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OMAPL138EZWT3

Texas Instruments

OMAPL138EZWT3 by Texas Instruments

OMAPL138EZWT3 by Texas Instruments is a low-profile, fine-pitch microprocessor circuit with 361 terminals. It operates at a max clock frequency of 50 MHz and has a data bus width of 32. This versatile IC is compatible with I2C, SPI, UART, and USB buses, making it suitable for various applications requiring high-speed processing.

Median Price

$20.302

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 38 parts In-Stock

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$4.297

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$4.297

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Chip1Stop

Japan . 38 parts In-Stock

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$15.300

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38

$15.300

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Texas Instruments

USA . 305 parts In-Stock

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$20.302

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$17.734

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$12.230

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305

$20.302

$17.734

$12.230

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Mouser Electronics

USA . 487 parts In-Stock

1+ parts

$31.840

100+ parts

$22.450

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$22.130

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487

$31.840

$22.450

$22.130

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DigiKey

USA . 278 parts In-Stock

1+ parts

$32.410

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$23.104

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$22.131

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278

$32.410

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$22.131

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Verical

USA . 38 parts In-Stock

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38

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Digiode

USA . 1,476 parts In-Stock

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$14.088

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$14.088

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Chip Stock

USA . 3,300 parts In-Stock

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3,300

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Vyrian

USA . 2,073 parts In-Stock

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Nova Conductors

Japan . 98 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 235 parts In-Stock

1+ parts

$12.610

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235

$12.610

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Semicontronic

India . 157 parts In-Stock

1+ parts

$12.610

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$12.295

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$12.232

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157

$12.610

$12.295

$12.232

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Corphita

USA . 3,622 parts In-Stock

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$13.347

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Corohmni

South Africa . 1,227 parts In-Stock

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$20.253

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Parana Technologies

USA . 771 parts In-Stock

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$53.601

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771

$53.601

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ChromeModa Solutions

Germany . 5,395 parts In-Stock

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$60.226

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$49.385

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5,395

$60.226

$49.385

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IDEA Electronic Components Group

UK . 894 parts In-Stock

1+ parts

$60.226

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$57.215

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$54.203

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894

$60.226

$57.215

$54.203

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Lixinc

USA . 12,969 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,726 parts In-Stock

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Continental Prestige Electronics

USA . 5,320 parts In-Stock

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DigiPath Technology Company

USA . 1,433 parts In-Stock

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$54.300

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Perfect Parts

USA . 1,411 parts In-Stock

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Argo Parts USA

USA . 564 parts In-Stock

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564

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Bastille Electronics

Australia . 500 parts In-Stock

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Futuretech Components

Singapore . 500 parts In-Stock

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Kepictronics

USA . 150 parts In-Stock

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Overview

Experience the unparalleled quality and innovation of Texas Instruments with the OMAPL138EZWT3. As a leading manufacturer in the industry, Texas Instruments consistently delivers cutting-edge technology that exceeds expectations. This versatile product falls under the category of Other Function uPs, uCs & Peripheral ICs, making it an essential component for a wide range of applications. With its grid array, low profile, and fine pitch package style, the OMAPL138EZWT3 offers convenience and ease of use. Its advanced features, such as I2C, SPI, UART, and USB compatibility, provide endless possibilities for integration and connectivity. Discover the value and benefits that this exceptional product brings to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material helps in reducing the overall weight of the product and provides good thermal conductivity.

Surface Mount: YES

The surface mount capability makes it easier to integrate this product into various electronic devices, saving space and simplifying the manufacturing process.

Maximum Supply Voltage: 1.35 V

The high maximum supply voltage allows for reliable operation and performance of the product under varying power conditions.

Package Shape: SQUARE

The square package shape helps in easy alignment and assembly of the product on circuit boards, ensuring proper placement and connectivity.

No. of Terminals: 361

With a high number of terminals, this product offers extensive connectivity options and compatibility with a wide range of external devices and peripherals.

Maximum Operating Temperature: 90 °C

The high maximum operating temperature ensures that the product can perform reliably in various environmental conditions, making it suitable for industrial applications.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature ensures that the product can function effectively even in cold environments, increasing its versatility.

Bus Compatibility: I2C; SPI; UART; USB

The compatibility with multiple bus protocols allows for flexible and versatile communication options, making the product suitable for a wide range of applications.

Speed: 456 rpm

The high speed capability of 456 rpm enables fast processing and response times, making this product ideal for applications that require quick data handling.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs OMAPL138EZWT3 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

Additional Features:

IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY

Bus Compatibility:

I2C; SPI; UART; USB

Maximum Clock Frequency:

50 MHz

External Data Bus Width:

32

JESD-30 Code:

S-PBGA-B361

JESD-609 Code:

e1

Length:

16 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

361

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.4 mm

Speed:

456 rpm

Maximum Supply Voltage:

1.35 V

Minimum Supply Voltage:

1.25 V

Nominal Supply Voltage:

1.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

16 mm

Peripheral IC Type:

Trade Compliance

OMAPL138EZWT3 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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