Loading...

MFRC52301HN1,157

NXP Semiconductors

MFRC52301HN1,157 by NXP Semiconductors

MFRC52301HN1,157 by NXP Semiconductors is a microprocessor circuit in a square chip carrier package. It operates at 3/3.3V with a max temp of 85 °C and features 32 terminals. Ideal for RFID applications, it supports surface mount technology for compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 12,365 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

12,365

-

-

-

-

Digiode

USA . 3,597 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,597

-

-

-

-

Anansix

USA . 2,538 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,538

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 550 parts In-Stock

1+ parts

$10.360

100+ parts

-

1k+ parts

-

10k+ parts

-

550

$10.360

-

-

-

One Stop Electronics

USA . 1,423 parts In-Stock

1+ parts

$27.000

100+ parts

-

1k+ parts

-

10k+ parts

-

1,423

$27.000

-

-

-

Corohmni

South Africa . 422 parts In-Stock

1+ parts

$73.269

100+ parts

-

1k+ parts

-

10k+ parts

-

422

$73.269

-

-

-

UNI Independent Distributors

Spain . 8,092 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,092

-

-

-

-

Corphita

USA . 2,245 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,245

-

-

-

-

Overview

Unlock seamless connectivity and innovation with the MFRC52301HN1,157 from NXP Semiconductors. Renowned for their cutting-edge technology and reliability, NXP delivers a versatile microprocessor circuit that excels in various applications, from smart cards to RFID systems. Experience superior performance, efficient power management, and robust temperature resilience—all designed to enhance your projects and drive success. Transform possibilities into realities with NXP's trusted solutions!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy materials ensures durability and reliability, making it suitable for various environmental conditions.

Surface Mount: YES

Surface mount technology allows for compact designs and easier integration into high-density circuit boards.

Package Shape: SQUARE

The square shape optimizes space on the PCB, allowing for more components in a given area.

Power Supplies (V): 3/3.3

Compatible with low power supply voltages, making it energy efficient and useful for battery-operated devices.

No. of Terminals: 32

With 32 terminals, this product offers ample connection points for interfacing with other components, enhancing versatility.

Package Style (Meter): CHIP CARRIER

Chip carrier packaging provides reliable electrical connections and aids in heat dissipation.

Maximum Operating Temperature: 85 °C

A high maximum operating temperature ensures reliability in warmer environments, making it suitable for industrial applications.

Minimum Operating Temperature: -25 °C

The low minimum operating temperature allows the product to function in colder climates, expanding its application range.

Terminal Finish: NICKEL PALLADIUM GOLD

The premium terminal finish enhances solderability and protects against corrosion, ensuring longevity and performance.

Terminal Position: QUAD

The quad terminal position supports a wide variety of circuit layouts, facilitating easier integration into different designs.

Maximum Time At Peak Reflow Temperature (s): 30

The relatively short peak reflow time ensures minimal thermal stress on the component, preserving its reliability during manufacturing.

Peak Reflow Temperature °C: 260

A peak reflow temperature of 260 °C enables compatibility with modern soldering techniques, thus optimizing the assembly process.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

As a microprocessor circuit, it provides robust processing capabilities for various computing applications.

Terminal Form: NO LEAD

No lead terminals contribute to a lower profile, allowing for greater design flexibility and improved performance in space-constrained applications.

Maximum Supply Current: 10 mA

A maximum supply current of 10 mA indicates low power consumption, contributing to energy efficiency in various applications.

Terminal Pitch: 0.5 mm

The small terminal pitch helps achieve designs with higher density, making it ideal for compact electronic devices.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MFRC52301HN1,157 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

S-PQCC-N32

JESD-609 Code:

e4

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-25 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/3.3

Qualification:

Not Qualified

Sub-Category:

Other Microprocessor ICs

Maximum Supply Current:

10 mA

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Peripheral IC Type:

Trade Compliance

MFRC52301HN1,157 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 16