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MCIMX6U5DVM10ACR

NXP Semiconductors

MCIMX6U5DVM10ACR by NXP Semiconductors

MCIMX6U5DVM10ACR by NXP Semiconductors is a SYSTEM ON CHIP with CMOS technology. It operates b/w 0-95 °C, with supply voltage range of 1.35-1.5 V. Ideal for applications requiring low profile and fine pitch package style in a square shape with 624 terminals.

Median Price

$49.497

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 1,369 parts In-Stock

1+ parts

$57.810

100+ parts

$43.873

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1,369

$57.810

$43.873

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Verical

USA . 2,000 parts In-Stock

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$41.184

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Flip Electronics (Authorized)

USA . 1,631 parts In-Stock

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1,631

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Distributors (In-Stock)

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Nova Conductors

Japan . 870 parts In-Stock

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$39.664

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870

$39.664

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Digiode

USA . 4,671 parts In-Stock

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$44.508

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$44.508

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Chip Stock

USA . 4,860 parts In-Stock

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ComSIT Distribution GmbH

Germany . 2,982 parts In-Stock

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ComSIT USA

USA . 2,982 parts In-Stock

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Flip Electronics

USA . 2,214 parts In-Stock

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Anansix

USA . 2,137 parts In-Stock

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Vyrian

USA . 1,276 parts In-Stock

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Sensible Micro Corp

USA . 716 parts In-Stock

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Bristol Electronics

USA . 716 parts In-Stock

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Distributors (Availability)

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Semicontronic

India . 1,225 parts In-Stock

1+ parts

$28.420

100+ parts

$27.710

1k+ parts

$27.567

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1,225

$28.420

$27.710

$27.567

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Ampacity Inc.

Singapore . 1,183 parts In-Stock

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$28.420

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$28.420

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Aztec Data Supply Inc.

USA . 2,299 parts In-Stock

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$30.065

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$30.065

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Continental Prestige Electronics

USA . 1,419 parts In-Stock

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$39.664

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$38.870

1,419

$39.664

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$38.870

Netroflash

USA . 100 parts In-Stock

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$39.664

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$38.870

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100

$39.664

$38.870

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Corphita

USA . 3,005 parts In-Stock

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$42.165

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$42.165

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Corohmni

South Africa . 1,066 parts In-Stock

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$63.670

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$63.670

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Advanced Electronics

New Zealand . 50 parts In-Stock

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$76.545

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$72.718

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$72.718

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$76.545

$72.718

$72.718

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Microchip USA

USA . 3,161 parts In-Stock

1+ parts

$83.100

100+ parts

$81.660

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$80.930

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$80.210

3,161

$83.100

$81.660

$80.930

$80.210

GreenTree Electronics

Israel . 8,017 parts In-Stock

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Lixinc

USA . 4,324 parts In-Stock

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UNI Independent Distributors

Spain . 4,212 parts In-Stock

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Perfect Parts

USA . 3,920 parts In-Stock

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Argo Parts USA

USA . 1,323 parts In-Stock

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Robosynatics

Brazil . 150 parts In-Stock

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$0.077

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$0.077

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$0.077

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$0.077

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Lucentia Tech

USA . 150 parts In-Stock

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$0.077

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$0.077

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$0.077

150

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$0.077

$0.077

$0.077

Overview

Experience the next level of performance with the MCIMX6U5DVM10ACR by NXP Semiconductors. This cutting-edge product is designed to meet your needs with top-tier quality and reliability. Whether you're in need of advanced processing power for industrial applications or innovative solutions for IoT devices, this versatile system-on-chip has got you covered. Unlock endless possibilities and elevate your projects with the MCIMX6U5DVM10ACR - the ultimate choice for seamless integration and superior performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and lightweight, making the product suitable for various applications.

Surface Mount: YES

Surface mount technology allows for efficient and compact PCB design, saving space and reducing assembly costs.

Maximum Supply Voltage: 1.5 V

Operates at a relatively low maximum supply voltage, suitable for low power applications.

Package Shape: SQUARE

Square shape facilitates easy and precise placement on the PCB, optimizing layout and space utilization.

No. of Terminals: 624

A high number of terminals provide greater connectivity and flexibility for interfacing with other components.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

This package style offers high density mounting with fine pitch, enabling compact and reliable integration.

Minimum Supply Voltage: 1.35 V

Ability to operate at a low minimum supply voltage enhances energy efficiency and extends battery life.

Maximum Operating Temperature: 95 °C

Wide operating temperature range ensures reliable performance in various environmental conditions.

Minimum Operating Temperature: 0 °C

Capable of operating at low temperatures, suitable for applications where temperature regulation is critical.

Terminal Finish: TIN SILVER COPPER

This finish provides good electrical conductivity and solderability for reliable connections.

Terminal Position: BOTTOM

Bottom terminal position simplifies PCB layout and facilitates heat dissipation.

Maximum Seated Height: 1.6 mm

Low profile design enables slim and compact device packaging, ideal for space-constrained applications.

Width: 21 mm

Compact width dimension allows for efficient space utilization on the PCB.

Maximum Time At Peak Reflow Temperature (s): 40

This spec ensures proper solder reflow during assembly, contributing to manufacturing reliability.

Peak Reflow Temperature °C: 260

High peak reflow temperature capability enables reliable soldering of the component to the PCB.

Length: 21 mm

Compact length dimension contributes to a space-saving overall design.

Peripheral IC Type: SYSTEM ON CHIP

Integration of multiple peripheral functions into a single chip simplifies system design and reduces component count.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, ideal for power-sensitive applications.

Terminal Form: BALL

Ball terminals enable reliable electrical connections and facilitate rework during assembly.

Nominal Supply Voltage: 1.4 V

Stable nominal supply voltage ensures consistent performance and compatibility with power sources.

Terminal Pitch: 0.8 mm

Fine terminal pitch allows for high-density mounting and enables efficient routing of signals.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates the component has moderate sensitivity to moisture, requiring standard handling procedures during storage and assembly.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MCIMX6U5DVM10ACR attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

S-PBGA-B624

JESD-609 Code:

e1

Length:

21 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

624

Maximum Operating Temperature:

95 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.6 mm

Maximum Supply Voltage:

1.5 V

Minimum Supply Voltage:

1.35 V

Nominal Supply Voltage:

1.4 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

21 mm

Peripheral IC Type:

Trade Compliance

MCIMX6U5DVM10ACR Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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