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MFRC52201HN1,115

NXP Semiconductors

MFRC52201HN1,115 by NXP Semiconductors

The NXP Semiconductors MFRC52201HN1,115 is a microprocessor circuit with 32 terminals in a square chip carrier package. It operates at temperatures ranging from -25 to 85°C and requires a power supply of 3/3.3V. This IC is commonly used in applications requiring contactless communication and RFID technology.

Median Price

$7.185

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 1,378 parts In-Stock

1+ parts

$7.185

100+ parts

$5.383

1k+ parts

$4.682

10k+ parts

-

1,378

$7.185

$5.383

$4.682

-

Newark

USA . 43 parts In-Stock

1+ parts

$10.070

100+ parts

$6.260

1k+ parts

$5.150

10k+ parts

-

43

$10.070

$6.260

$5.150

-

Mouser Electronics

USA . 145 parts In-Stock

1+ parts

$10.280

100+ parts

$6.390

1k+ parts

$4.800

10k+ parts

$4.760

145

$10.280

$6.390

$4.800

$4.760

Verical

USA . 9,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$4.922

9,000

-

-

-

$4.922

Element14

Singapore . 1,378 parts In-Stock

1+ parts

-

100+ parts

$5.498

1k+ parts

$4.791

10k+ parts

-

1,378

-

$5.498

$4.791

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 500 parts In-Stock

1+ parts

$4.767

100+ parts

-

1k+ parts

-

10k+ parts

-

500

$4.767

-

-

-

Digiode

USA . 4,152 parts In-Stock

1+ parts

$6.555

100+ parts

-

1k+ parts

-

10k+ parts

-

4,152

$6.555

-

-

-

Maritex

Poland . 1,500 parts In-Stock

1+ parts

$6.633

100+ parts

$4.853

1k+ parts

-

10k+ parts

-

1,500

$6.633

$4.853

-

-

Anansix

USA . 1,830 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,830

-

-

-

-

Vyrian

USA . 1,229 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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1,229

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Argo Parts USA

USA . 4,855 parts In-Stock

1+ parts

$4.400

100+ parts

-

1k+ parts

-

10k+ parts

-

4,855

$4.400

-

-

-

Ampacity Inc.

Singapore . 981 parts In-Stock

1+ parts

$4.670

100+ parts

-

1k+ parts

-

10k+ parts

-

981

$4.670

-

-

-

Semicontronic

India . 702 parts In-Stock

1+ parts

$4.670

100+ parts

$4.553

1k+ parts

$4.530

10k+ parts

-

702

$4.670

$4.553

$4.530

-

Netroflash

USA . 500 parts In-Stock

1+ parts

$4.767

100+ parts

-

1k+ parts

-

10k+ parts

-

500

$4.767

-

-

-

Corphita

USA . 2,537 parts In-Stock

1+ parts

$6.210

100+ parts

-

1k+ parts

-

10k+ parts

-

2,537

$6.210

-

-

-

Aztec Data Supply Inc.

USA . 3,646 parts In-Stock

1+ parts

$50.290

100+ parts

-

1k+ parts

-

10k+ parts

-

3,646

$50.290

-

-

-

Corohmni

South Africa . 803 parts In-Stock

1+ parts

$65.647

100+ parts

-

1k+ parts

-

10k+ parts

-

803

$65.647

-

-

-

Advanced Electronics

New Zealand . 900 parts In-Stock

1+ parts

$72.096

100+ parts

$68.491

1k+ parts

$68.491

10k+ parts

-

900

$72.096

$68.491

$68.491

-

Lixinc

USA . 15,606 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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15,606

-

-

-

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Perfect Parts

USA . 6,720 parts In-Stock

1+ parts

-

100+ parts

-

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10k+ parts

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6,720

-

-

-

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Epart123

USA . 6,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$4.200

10k+ parts

$4.200

6,000

-

-

$4.200

$4.200

UNI Independent Distributors

Spain . 5,668 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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5,668

-

-

-

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Continental Prestige Electronics

USA . 1,844 parts In-Stock

1+ parts

-

100+ parts

$3.880

1k+ parts

-

10k+ parts

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1,844

-

$3.880

-

-

Robosynatics

Brazil . 500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

500

-

-

-

-

Lucentia Tech

USA . 500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

500

-

-

-

-

Overview

Discover the cutting-edge technology of the MFRC52201HN1,115 by NXP Semiconductors. This innovative product belongs to the category of Other Function uPs,uCs & Peripheral ICs and offers unparalleled quality and reliability. With a package body material made of PLASTIC/EPOXY and surface mount capability, this chip carrier style device is a game-changer in the industry. Whether you are looking to enhance your microprocessor circuit or boost your peripheral IC performance, the MFRC52201HN1,115 is the ideal solution. Trust NXP Semiconductors for top-notch products that deliver exceptional value and benefits to customers worldwide.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, suitable for a variety of applications.

Surface Mount: YES

Surface mount technology makes it easier to integrate the product into electronic circuits, saving space and improving overall design efficiency.

Package Shape: SQUARE

The square package shape allows for easier placement on circuit boards and provides a more uniform distribution of components.

Power Supplies (V): 3/3.3

The availability of both 3V and 3.3V power supplies ensures compatibility with a wide range of systems and applications.

No. of Terminals: 32

The high number of terminals allows for more connectivity options and flexibility in designing and implementing electronic circuits.

Package Style (Meter): CHIP CARRIER

The chip carrier package style is compact and provides excellent thermal performance, ensuring stable operation of the product.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature makes the product suitable for use in harsh environments and ensures reliable performance under varying conditions.

Minimum Operating Temperature: -25 °C

The low minimum operating temperature allows the product to function effectively in cold conditions, making it versatile for use in various environments.

Terminal Position: QUAD

The quad terminal position offers improved stability and connectivity, enhancing the overall performance of the product.

Peak Reflow Temperature °C: 260

The high peak reflow temperature ensures proper soldering and assembly of the product, leading to a reliable and durable end result.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Being a microprocessor circuit, the product offers advanced processing capabilities and functionality, making it ideal for complex electronic systems.

Terminal Form: NO LEAD

The no-lead terminal form simplifies the integration of the product into electronic assemblies, reducing assembly time and potential errors.

Maximum Supply Current: 100 mA

The maximum supply current of 100 mA ensures efficient power consumption and helps prevent overload, enhancing the overall reliability of the product.

Terminal Pitch: 0.5 mm

The small terminal pitch of 0.5 mm allows for precise and compact circuit designs, optimizing the use of available space on the circuit board.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MFRC52201HN1,115 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

S-PQCC-N32

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-25 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/3.3

Qualification:

Not Qualified

Sub-Category:

Other Microprocessor ICs

Maximum Supply Current:

100 mA

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Peripheral IC Type:

Trade Compliance

MFRC52201HN1,115 Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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