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XCZU7EG-1FFVC1156I

Xilinx

XCZU7EG-1FFVC1156I by Xilinx

XCZU7EG-1FFVC1156I by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 100 °C and has a supply voltage range of 0.825V to 0.876V. This GRID ARRAY package is ideal for industrial applications requiring high performance uPs/uCs.

Median Price

$3,723.715

Lifecycle Status

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4

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1k+

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Nova Conductors

Japan . 900 parts In-Stock

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Vyrian

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Digiode

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Ampacity Inc.

Singapore . 201 parts In-Stock

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$6.000

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AZTECH Wire

Italy . 347 parts In-Stock

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One Stop Electronics

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Semicontronic

India . 1,516 parts In-Stock

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$30.070

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MARBEL Systems

Belgium . 5,814 parts In-Stock

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Texas Native Microelectronics

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Kenton Components

USA . 3,582 parts In-Stock

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Corohmni

South Africa . 81 parts In-Stock

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Modulus Dynamics

Lithuania . 542 parts In-Stock

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Qasali Group International

UK . 28,757 parts In-Stock

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Continental Prestige Electronics

USA . 5,735 parts In-Stock

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Argo Parts USA

USA . 1,855 parts In-Stock

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$3,686.478

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$3,649.241

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$3,612.004

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$3,612.004

Supply Digital

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Corphita

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Vigor

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Overview

Unleash the power of innovation with the XCZU7EG-1FFVC1156I by Xilinx, a cutting-edge microprocessor circuit that sets the standard for excellence in the industry. Xilinx's reputation for quality and reliability shines through in this versatile product, perfect for a wide range of applications. From enhancing performance in computing systems to revolutionizing data processing, this device offers unmatched value and benefits to customers seeking top-notch solutions. Experience the advantages of Xilinx technology and take your projects to the next level with the XCZU7EG-1FFVC1156I.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this product lightweight and durable, ideal for various applications.

Surface Mount: YES

With surface mount capability, this product can easily be integrated onto printed circuit boards for compact and space-saving designs.

Maximum Supply Voltage: 0.876 V

The high maximum supply voltage allows for reliable and stable performance in demanding electrical systems.

Package Shape: RECTANGULAR

The rectangular package shape provides a standardized form factor for easy installation and compatibility with existing designs.

No. of Terminals: 1156

With a large number of terminals, this product offers versatile connectivity options for complex circuit configurations.

Package Style (Meter): GRID ARRAY

The grid array package style ensures efficient heat dissipation and reliable electrical connections for optimal performance.

Minimum Supply Voltage: 0.825 V

The low minimum supply voltage enables energy-efficient operation and compatibility with a wide range of power sources.

Maximum Operating Temperature: 100 °C

The high maximum operating temperature allows for reliable performance in harsh environmental conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures reliable functionality even in extreme cold environments.

Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)

The use of high-quality terminal finishes ensures excellent conductivity and reliability in electrical connections.

Terminal Position: BOTTOM

The bottom terminal position facilitates easy installation and maintenance of the product in various electronic devices.

Maximum Time At Peak Reflow Temperature (s): 30

The short maximum time at peak reflow temperature ensures quick and efficient soldering processes for fast production.

Peak Reflow Temperature °C: 245

The high peak reflow temperature allows for secure and durable solder joints in the assembly process.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable performance in demanding industrial applications with varying temperature conditions.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

The integration of a microprocessor circuit enhances the functionality and capabilities of the product for advanced electronic systems.

Technology: CMOS

The CMOS technology used in this product ensures low power consumption and high-speed operation, making it an efficient choice for various applications.

Terminal Form: BALL

The ball terminal form provides secure and reliable connections for stable and uninterrupted electrical signals.

Nominal Supply Voltage: 0.85 V

The nominal supply voltage offers a balanced level of power for efficient and stable operation of the product.

Moisture Sensitivity Level (MSL): 4

The moisture sensitivity level of 4 indicates that this product can withstand moderate exposure to moisture without compromising performance.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs XCZU7EG-1FFVC1156I attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Xilinx

Specs

JESD-30 Code:

R-PBGA-B1156

JESD-609 Code:

e1

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

245

Maximum Supply Voltage:

.876 V

Minimum Supply Voltage:

.825 V

Nominal Supply Voltage:

.85 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Peripheral IC Type:

Trade Compliance

XCZU7EG-1FFVC1156I Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A002.A.4

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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