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OMAPL138BZWTRB

Texas Instruments

OMAPL138BZWTRB by Texas Instruments

OMAPL138BZWTRB by Texas Instruments is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w 0-90°C, with supply voltage range of 1.25-1.35V. This SQUARE package has 361 terminals and is ideal for applications requiring low profile, fine pitch ICs in surface mount configurations.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 4,166 parts In-Stock

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Digiode

USA . 3,922 parts In-Stock

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Nova Conductors

Japan . 54 parts In-Stock

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AZTECH Wire

Italy . 704 parts In-Stock

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$8.310

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Ampacity Inc.

Singapore . 1,552 parts In-Stock

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$12.000

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Advanced Electronics

New Zealand . 350 parts In-Stock

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$12.521

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$11.394

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$10.267

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$12.521

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One Stop Electronics

USA . 1,302 parts In-Stock

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$33.000

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Parana Technologies

USA . 2,174 parts In-Stock

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$41.832

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DigiPath Technology Company

USA . 226 parts In-Stock

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$46.062

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IDEA Electronic Components Group

UK . 2,259 parts In-Stock

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$47.002

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$44.652

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$42.302

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ChromeModa Solutions

Germany . 2,024 parts In-Stock

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$47.002

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$38.542

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Corohmni

South Africa . 214 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 21,232 parts In-Stock

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Microchip USA

USA . 4,293 parts In-Stock

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Continental Prestige Electronics

USA . 3,099 parts In-Stock

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Corphita

USA . 2,596 parts In-Stock

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Argo Parts USA

USA . 1,339 parts In-Stock

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Aranea Global

USA . 100 parts In-Stock

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Overview

Discover unparalleled performance and reliability with the OMAPL138BZWTRB by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality products that exceed expectations. This Peripheral IC is perfect for a wide range of applications, offering customers exceptional value and benefits. Experience seamless functionality and superior efficiency with this cutting-edge product, setting new standards in the industry. Elevate your projects with the OMAPL138BZWTRB and unlock endless possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material provides durability and protection for the internal components of the product.

Surface Mount: YES

Surface mount capability allows for easy and efficient integration into circuit boards, saving space and simplifying assembly.

Maximum Supply Voltage: 1.35 V

Operates efficiently within a specific voltage range, ensuring stability and performance under varying conditions.

Package Shape: SQUARE

The square package shape allows for optimal use of space on the circuit board, making it suitable for compact designs.

No. of Terminals: 361

With a high number of terminals, this product offers a wide range of connection options, enabling complex circuit configurations.

Minimum Operating Temperature: 0 °C

With a minimum operating temperature of 0°C, this product can function reliably in a wide range of environmental conditions.

Terminal Finish: TIN SILVER COPPER

The terminal finish of tin silver copper provides excellent conductivity and corrosion resistance, ensuring long-term reliability.

Width: 16 mm

The compact width of 16mm makes this product suitable for space-constrained applications where size is a critical factor.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this product energy-efficient and reliable in various applications.

Nominal Supply Voltage: 1.3 V

The nominal supply voltage of 1.3V provides a stable power source for the product's operation, ensuring consistent performance.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs OMAPL138BZWTRB attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

Additional Features:

IT ASLO OPERATES IN 0.95V MINIMUM SUPPLY

JESD-30 Code:

S-PBGA-B361

JESD-609 Code:

e1

Length:

16 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

361

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.4 mm

Maximum Supply Voltage:

1.35 V

Minimum Supply Voltage:

1.25 V

Nominal Supply Voltage:

1.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

16 mm

Peripheral IC Type:

Trade Compliance

OMAPL138BZWTRB Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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