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ATWINC1500-MR210PB1172

Microchip Technology

ATWINC1500-MR210PB1172 by Microchip Technology

ATWINC1500-MR210PB1172 by Microchip operates at 2.7-3.6V, with temp range -40 to 85°C. Its MICROELECTRONIC ASSEMBLY style has 28 terminals and CMOS tech for INDUSTRIAL applications in MICROPROCESSOR CIRCUITS.

Median Price

$8.266

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

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Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

RS (Exports)

UK . 45 parts In-Stock

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$7.682

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DigiKey

USA . 150 parts In-Stock

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$8.850

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Nova Conductors

Japan . 400 parts In-Stock

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$8.813

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Vyrian

USA . 8,964 parts In-Stock

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VNN

France . 2,781 parts In-Stock

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Ampacity Inc.

Singapore . 98 parts In-Stock

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$6.530

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Semicontronic

India . 70 parts In-Stock

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$6.530

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$6.367

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$6.334

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Continental Prestige Electronics

USA . 6,578 parts In-Stock

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$8.813

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$8.637

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Netroflash

USA . 100 parts In-Stock

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$8.813

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AZTECH Wire

Italy . 697 parts In-Stock

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$12.831

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Component Stockers USA

USA . 46 parts In-Stock

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$21.510

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Aztec Data Supply Inc.

USA . 726 parts In-Stock

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Corohmni

South Africa . 1,105 parts In-Stock

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RGB Technical Solutions

Ukraine . 6,966 parts In-Stock

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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Lixinc

USA . 4,615 parts In-Stock

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Argo Parts USA

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Perfect Parts

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Overview

Boost your projects with the ATWINC1500-MR210PB1172 by Microchip Technology, a cutting-edge peripheral IC that offers unmatched quality and reliability. With its compact design and wide operating temperature range, this product is perfect for a variety of applications in the industrial sector. Experience seamless connectivity and superior performance without compromising on power efficiency. Trust in Microchip Technology's expertise to deliver innovative solutions that bring value to your designs. Upgrade your systems today with the ATWINC1500-MR210PB1172 and stay ahead in the game.

Feature Benefit Bullets

Surface Mount

This feature allows for easy and secure mounting onto circuit boards, making installation and assembly simple and efficient.

Maximum Supply Voltage

With a maximum voltage of 3.6 V, this product is versatile and can handle a wide range of power sources, providing flexibility in various applications.

Package Shape

The rectangular shape of the package offers compatibility with standard mounting layouts, ensuring easy integration into existing designs.

No. of Terminals

With 28 terminals, this product provides ample connections for interfacing with other components, allowing for complex circuitry and functionality.

Package Style

The microelectronic assembly package style offers compactness and space-saving benefits, ideal for applications with limited physical space.

Minimum Supply Voltage

The low minimum voltage requirement of 2.7 V ensures efficiency and power savings, making it suitable for battery-powered devices.

Maximum Operating Temperature

With a maximum operating temperature of 85°C, this product can withstand heat and operate reliably in tough industrial environments.

Minimum Operating Temperature

The product's minimum operating temperature of -40°C ensures durability and functionality even in extreme cold conditions.

Maximum Seated Height

The low seated height of 2.113 mm allows for a slim and compact design, making it suitable for applications with space constraints.

Width

The width of 14.73 mm provides a balance between compactness and ease of handling during installation and deployment.

Length

With a length of 21.72 mm, this product offers a good balance between compact size and sufficient space for components and connections.

Temperature Grade

The industrial temperature grade ensures reliability and performance in demanding industrial settings, making it a robust choice for harsh environments.

Peripheral IC Type

Being a microprocessor circuit, this product offers advanced processing capabilities, enabling complex functions and tasks to be performed efficiently.

Technology

The CMOS technology used in this product ensures low power consumption and high-speed operation, making it energy-efficient and fast.

Terminal Form

The no-lead terminal form simplifies assembly and reduces the risk of soldering errors, enhancing the overall reliability and quality of the product.

Nominal Supply Voltage

With a nominal supply voltage of 3.3 V, this product offers compatibility with standard power sources, ensuring easy integration into existing systems.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs ATWINC1500-MR210PB1172 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Microchip Technology

Specs

JESD-30 Code:

R-XXMA-N28

Length:

21.72 mm

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

Package Style (Meter):

MICROELECTRONIC ASSEMBLY

Maximum Seated Height:

2.113 mm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.7 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Position:

UNSPECIFIED

Width:

14.73 mm

Peripheral IC Type:

Trade Compliance

ATWINC1500-MR210PB1172 Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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