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OMAPL138EZCE3

Texas Instruments

OMAPL138EZCE3 by Texas Instruments

OMAPL138EZCE3 by Texas Instruments is a MICROPROCESSOR CIRCUIT with 32-bit External Data Bus Width and 50 MHz Max Clock Frequency. It operates b/w 0-90 °C, suitable for applications requiring low power consumption and high processing speed like IoT devices and embedded systems.

Median Price

$21.924

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 70,739 parts In-Stock

1+ parts

$21.924

100+ parts

$19.150

1k+ parts

$13.207

10k+ parts

-

70,739

$21.924

$19.150

$13.207

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Bristol Electronics

USA . 320 parts In-Stock

1+ parts

$17.962

100+ parts

$15.889

1k+ parts

$14.729

10k+ parts

-

320

$17.962

$15.889

$14.729

-

Digiode

USA . 3,865 parts In-Stock

1+ parts

$20.828

100+ parts

-

1k+ parts

-

10k+ parts

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3,865

$20.828

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-

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Nova Conductors

Japan . 870 parts In-Stock

1+ parts

$21.860

100+ parts

-

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870

$21.860

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-

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Vyrian

USA . 35,178 parts In-Stock

1+ parts

-

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35,178

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ACDS - Activité Composants Distribution Service

France . 320 parts In-Stock

1+ parts

-

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320

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Dan-Mar Components

USA . 320 parts In-Stock

1+ parts

-

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-

1k+ parts

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320

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,242 parts In-Stock

1+ parts

$17.070

100+ parts

-

1k+ parts

$17.291

10k+ parts

-

1,242

$17.070

-

$17.291

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Ampacity Inc.

Singapore . 35,040 parts In-Stock

1+ parts

$18.640

100+ parts

-

1k+ parts

-

10k+ parts

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35,040

$18.640

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-

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Semicontronic

India . 35,039 parts In-Stock

1+ parts

$18.640

100+ parts

$18.174

1k+ parts

$18.081

10k+ parts

-

35,039

$18.640

$18.174

$18.081

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DigiPath Technology Company

USA . 170 parts In-Stock

1+ parts

$18.796

100+ parts

-

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-

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170

$18.796

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-

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AZTECH Wire

Italy . 390 parts In-Stock

1+ parts

$18.800

100+ parts

-

1k+ parts

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390

$18.800

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ChromeModa Solutions

Germany . 3,036 parts In-Stock

1+ parts

$19.180

100+ parts

$15.728

1k+ parts

-

10k+ parts

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3,036

$19.180

$15.728

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IDEA Electronic Components Group

UK . 470 parts In-Stock

1+ parts

$19.180

100+ parts

$18.221

1k+ parts

$17.262

10k+ parts

-

470

$19.180

$18.221

$17.262

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Corphita

USA . 872 parts In-Stock

1+ parts

$19.732

100+ parts

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872

$19.732

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Continental Prestige Electronics

USA . 3,878 parts In-Stock

1+ parts

$21.860

100+ parts

-

1k+ parts

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10k+ parts

$21.423

3,878

$21.860

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-

$21.423

Netroflash

USA . 500 parts In-Stock

1+ parts

$21.860

100+ parts

$21.423

1k+ parts

-

10k+ parts

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500

$21.860

$21.423

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Corohmni

South Africa . 1,902 parts In-Stock

1+ parts

$22.970

100+ parts

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1,902

$22.970

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Lixinc

USA . 4,236 parts In-Stock

1+ parts

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4,236

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Argo Parts USA

USA . 3,171 parts In-Stock

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3,171

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Kepictronics

USA . 2,000 parts In-Stock

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2,000

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Overview

Unleash the power of cutting-edge technology with the OMAPL138EZCE3 by Texas Instruments. Crafted with precision and expertise, this versatile microprocessor circuit offers unparalleled performance and reliability. From IoT devices to industrial automation systems, the possibilities are endless with this product. Experience seamless connectivity and lightning-fast processing speeds, all while ensuring optimal efficiency and cost-effectiveness. Elevate your projects to new heights with the OMAPL138EZCE3 - where innovation meets excellence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides good durability and resistance to moisture, making the product reliable in various environments.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly of the product on circuit boards, saving space and reducing overall system costs.

Maximum Supply Voltage: 1.35 V

Operating at a higher supply voltage ensures stable performance and allows for increased processing power.

Package Shape: SQUARE

Square package shape helps in efficient placement and mounting of the product on PCBs, optimizing space utilization.

No. of Terminals: 361

Having a high number of terminals enables the product to interface with a wide range of external devices and peripherals.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

This package style allows for high-density mounting, reducing signal interference and improving overall system performance.

Minimum Operating Temperature: 0 °C

Operating at low temperatures ensures the product can function reliably in cold environments without any performance degradation.

Maximum Clock Frequency: 50 MHz

Operating at a high clock frequency enables fast data processing and improves overall system responsiveness.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, contributing to the product's efficiency and reliability.

Bus Compatibility: I2C; SPI; UART; USB

Supporting multiple bus protocols allows for versatile connectivity options, making the product suitable for a wide range of applications.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs OMAPL138EZCE3 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

Additional Features:

IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY

Bus Compatibility:

I2C; SPI; UART; USB

Maximum Clock Frequency:

50 MHz

External Data Bus Width:

32

JESD-30 Code:

S-PBGA-B361

JESD-609 Code:

e1

Length:

13 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

361

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.3 mm

Speed:

456 rpm

Maximum Supply Voltage:

1.35 V

Minimum Supply Voltage:

1.25 V

Nominal Supply Voltage:

1.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

13 mm

Peripheral IC Type:

Trade Compliance

OMAPL138EZCE3 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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