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MFRC53101T/0FE,118

NXP Semiconductors

MFRC53101T/0FE,118 by NXP Semiconductors

NXP Semiconductors' MFRC53101T/0FE,118 is a MICROPROCESSOR CIRCUIT with 32 terminals in a SMALL OUTLINE package. It operates at -25 to 85 °C and requires 3.3/5,5 V power supply. Ideal for applications requiring high-performance peripheral ICs in compact designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 4,927 parts In-Stock

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Vyrian

USA . 1,160 parts In-Stock

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Anansix

USA . 310 parts In-Stock

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310

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Nova Conductors

Japan . 98 parts In-Stock

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AZTECH Wire

Italy . 502 parts In-Stock

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$6.997

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One Stop Electronics

USA . 312 parts In-Stock

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$22.000

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312

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Corohmni

South Africa . 118 parts In-Stock

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$27.280

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$27.280

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Ampacity Inc.

Singapore . 928 parts In-Stock

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$29.000

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Aztec Data Supply Inc.

USA . 124 parts In-Stock

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$71.320

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GreenTree Electronics

Israel . 7,000 parts In-Stock

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Continental Prestige Electronics

USA . 6,111 parts In-Stock

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Corphita

USA . 3,794 parts In-Stock

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UNI Independent Distributors

Spain . 3,213 parts In-Stock

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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Argo Parts USA

USA . 2,614 parts In-Stock

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Aranea Global

USA . 1,000 parts In-Stock

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Overview

Discover the innovative MFRC53101T/0FE,118 by NXP Semiconductors, a cutting-edge solution in the category of Other Function uPs, uCs & Peripheral ICs. With a durable plastic body and surface mount capability, this product offers superior performance with power supplies ranging from 3.3V to 5.5V. Ideal for various applications, this small outline package features 32 terminals and a maximum operating temperature of 85°C, ensuring reliable operation in any environment. Experience the value and benefits of this advanced peripheral IC, designed to exceed your expectations and elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and reliable material for the package body ensures longevity of the product.

Surface Mount: YES

Allows for easy installation and space-saving on PCBs.

Power Supplies (V): 3.3/5,5

Supports a range of power supplies, making it versatile for different applications.

No. of Terminals: 32

Sufficient number of terminals for connecting various components.

Maximum Operating Temperature: 85 °C

Can operate reliably at high temperatures without risk of damage.

Minimum Operating Temperature: -25 °C

Can operate in cold temperatures without performance issues.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Advanced microprocessor circuit for efficient performance.

Maximum Supply Current: 150 mA

Supports a maximum supply current for reliable operation.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MFRC53101T/0FE,118 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PDSO-G32

JESD-609 Code:

e4

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-25 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP32,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

250

Power Supplies (V):

3.3/5,5

Qualification:

Not Qualified

Sub-Category:

Other Microprocessor ICs

Maximum Supply Current:

150 mA

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Peripheral IC Type:

Trade Compliance

MFRC53101T/0FE,118 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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