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TMS320DM355DZCE270

Texas Instruments

TMS320DM355DZCE270 by Texas Instruments

TMS320DM355DZCE270 by Texas Instruments is a 32-bit microprocessor with 8192 RAM words. It operates at temperatures from 0 to 85 °C and supports I2C, SPI, UART, and USB buses. This MICROPROCESSOR CIRCUIT has a package style of GRID ARRAY and is suitable for various applications requiring low profile and fine pitch components.

Median Price

$34.102

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 32,439 parts In-Stock

1+ parts

$34.102

100+ parts

$30.313

1k+ parts

$22.289

10k+ parts

-

32,439

$34.102

$30.313

$22.289

-

Rochester

USA . 321 parts In-Stock

1+ parts

-

100+ parts

$32.040

1k+ parts

$28.670

10k+ parts

$26.980

321

-

$32.040

$28.670

$26.980

DigiKey

USA . 321 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

321

-

-

-

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Verical

USA . 321 parts In-Stock

1+ parts

-

100+ parts

$40.050

1k+ parts

$35.837

10k+ parts

$33.725

321

-

$40.050

$35.837

$33.725

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,776 parts In-Stock

1+ parts

$29.412

100+ parts

-

1k+ parts

-

10k+ parts

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2,776

$29.412

-

-

-

Vyrian

USA . 5,998 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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5,998

-

-

-

-

DigiKey Marketplace

USA . 321 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

321

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 765 parts In-Stock

1+ parts

$27.864

100+ parts

-

1k+ parts

-

10k+ parts

-

765

$27.864

-

-

-

Parana Technologies

USA . 678 parts In-Stock

1+ parts

$39.555

100+ parts

-

1k+ parts

-

10k+ parts

-

678

$39.555

-

-

-

DigiPath Technology Company

USA . 279 parts In-Stock

1+ parts

$43.555

100+ parts

$40.071

1k+ parts

-

10k+ parts

-

279

$43.555

$40.071

-

-

ChromeModa Solutions

Germany . 6,479 parts In-Stock

1+ parts

$44.444

100+ parts

$36.444

1k+ parts

-

10k+ parts

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6,479

$44.444

$36.444

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-

IDEA Electronic Components Group

UK . 1,387 parts In-Stock

1+ parts

$44.444

100+ parts

$42.222

1k+ parts

$40.000

10k+ parts

-

1,387

$44.444

$42.222

$40.000

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Corohmni

South Africa . 258 parts In-Stock

1+ parts

$83.788

100+ parts

-

1k+ parts

-

10k+ parts

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258

$83.788

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-

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QUARKTWIN TECHNOLOGY LTD

USA . 24,576 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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24,576

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Perfect Parts

USA . 312 parts In-Stock

1+ parts

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312

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Overview

Unleash the power of innovation with the TMS320DM355DZCE270 by Texas Instruments. As a leader in the industry, Texas Instruments delivers top-notch quality and reliability in every product they create. The TMS320DM355DZCE270 falls into the category of Other Function uPs,uCs & Peripheral ICs, offering a wide range of applications for various projects. With its advanced technology and exceptional performance, this product provides unmatched value and benefits to customers looking to take their designs to the next level. Experience the advantages of Texas Instruments today with the TMS320DM355DZCE270.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used for electronic components due to its durability, moisture resistance, and cost-effectiveness.

Surface Mount: YES

Surface mount packaging allows for easy installation onto a circuit board and helps save space.

Maximum Supply Voltage: 1.365 V

Operating at a maximum supply voltage of 1.365V ensures efficient power utilization and helps protect the components from potential damage.

Package Shape: SQUARE

Square packages are space-efficient and easy to handle during assembly and maintenance.

Bit Size: 32

With a bit size of 32, this product can handle complex data processing tasks and calculations effectively.

Power Supplies (V): 1.3, 1.8, 3.3

Support for multiple power supply voltages provides flexibility in designing and operating the product in various applications.

No. of Terminals: 337

A higher number of terminals allow for more connectivity options and can support a wide range of input and output devices.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The combination of grid array, low profile, and fine pitch packaging styles offers versatility in mounting options and enhances overall performance.

Minimum Supply Voltage: 1.235 V

The minimum supply voltage of 1.235V ensures stable operation even under low power conditions.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C allows the product to function reliably in a wide range of environmental conditions.

Minimum Operating Temperature: 0 °C

The minimum operating temperature of 0°C indicates that the product can withstand cold temperatures without performance degradation.

Terminal Finish: TIN SILVER COPPER

This terminal finish provides excellent conductivity, corrosion resistance, and solderability for reliable connections.

Terminal Position: BOTTOM

Bottom terminal position simplifies the installation process and ensures proper alignment on the circuit board.

Maximum Seated Height: 1.3 mm

The low seated height of 1.3mm minimizes the overall profile of the product, making it suitable for compact electronic devices.

RAM Words: 8192

With a large RAM capacity of 8192 words, the product can efficiently store and retrieve data during operation.

Width: 13 mm

A width of 13mm offers a balance between compactness and accessibility, making the product suitable for various design layouts.

External Data Bus Width: 32

The 32-bit external data bus width allows for fast and efficient data transfer between the product and external devices.

Maximum Time At Peak Reflow Temperature (s): 30

The 30-second maximum time at peak reflow temperature ensures proper soldering and component bonding during assembly processes.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260°C enables reliable solder joints and helps prevent solder defects.

Length: 13 mm

A length of 13mm complements the width dimension and provides a compact form factor for the product.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Being a microprocessor circuit, this product offers advanced processing capabilities and can handle various tasks efficiently.

Technology: CMOS

CMOS technology provides low power consumption, high noise immunity, and reliability, making the product suitable for battery-powered devices.

Terminal Form: BALL

Ball terminals offer secure connections and excellent signal integrity, enhancing the overall performance of the product.

Nominal Supply Voltage: 1.3 V

Operating at a nominal supply voltage of 1.3V ensures consistent and stable performance under typical operating conditions.

Bus Compatibility: I2C; SPI; UART; USB

Support for multiple bus protocols such as I2C, SPI, UART, and USB allows for versatile connectivity options with other devices.

Terminal Pitch: 0.65 mm

The fine terminal pitch of 0.65mm enables high-density mounting and efficient signal routing on the circuit board.

Format: FIXED POINT

Fixed-point format simplifies data representation and arithmetic operations, suitable for a wide range of applications.

Moisture Sensitivity Level (MSL): 3

A moisture sensitivity level of 3 indicates that the product can withstand moderate exposure to moisture during handling and storage.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs TMS320DM355DZCE270 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

Additional Features:

IT ALSO OPERATES AT 1.8V AND 3.3V SUPPLY FOR I/O

Bit Size:

32

Bus Compatibility:

I2C; SPI; UART; USB

External Data Bus Width:

32

Format:

FIXED POINT

JESD-30 Code:

S-PBGA-B337

JESD-609 Code:

e1

Length:

13 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

337

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA337,19X19,25

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.3,1.8,3.3

Qualification:

Not Qualified

RAM Words:

8192

Maximum Seated Height:

1.3 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.365 V

Minimum Supply Voltage:

1.235 V

Nominal Supply Voltage:

1.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

13 mm

Peripheral IC Type:

Trade Compliance

TMS320DM355DZCE270 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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