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Microchip USA

USA . 2,644 parts In-Stock

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$87.650

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$86.130

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$85.370

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$84.600

2,644

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A-Z Elektronik GmbH

Germany . 4,862 parts In-Stock

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Authorized Procurement Solutions

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Perfect Parts

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Argo Parts USA

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GreenTree Electronics

Israel . 50 parts In-Stock

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Overview

Discover the power and precision of the TMS320DM368ZCEF by Texas Instruments, a cutting-edge microprocessor circuit that delivers unparalleled performance and reliability. With advanced technology and a wide range of applications, this product offers customers a seamless user experience and enhanced functionality. Experience the quality and innovation of Texas Instruments with the TMS320DM368ZCEF, designed to exceed expectations and elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material ensures durability and resistance to external elements, making it a reliable choice.

Surface Mount: YES

The surface mount feature allows for easy and convenient installation on PCBs, saving time and effort during assembly.

Maximum Supply Voltage: 1.42 V

With a high maximum supply voltage, this product can handle power fluctuations effectively and ensure stable performance.

Package Shape: SQUARE

The square package shape helps in saving space on the PCB and allows for efficient component layout in tight spaces.

Bit Size: 32

The 32-bit architecture provides high processing power and capability, making it suitable for complex applications.

Power Supplies (V): 1.35,1.8,3.3

The product supports multiple power supply voltages, offering flexibility in design and compatibility with various systems.

No. of Terminals: 338

The high number of terminals enables connectivity with a wide range of external devices and peripherals, enhancing functionality.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The grid array, low profile, and fine pitch package style ensures efficient heat dissipation and optimal signal integrity.

Minimum Supply Voltage: 1.28 V

The low minimum supply voltage requirement allows for energy-efficient operation and prolongs battery life in portable applications.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature makes the product suitable for industrial environments where heat resistance is critical.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature ensures reliable performance even in cold environments, making it versatile for various applications.

Terminal Finish: TIN SILVER COPPER

The use of tin, silver, and copper as terminal finish provides excellent conductivity and corrosion resistance, ensuring long-term reliability.

Terminal Position: BOTTOM

The bottom terminal position simplifies PCB layout and reduces interference with other components, optimizing space utilization.

Maximum Seated Height: 1.3 mm

The low maximum seated height enables a compact design that is suitable for slim and lightweight devices.

RAM Words: 8192

The ample RAM size of 8192 words allows for efficient data processing and storage, enhancing the product's performance.

Width: 13 mm

The compact width of 13 mm makes the product suitable for applications where space-saving is essential.

External Data Bus Width: 32

The 32-bit external data bus width enables high-speed data transfer and processing capabilities, enhancing overall system performance.

Maximum Time At Peak Reflow Temperature (s): 30

The short maximum time at peak reflow temperature ensures quick and efficient soldering during manufacturing processes.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance ensures reliable solder joints and prevents solder defects, enhancing product durability.

Length: 13 mm

The short length of 13 mm allows for a compact and efficient PCB design, ideal for space-constrained applications.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

The peripheral IC type as a microprocessor circuit offers high processing power and functionality, making it suitable for advanced applications.

Technology: CMOS

The CMOS technology used in the product ensures low power consumption, high speed, and reliability, making it an energy-efficient choice.

Terminal Form: BALL

The ball terminal form offers reliable connections and ease of installation, making it a user-friendly option.

Nominal Supply Voltage: 1.35 V

The nominal supply voltage of 1.35 V ensures stable and efficient power delivery, enhancing overall system performance.

Bus Compatibility: I2C; SPI; UART; USB

The bus compatibility with I2C, SPI, UART, and USB allows for versatile connectivity options, making it suitable for diverse applications.

Terminal Pitch: 0.65 mm

The small terminal pitch of 0.65 mm enables high-density board designs and efficient signal routing, maximizing PCB space usage.

Format: FIXED POINT

The fixed-point format simplifies data processing and calculations, making it suitable for real-time applications.

Moisture Sensitivity Level (MSL): 3

The moisture sensitivity level of 3 ensures that the product can withstand standard humidity conditions, making it suitable for a variety of environments.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs TMS320DM368ZCEF attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

Bit Size:

32

Bus Compatibility:

I2C; SPI; UART; USB

External Data Bus Width:

32

Format:

FIXED POINT

JESD-30 Code:

S-PBGA-B338

JESD-609 Code:

e1

Length:

13 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

338

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA338,19X19,25

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.35,1.8,3.3

Qualification:

Not Qualified

RAM Words:

8192

Maximum Seated Height:

1.3 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.42 V

Minimum Supply Voltage:

1.28 V

Nominal Supply Voltage:

1.35 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

13 mm

Peripheral IC Type:

Trade Compliance

TMS320DM368ZCEF Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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