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MFRC52301HN1,151

NXP Semiconductors

MFRC52301HN1,151 by NXP Semiconductors

MFRC52301HN1,151 by NXP Semiconductors is a microprocessor circuit in a square chip carrier package. It operates at 3/3.3V with a max temp of 85 °C and features 32 terminals. Ideal for RFID applications, it supports surface mount technology for compact designs.

Median Price

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Verical

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Vyrian

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SIE Connect GmbH - GreenChips

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Rebound Electronics

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AZTECH Wire

Italy . 182 parts In-Stock

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Semicontronic

India . 4,442 parts In-Stock

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Corohmni

South Africa . 745 parts In-Stock

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GreenTree Electronics

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Overview

Unlock seamless connectivity and innovation with the MFRC52301HN1,151 from NXP Semiconductors. Renowned for their quality and reliability, NXP ensures this versatile microprocessor enhances your applications across various industries, from smart cards to IoT devices. With superior performance in extreme temperatures and a compact design, this product not only boosts efficiency but also provides exceptional value, empowering you to stay ahead in a competitive market.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures a lightweight and durable design, ideal for various applications.

Surface Mount: YES

Surface mount technology allows for a smaller footprint on PCBs, facilitating compact designs in modern electronics.

Package Shape: SQUARE

A square shape can enhance layout options on the PCB, providing flexibility during circuit design.

Power Supplies (V): 3/3.3

Operating at low voltage enhances power efficiency, making this product suitable for battery-powered applications.

No. of Terminals: 32

With 32 terminals, this microprocessor offers ample connectivity options, allowing for versatile integration into various systems.

Package Style (Meter): CHIP CARRIER

The chip carrier package style supports better thermal management and facilitates easy mounting on PCBs.

Maximum Operating Temperature: 85 °C

The ability to operate at high temperatures makes this product suitable for demanding environments.

Minimum Operating Temperature: -25 °C

This wide temperature range allows operation in various conditions, making it versatile for outdoor or industrial applications.

Terminal Finish: NICKEL PALLADIUM GOLD

This high-quality terminal finish ensures excellent conductivity and corrosion resistance, enhancing the product's reliability.

Terminal Position: QUAD

Quad terminal positioning aids in robust connection stability, minimizing the risk of failure in applications.

Maximum Time At Peak Reflow Temperature: 30s

A quick peak reflow time allows for efficient soldering processes, minimizing potential thermal damage to the microprocessor.

Peak Reflow Temperature: 260 °C

Being compatible with high peak temperatures ensures reliable soldering without compromising the integrity of the component.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

As a peripheral microprocessor circuit, it offers the processing power necessary for a wide range of functions in embedded systems.

Terminal Form: NO LEAD

No-lead terminals simplify assembly and reduce the material footprint, promoting more environmentally friendly production.

Maximum Supply Current: 10 mA

Low supply current contributes to overall energy efficiency, making it suitable for power-sensitive applications.

Terminal Pitch: 0.5 mm

A 0.5 mm terminal pitch is ideal for high-density circuit layouts, allowing for compact PCB designs without sacrificing performance.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MFRC52301HN1,151 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

S-PQCC-N32

JESD-609 Code:

e4

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-25 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/3.3

Qualification:

Not Qualified

Sub-Category:

Other Microprocessor ICs

Maximum Supply Current:

10 mA

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Peripheral IC Type:

Trade Compliance

MFRC52301HN1,151 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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