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XC7Z007S-1CLG225I

Xilinx

XC7Z007S-1CLG225I by Xilinx

XC7Z007S-1CLG225I by Xilinx is a System on Chip with CMOS technology. It operates b/w -40 to 100 °C and has a supply voltage range of 0.95V to 1.05V. With 225 terminals in a low profile grid array package, it's ideal for various embedded applications.

Median Price

$72.537

Lifecycle Status

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10

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1k+

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Newark

USA . 56 parts In-Stock

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Mouser Electronics

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Farnell

UK . 141 parts In-Stock

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Element14

Singapore . 141 parts In-Stock

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DigiKey

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Digiode

USA . 458 parts In-Stock

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VNN

France . 858 parts In-Stock

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Nova Conductors

Japan . 1,000 parts In-Stock

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AZTECH Wire

Italy . 356 parts In-Stock

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Aztec Data Supply Inc.

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Continental Prestige Electronics

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Vigor

Singapore . 305 parts In-Stock

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Ampacity Inc.

Singapore . 161 parts In-Stock

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Semicontronic

India . 155 parts In-Stock

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Corphita

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Corohmni

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Advanced Electronics

New Zealand . 750 parts In-Stock

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MARBEL Systems

Belgium . 27,519 parts In-Stock

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Texas Native Microelectronics

USA . 30 parts In-Stock

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Kenton Components

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Modulus Dynamics

Lithuania . 435 parts In-Stock

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Microchip USA

USA . 6,418 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

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Lixinc

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Argo Parts USA

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Supply Digital

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Netroflash

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GreenTree Electronics

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Qasali Group International

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Perfect Parts

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iodParts Technologies Inc.

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Overview

Unlock endless possibilities with the XC7Z007S-1CLG225I by Xilinx. As a leading manufacturer in the industry, Xilinx delivers exceptional quality and reliability with this versatile system on chip. From smart home devices to industrial automation, this product offers advanced functionality and seamless integration for a wide range of applications. Experience the value of cutting-edge technology and unleash the potential of your projects with the XC7Z007S-1CLG225I.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, suitable for various applications.

Surface Mount: YES

Being surface mountable allows for easier and more efficient PCB assembly.

Maximum Supply Voltage: 1.05 V

The high maximum supply voltage offers flexibility in power requirements.

Package Shape: SQUARE

The square package shape makes it easier to place and align on the PCB.

No. of Terminals: 225

The high number of terminals allows for more connections and functionality in a compact space.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The grid array style with low profile and fine pitch design contributes to space-saving and efficient PCB layout.

Minimum Supply Voltage: 0.95 V

The low minimum supply voltage ensures compatibility with a wide range of power sources.

Maximum Operating Temperature: 100 °C

The high maximum operating temperature ensures reliable performance even in challenging environments.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows for operation in extreme cold conditions.

Terminal Position: BOTTOM

The bottom terminal position simplifies PCB design and allows for efficient heat dissipation.

Maximum Seated Height: 1.5 mm

The low maximum seated height enables a slim and compact overall system design.

Width: 13 mm

The compact width contributes to space-saving on the PCB.

Length: 13 mm

The compact length ensures a smaller footprint on the PCB.

Peripheral IC Type: SYSTEM ON CHIP

The integration of various peripheral functions into a single system on chip simplifies design complexity and reduces component count.

Technology: CMOS

The CMOS technology offers low power consumption and high noise immunity, ideal for energy-efficient and reliable operation.

Terminal Form: BALL

The ball terminal form enables reliable connections and easy soldering for robust performance.

Nominal Supply Voltage: 1 V

The nominal supply voltage provides a standard reference for power requirements in the system.

Terminal Pitch: 0.8 mm

The narrow terminal pitch allows for high-density interconnections and compact layout on the PCB.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs XC7Z007S-1CLG225I attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Xilinx

Specs

JESD-30 Code:

S-PBGA-B225

Length:

13 mm

No. of Terminals:

225

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA225,15X15,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Maximum Seated Height:

1.5 mm

Maximum Supply Voltage:

1.05 V

Minimum Supply Voltage:

.95 V

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

13 mm

Peripheral IC Type:

Trade Compliance

XC7Z007S-1CLG225I Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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