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OMAPL132BZWTA2E

Texas Instruments

OMAPL132BZWTA2E by Texas Instruments

OMAPL132BZWTA2E by Texas Instruments is a MICROPROCESSOR CIRCUIT with 361 terminals in a GRID ARRAY package. It operates at supply voltages ranging from 0.95V to 1.2V, making it suitable for low power applications. With a compact SQUARE shape and BALL terminal form, it is ideal for space-constrained designs requiring high performance.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,470 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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3,470

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Vyrian

USA . 2,354 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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2,354

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,348 parts In-Stock

1+ parts

$3.000

100+ parts

-

1k+ parts

-

10k+ parts

-

1,348

$3.000

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Parana Technologies

USA . 327 parts In-Stock

1+ parts

$15.463

100+ parts

$1,435.961

1k+ parts

$13.917

10k+ parts

-

327

$15.463

$1,435.961

$13.917

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DigiPath Technology Company

USA . 1,241 parts In-Stock

1+ parts

$17.027

100+ parts

-

1k+ parts

-

10k+ parts

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1,241

$17.027

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ChromeModa Solutions

Germany . 2,034 parts In-Stock

1+ parts

$17.374

100+ parts

$14.247

1k+ parts

-

10k+ parts

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2,034

$17.374

$14.247

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-

IDEA Electronic Components Group

UK . 1,037 parts In-Stock

1+ parts

$17.374

100+ parts

$16.505

1k+ parts

$15.637

10k+ parts

-

1,037

$17.374

$16.505

$15.637

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AZTECH Wire

Italy . 261 parts In-Stock

1+ parts

$19.687

100+ parts

-

1k+ parts

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10k+ parts

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261

$19.687

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Corohmni

South Africa . 665 parts In-Stock

1+ parts

$26.226

100+ parts

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1k+ parts

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10k+ parts

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665

$26.226

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Microchip USA

USA . 391 parts In-Stock

1+ parts

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100+ parts

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391

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Corphita

USA . 246 parts In-Stock

1+ parts

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246

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Overview

Experience unparalleled quality and innovation with the OMAPL132BZWTA2E by Texas Instruments. As a leader in the industry, Texas Instruments delivers cutting-edge solutions for a wide range of applications, including Other Function uPs,uCs & Peripheral ICs. With a focus on value and performance, this product offers customers unmatched benefits, reliability, and versatility. Trust Texas Instruments to provide you with the tools you need to succeed in today's competitive market. Elevate your projects with the OMAPL132BZWTA2E and experience the difference that quality makes.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the product lightweight and durable, ideal for portable and long-lasting applications.

Surface Mount: YES

Being surface mountable allows for easier and more efficient PCB assembly, saving time and effort during manufacturing.

Maximum Supply Voltage: 1.05 V

The maximum supply voltage of 1.05V ensures safe operation and protection of the component, preventing damage from overvoltage.

Package Shape: SQUARE

The square package shape provides a compact form factor, saving space on the PCB and allowing for higher component density.

Power Supplies (V): 1.2,1.8/3.3

The multiple power supply options allow for versatility in different voltage requirements, making it adaptable to a variety of system designs.

No. of Terminals: 361

With a high number of terminals, this product offers a wide range of connectivity options, enabling complex circuit configurations.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The combination of grid array, low profile, and fine pitch package styles promotes efficient PCB layout and assembly, improving overall system reliability.

Minimum Supply Voltage: 0.95 V

The low minimum supply voltage of 0.95V allows for operation in low-power scenarios, making it suitable for energy-efficient applications.

Terminal Finish: TIN SILVER COPPER

The use of tin, silver, and copper terminal finish provides excellent conductivity and corrosion resistance, ensuring reliable electrical connections.

Terminal Position: BOTTOM

Bottom terminal positioning facilitates easier heat dissipation and soldering during assembly, improving thermal management and overall performance.

Maximum Seated Height: 1.4 mm

The low maximum seated height of 1.4mm saves vertical space on the PCB, allowing for compact and slim device designs.

Width: 16 mm

The compact width of 16mm contributes to a smaller footprint on the PCB, enabling high-density integration in crowded electronic systems.

Maximum Time At Peak Reflow Temperature (s): 30

With a maximum time of 30 seconds at peak reflow temperature, this product is well-suited for efficient and reliable soldering processes during assembly.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C ensures proper solder joint formation, contributing to the long-term reliability and performance of the product.

Length: 16 mm

The compact length of 16mm further enhances space-saving benefits on the PCB, promoting compact and streamlined device designs.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

As a microprocessor circuit, this product offers advanced processing capabilities, making it suitable for sophisticated computing and control applications.

Technology: CMOS

Utilizing CMOS technology ensures low power consumption and high noise immunity, enhancing the energy efficiency and reliability of the product.

Terminal Form: BALL

The ball terminal form enables reliable connections and efficient soldering, contributing to overall system durability and performance.

Nominal Supply Voltage: 1 V

The nominal supply voltage of 1V provides stable and consistent power to the component, ensuring reliable operation and performance.

Terminal Pitch: 0.8 mm

The fine terminal pitch of 0.8mm allows for high-density packing of terminals on the PCB, enabling intricate circuit designs and reducing space constraints.

Moisture Sensitivity Level (MSL): 3

With a moisture sensitivity level of 3, this product is less susceptible to moisture-induced damage, offering increased reliability in various environmental conditions.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs OMAPL132BZWTA2E attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

Additional Features:

ALSO OPERATES AT 1.2 V AND 1.1 V TYP

JESD-30 Code:

S-PBGA-B361

JESD-609 Code:

e1

Length:

16 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

361

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA361,19X19,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,1.8/3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.4 mm

Sub-Category:

Other Microprocessor ICs

Maximum Supply Voltage:

1.05 V

Minimum Supply Voltage:

.95 V

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

16 mm

Peripheral IC Type:

Trade Compliance

OMAPL132BZWTA2E Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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