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MCIMX286CVM4BR2

NXP Semiconductors

MCIMX286CVM4BR2 by NXP Semiconductors

MCIMX286CVM4BR2 by NXP Semiconductors is a System on Chip with 289 terminals, operating at -40 to 85°C. It has a supply voltage range of 1.35-1.55V and uses CMOS technology. This low-profile, fine-pitch IC is ideal for industrial applications requiring high performance in a compact form factor.

Median Price

$15.676

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

MCIMX286CVM4BR2 by NXP Semiconductors
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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$15.676

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50

$15.676

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Vyrian

USA . 1,179 parts In-Stock

1+ parts

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1,179

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Anansix

USA . 872 parts In-Stock

1+ parts

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872

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Digiode

USA . 491 parts In-Stock

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491

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Distributors (Availability)

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AZTECH Wire

Italy . 728 parts In-Stock

1+ parts

$8.194

100+ parts

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728

$8.194

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Semicontronic

India . 826 parts In-Stock

1+ parts

$11.000

100+ parts

$10.725

1k+ parts

$10.670

10k+ parts

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826

$11.000

$10.725

$10.670

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Netroflash

USA . 1,000 parts In-Stock

1+ parts

$15.676

100+ parts

$15.363

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1,000

$15.676

$15.363

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Continental Prestige Electronics

USA . 409 parts In-Stock

1+ parts

$15.676

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$15.363

409

$15.676

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$15.363

Ampacity Inc.

Singapore . 879 parts In-Stock

1+ parts

$27.000

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879

$27.000

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One Stop Electronics

USA . 1,650 parts In-Stock

1+ parts

$28.000

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1,650

$28.000

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Advanced Electronics

New Zealand . 96 parts In-Stock

1+ parts

$37.605

100+ parts

$34.221

1k+ parts

$30.836

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96

$37.605

$34.221

$30.836

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Microchip USA

USA . 2,614 parts In-Stock

1+ parts

$48.183

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2,614

$48.183

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Corohmni

South Africa . 2,443 parts In-Stock

1+ parts

$49.105

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2,443

$49.105

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Aztec Data Supply Inc.

USA . 998 parts In-Stock

1+ parts

$78.328

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998

$78.328

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Argo Parts USA

USA . 4,021 parts In-Stock

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4,021

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UNI Independent Distributors

Spain . 3,915 parts In-Stock

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Corphita

USA . 835 parts In-Stock

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835

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Overview

Unlock the potential of your electronic devices with the MCIMX286CVM4BR2 by NXP Semiconductors. As a leader in semiconductor manufacturing, NXP guarantees top-notch quality and reliability. This innovative product falls under the category of Other Function uPs,uCs & Peripheral ICs, making it versatile for a wide range of applications. Experience the seamless integration, superior performance, and energy efficiency that this product offers. Upgrade your technology with NXP Semiconductors and see the difference for yourself!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, making the product resistant to external elements.

Surface Mount: YES

Allows for easy and secure installation on circuit boards, saving valuable space and reducing assembly time.

Maximum Supply Voltage: 1.55 V

Supports a wide range of supply voltage options, ensuring compatibility with various power sources.

Package Shape: SQUARE

A compact and symmetrical design that facilitates efficient placement and routing on circuit boards.

Power Supplies (V): 1.4,1.8

Offers flexibility in power supply options, allowing for customization based on specific requirements.

No. of Terminals: 289

Provides a high level of connectivity for interfacing with other components, enhancing the product's functionality.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

Enables a compact and efficient layout, optimizing space utilization and enhancing overall system performance.

Minimum Supply Voltage: 1.35 V

Ensures reliable operation even under low voltage conditions, enhancing the product's versatility and robustness.

Maximum Operating Temperature: 85 °C

Allows for operation in a wide range of temperatures, making the product suitable for various environments and applications.

Minimum Operating Temperature: -40 °C

Ensures reliable performance even in extreme cold conditions, enhancing the product's durability and reliability.

Terminal Finish: TIN SILVER COPPER

Provides excellent conductivity and corrosion resistance, ensuring long-term reliability and performance.

Terminal Position: BOTTOM

Facilitates easy installation and maintenance, simplifying the integration process and reducing overall cost.

Maximum Seated Height: 1.37 mm

A low profile design that saves space and allows for compact system designs, enhancing overall product efficiency.

Width: 14 mm

Optimal width dimension for compatibility with standard circuit board layouts, ensuring easy integration into existing systems.

Maximum Time At Peak Reflow Temperature (s): 40

Ensures proper soldering and reflow process, enhancing the product's reliability and long-term performance.

Peak Reflow Temperature °C: 260

Supports high-temperature soldering processes, ensuring strong and reliable connections for the product.

Length: 14 mm

Optimal length dimension for compatibility with standard circuit board layouts, ensuring easy integration into existing systems.

Temperature Grade: INDUSTRIAL

Designed to meet industrial-grade standards, ensuring reliable performance in harsh operating conditions.

Peripheral IC Type: SYSTEM ON CHIP

Combines multiple functions into a single integrated circuit, reducing component count and improving system efficiency.

Technology: CMOS

Utilizes low power consumption and high noise immunity, enhancing the product's efficiency and reliability.

Terminal Form: BALL

Provides reliable and secure connections, ensuring long-term performance and stability of the product.

Nominal Supply Voltage: 1.45 V

Optimal supply voltage for efficient and stable operation, maximizing the product's performance and longevity.

Terminal Pitch: 0.8 mm

Provides a fine pitch for high-density connections, allowing for compact design and efficient use of space.

Moisture Sensitivity Level (MSL): 3

Designed to withstand moderate moisture exposure, ensuring long-term reliability in various environmental conditions.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MCIMX286CVM4BR2 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from NXP Semiconductors

Specs

Additional Features:

IT HAS ANALOG CORE SUPPLY VOLTAGE OF 1.62 TO 2.1 V

JESD-30 Code:

S-PBGA-B289

JESD-609 Code:

e1

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

289

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA289,17X17,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.4,1.8

Qualification:

Not Qualified

Maximum Seated Height:

1.37 mm

Sub-Category:

Microprocessors

Maximum Supply Voltage:

1.55 V

Minimum Supply Voltage:

1.35 V

Nominal Supply Voltage:

1.45 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

14 mm

Peripheral IC Type:

Trade Compliance

MCIMX286CVM4BR2 Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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