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TMS320DM368ZCEDF

Texas Instruments

TMS320DM368ZCEDF by Texas Instruments

TMS320DM368ZCEDF by Texas Instruments is a 32-bit microprocessor with 8192 RAM words. It operates in industrial temperature range (-40 to 85 °C) and supports I2C, SPI, UART, USB buses. This MICROPROCESSOR CIRCUIT is ideal for applications requiring low profile and fine pitch package style.

Median Price

$54.340

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 3,339 parts In-Stock

1+ parts

$33.845

100+ parts

$30.085

1k+ parts

$22.121

10k+ parts

-

3,339

$33.845

$30.085

$22.121

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DigiKey

USA . 53 parts In-Stock

1+ parts

$54.340

100+ parts

$42.319

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-

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53

$54.340

$42.319

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Mouser Electronics

USA . 36 parts In-Stock

1+ parts

$54.340

100+ parts

$42.310

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-

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36

$54.340

$42.310

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,669 parts In-Stock

1+ parts

$32.153

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-

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1,669

$32.153

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Nova Conductors

Japan . 700 parts In-Stock

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$38.490

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700

$38.490

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Vyrian

USA . 3,700 parts In-Stock

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-

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3,700

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-

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Chip Stock

USA . 1,123 parts In-Stock

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1,123

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Cyclops Electronics Ltd

UK . 37 parts In-Stock

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37

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Bristol Electronics

USA . 25 parts In-Stock

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25

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,054 parts In-Stock

1+ parts

$14.534

100+ parts

-

1k+ parts

$14.974

10k+ parts

-

1,054

$14.534

-

$14.974

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Corohmni

South Africa . 1,058 parts In-Stock

1+ parts

$15.128

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-

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1,058

$15.128

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DigiPath Technology Company

USA . 960 parts In-Stock

1+ parts

$16.003

100+ parts

$14.723

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-

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960

$16.003

$14.723

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ChromeModa Solutions

Germany . 3,421 parts In-Stock

1+ parts

$16.330

100+ parts

$13.391

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3,421

$16.330

$13.391

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IDEA Electronic Components Group

UK . 1,923 parts In-Stock

1+ parts

$16.330

100+ parts

$15.514

1k+ parts

$14.697

10k+ parts

-

1,923

$16.330

$15.514

$14.697

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Ampacity Inc.

Singapore . 935 parts In-Stock

1+ parts

$28.770

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935

$28.770

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Semicontronic

India . 780 parts In-Stock

1+ parts

$28.770

100+ parts

$28.051

1k+ parts

$27.907

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780

$28.770

$28.051

$27.907

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Corphita

USA . 2,331 parts In-Stock

1+ parts

$30.460

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2,331

$30.460

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Continental Prestige Electronics

USA . 5,628 parts In-Stock

1+ parts

$35.283

100+ parts

-

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$34.577

5,628

$35.283

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-

$34.577

Advanced Electronics

New Zealand . 900 parts In-Stock

1+ parts

$44.648

100+ parts

$41.077

1k+ parts

$38.490

10k+ parts

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900

$44.648

$41.077

$38.490

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Lixinc

USA . 19,820 parts In-Stock

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19,820

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iodParts Technologies Inc.

India . 8,017 parts In-Stock

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8,017

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Argo Parts USA

USA . 2,502 parts In-Stock

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2,502

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Kepictronics

USA . 1,490 parts In-Stock

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1,490

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Overview

Unlock unparalleled performance and efficiency with the TMS320DM368ZCEDF by Texas Instruments. As a leader in semiconductor manufacturing, Texas Instruments delivers cutting-edge solutions that redefine the possibilities in the realm of Other Function uPs, uCs & Peripheral ICs. With a focus on quality and innovation, this product offers customers unmatched value through its advanced features and applications. Experience seamless integration, increased productivity, and superior functionality with the TMS320DM368ZCEDF, setting new standards in the industry. Elevate your projects and achieve excellence with Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy makes this product lightweight and durable.

Surface Mount: YES

With surface mount capability, this product is easy to install and saves space on the PCB.

Maximum Supply Voltage: 1.42V

The high maximum supply voltage allows for flexibility in power input options.

Package Shape: SQUARE

The square package shape aids in efficient PCB layout and space utilization.

Bit Size: 32

A 32-bit size ensures high processing power and capability for complex applications.

Power Supplies (V): 1.35, 1.8, 3.3

Multiple power supply options provide versatility for various power requirements.

No. of Terminals: 338

With a large number of terminals, this product can connect to multiple external components.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The grid array, low profile, and fine pitch package style offers high density and reliability.

Minimum Supply Voltage: 1.28V

The low minimum supply voltage ensures compatibility with different power sources.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature allows for reliable operation in various environments.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures functionality in extreme conditions.

Terminal Finish: TIN SILVER COPPER

The terminal finish of tin silver copper provides excellent conductivity and corrosion resistance.

Terminal Position: BOTTOM

The bottom terminal position simplifies PCB routing and assembly.

Maximum Seated Height: 1.3mm

The low maximum seated height contributes to a compact overall design.

RAM Words: 8192

With a large RAM capacity, this product can handle extensive data processing tasks efficiently.

Width: 13mm

The compact width of 13mm allows for easy integration into tight spaces.

External Data Bus Width: 32

A 32-bit external data bus width enables fast data transfer rates.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time at peak reflow temperature of 30 seconds ensures proper soldering without component damage.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance ensures reliability during soldering processes.

Length: 13mm

The length of 13mm contributes to the product's overall compactness and space-saving design.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable performance in harsh operating conditions.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

The microprocessor circuit type provides advanced functionality for processing tasks.

Technology: CMOS

The CMOS technology offers low power consumption and high-speed operation.

Terminal Form: BALL

The ball terminal form provides secure connections and ease of soldering.

Nominal Supply Voltage: 1.35V

The nominal supply voltage of 1.35V ensures stable operation within specified parameters.

Bus Compatibility: I2C; SPI; UART; USB

Multiple bus compatibility options allow for flexible communication interfaces.

Terminal Pitch: 0.65mm

The small terminal pitch of 0.65mm aids in high-density packaging and PCB layout.

Format: FIXED POINT

The fixed-point format is ideal for applications requiring precise mathematical calculations.

Moisture Sensitivity Level (MSL): 3

The MSL level of 3 indicates the product's resistance to moisture and humidity.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs TMS320DM368ZCEDF attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

Bit Size:

32

Bus Compatibility:

I2C; SPI; UART; USB

External Data Bus Width:

32

Format:

FIXED POINT

JESD-30 Code:

S-PBGA-B338

JESD-609 Code:

e1

Length:

13 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

338

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA338,19X19,25

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.35,1.8,3.3

Qualification:

Not Qualified

RAM Words:

8192

Maximum Seated Height:

1.3 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.42 V

Minimum Supply Voltage:

1.28 V

Nominal Supply Voltage:

1.35 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

13 mm

Peripheral IC Type:

Trade Compliance

TMS320DM368ZCEDF Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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