Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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MPFS250T-FCG1152E by Microchip: Programmable SoC with 1152 terminals, CMOS tech, 1V nominal supply. Square GRID ARRAY package for surface mount applications. Operates b/w 0-100°C, ideal for various uP & uC functions.
Median Price
$394.490
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3
In-Stock Inventory
1k+
DigiKey
1+ parts
100+ parts
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1k+ parts
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Nova Conductors
$439.139
Vyrian
AZTECH Wire
$5.664
Ampacity Inc.
$372.590
Argo Parts USA
$434.747
$430.356
$425.965
Continental Prestige Electronics
Netroflash
Microchip USA
$713.880
LOOK Integrated Logistics
NIA Electronics
Ledger Components
Montano Global Distributors
LMD Electronica
Provides durability and protection for the internal components of the IC, making it suitable for various applications.
Allows for easy and efficient mounting on circuit boards, saving space and simplifying assembly processes.
Supports a higher supply voltage range, offering flexibility in power requirements for the IC.
Square shape allows for optimal use of space on the circuit board, maximizing efficiency in layout design.
High number of terminals allows for a wide range of connectivity options, enabling complex functionalities in the IC.
Grid array package style provides better electrical performance and thermal properties, enhancing the overall reliability of the IC.
Low minimum supply voltage helps in reducing power consumption and improves energy efficiency of the IC.
High maximum operating temperature range ensures reliability and stability of the IC in various environmental conditions.
Low minimum operating temperature allows for usage in cold environments without affecting performance.
Bottom terminal position provides better soldering connections and ease of mounting on the PCB.
Low seated height allows for a compact design and integration in space-constrained applications.
Compact width makes the IC suitable for small form factor devices and applications where space is limited.
Equal length and width dimensions provide a square form factor, facilitating uniform layout design on the PCB.
Programmable System on Chip (SoC) allows for customization and flexibility in functionality, catering to diverse application requirements.
Complementary Metal-Oxide-Semiconductor (CMOS) technology offers low power consumption, high speed, and reliability for the IC.
Ball terminal form ensures better electrical connections and heat dissipation, enhancing the overall performance of the IC.
Stable nominal supply voltage ensures consistent and reliable operation of the IC in various operating conditions.
Narrow terminal pitch facilitates high-density mounting on the PCB, enabling more functionality in a smaller footprint.
Other Function uPs,uCs & Peripheral ICs MPFS250T-FCG1152E attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Microchip Technology
Additional Features:
JESD-30 Code:
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Peripheral IC Type:
MPFS250T-FCG1152E Peripheral ICs trade compliance attributes, and parameters.
HTS
8542.31.00.01
SB
8542.31.00.00
PCN Obsolescence/ EOL - Software 19/Apr/2023
PCN Design/Specification - MPFxxx/RTPF 10/May/2023 Software 19/Apr/2023
Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.
President and CEO
Ganesh Moorthy
Executive Chair
Steve Sanghi
CFO, Senior VP
J. Eric Bjornholt
Fab 5 - Colorado
Fabrication
Fab Initiation
1995
USA
Colorado Springs
Wafer Capacity
70,000
Santa Clara
1990
1,290
Lawrence
1989
5,000
Fab 4 - Gresham
1988
Gresham
50,000
Fab 2 - Tempe
1994
Tempe
30,000
Beverly
1985
2,000
Lowell
1986
15,000
Garden Grove
12,000
New Fab - Gresham
2024
LM555CN
National Semiconductor
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Surface Mount: NO;
SS14
Eic Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LL4148
Excel (Suzhou) Semiconductor
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
1554216004
Molex
WIRE AND CABLE;
BAT54C-7-F
Diodes Incorporated
BAT54C-7-F by Diodes Inc. is a Schottky rectifier diode with common cathode, 2 elements, and max forward voltage of 0.24V. Ideal for applications requiring fast reverse recovery time of 0.005 us, such as in small outline packages for surface mount technology at temperatures ranging from -65 to 150°C.
1N4148
Diotec Semiconductor Ag
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
BSS138
Vishay Semiconductors
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Package Style (Meter): SMALL OUTLINE; Package Shape: RECTANGULAR; Transistor Application: SWITCHING;
BAV99
Formosa Microsemi
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148WS
Dc Components
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
2N7002
Transys Electronics
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .35 W; Minimum DS Breakdown Voltage: 60 V; Maximum Operating Temperature: 150 Cel;
Hitano Enterprise
Philips Semiconductors
RECTIFIER DIODE; Surface Mount: YES; Maximum Output Current: .1 A; Peak Reflow Temperature (C): 260; Terminal Finish: MATTE TIN; Maximum Reverse Recovery Time: .006 us;
Weitron Technology
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .35 W; Terminal Finish: TIN LEAD; Maximum Operating Temperature: 150 Cel;
Synsemi
Daco Semiconductor
AB26TRB-32.768KHZ--T
Abracon
AB26TRB-32.768KHZ--T by Abracon is a crystal oscillator with 20 ppm frequency tolerance, 126% stability, and 35000 ohm series resistance. Ideal for applications requiring 0.032768 MHz nominal frequency in surface mount configurations.
SMBJ18CA
Lite-on Semiconductor
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
DS18B20
Dallas Semiconductor
TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL; Mounting Feature: SURFACE MOUNT; No. of Terminals: 3; Package Shape or Style: ROUND; Housing: PLASTIC; Output Interface Type: 1-WIRE INTERFACE;
BSS138BKW,115
Nexperia
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Terminal Finish: TIN; No. of Terminals: 3; Additional Features: LOGIC LEVEL COMPATIBLE;
2N7002,215
NXP Semiconductors
2N7002,215 by NXP Semiconductors is a small signal N-CHANNEL FET with a min DS breakdown voltage of 60V and max drain current of 0.3A. It is used for switching applications in enhancement mode, operates b/w -65 to 150 °C, and has a max power dissipation of 0.2W.
XC7Z010-1CLG225I
Xilinx
The Xilinx XC7Z010-1CLG225I is a low-profile, fine-pitch grid array IC with 225 terminals. Operating b/w -40 to 100°C, it features a CMOS technology and requires a supply voltage of 0.95V to 1.05V. Ideal for System on Chip applications due to its compact size and ball terminal form factor.
XCZU7EG-2FFVF1517I
XCZU7EG-2FFVF1517I by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 100 °C and has a supply voltage range of 0.825V to 0.876V. This GRID ARRAY package is ideal for industrial applications requiring high performance uPs/uCs.
MCIMX6X2AVN08AB
MCIMX6X2AVN08AB by NXP Semiconductors is a SYSTEM ON CHIP with CMOS technology. It operates b/w -40 to 125 °C, with supply voltage ranging from 1.275V to 1.5V. Ideal for automotive applications due to its low profile and fine pitch package style.
CY8C4025AZI-S413
Cypress Semiconductor
PROGRAMMABLE SoC; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 48; Package Code: LFQFP; Package Shape: SQUARE;
MCIMX6Q5EYM10AC
Freescale Semiconductor
SYSTEM ON CHIP; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 624; Package Code: LFBGA; Package Shape: SQUARE;
AX8052F143-3-TX30
Onsemi
AX8052F143-3-TX30 by Onsemi is a 40-terminal System on Chip with CMOS technology. It operates b/w -40 to 85°C, with supply voltage ranging from 1.8V to 3.6V. Ideal for industrial applications requiring a compact, low-profile chip carrier package style.
CY8C4247LQI-BL483
Infineon Technologies
CY8C4247LQI-BL483 by Infineon is a PROGRAMMABLE SoC with NICKEL PALLADIUM GOLD finish. It can withstand peak reflow temp of 260°C for 30s, suitable for INDUSTRIAL applications. MSL level of 3 makes it ideal for Other Function uPs,uCs & Peripheral ICs.
XC7Z007S-2CLG225I
XC7Z007S-2CLG225I by Xilinx is a System on Chip with CMOS technology. It operates b/w -40 to 100 °C and has a supply voltage range of 0.95V to 1.05V. With 225 terminals in a low profile grid array package, it's ideal for various uPs and uCs applications.
XC7Z012S-1CLG485C
The Xilinx XC7Z012S-1CLG485C is a System on Chip with CMOS technology. It operates b/w 0-85°C, with supply voltage range of 0.95-1.05V. Featuring 485 terminals in a low profile grid array package, it's ideal for various applications requiring high-performance processing capabilities.
XAZU2EG-L1SFVA625I
Xilinx XAZU2EG-L1SFVA625I is a MICROPROCESSOR CIRCUIT with CMOS technology. It features 625 terminals in a GRID ARRAY, FINE PITCH package style. Operating from -40 to 100 °C, it's ideal for industrial applications requiring low power consumption at 0.72 V supply voltage.
ESP32-WROOM-32UE-N8
Espressif Systems (Shanghai)
ESP32-WROOM-32UE-N8 by Espressif Systems is a SoC with 38 terminals, operating at 3.3V nominal voltage and 85°C max temp. Ideal for IoT applications due to its CMOS technology, compact size (19.2mm x 18mm), and surface mount capability.
NRF52811-QCAA-R7
Nordic Semiconductor Asa
NRF52811-QCAA-R7 by Nordic Semiconductor Asa is a 32-terminal microprocessor circuit with CMOS technology. It operates b/w -40 to 85 °C, with supply voltage range of 1.7V to 3.6V. Ideal for applications requiring low-profile, surface-mountable chips in compact devices.
XC7Z014S-2CLG484E
The Xilinx XC7Z014S-2CLG484E is a System on Chip with CMOS technology. It operates b/w 0-100°C, with supply voltage range of 0.95-1.05V. This low profile chip in a grid array package is ideal for various applications requiring high performance and integration capabilities.
XC7Z015-2CLG485I
Xilinx XC7Z015-2CLG485I is a CMOS System on Chip with 485 terminals in a low profile grid array package. Operating b/w -40 to 100 °C, it has a supply voltage range of 0.95V to 1.05V. Ideal for applications requiring high-performance computing in compact spaces.
5CSEBA5U23I7N
Intel
SoC;
MIMX8MN1CVTIZAA
SYSTEM ON CHIP; JESD-609 Code: e2; Terminal Finish: TIN SILVER; Maximum Time At Peak Reflow Temperature (s): 40; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 260;
CY8C21434-24LTXIT
CY8C21434-24LTXIT by Infineon Technologies is a 32-terminal, square-shaped chip carrier with a max supply voltage of 5.25V and operating temperature range from -40 to 85°C. This programmable SoC features CMOS technology, no-lead terminal form, and is suitable for applications requiring very thin profile ICs in various industries.
MIMX8MQ5DVAJZAB
SoC; Moisture Sensitivity Level (MSL): 3; Maximum Time At Peak Reflow Temperature (s): 40; Peak Reflow Temperature (C): 260;
XC7Z010-L1CLG400I
XC7Z010-L1CLG400I by Xilinx is a 400-terminal System on Chip with CMOS technology. It operates b/w -40°C to 100°C, with supply voltage ranging from 0.95V to 1.05V. This low-profile, fine-pitch IC is ideal for applications requiring high-performance computing in compact spaces.
ESP32-S3-WROOM-1U-N16R2
ESP32-S3-WROOM-1U-N16R2 by Espressif Systems is a 41-terminal SoC with CMOS technology. It operates b/w -40 to 85°C, with supply voltage range of 3-3.6V. Ideal for IoT applications due to its compact size and surface mount capability.
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MPFS250TFCVG484I
Microchip Technology
SoC; Terminal Form: BALL; No. of Terminals: 484; Package Code: FBGA; Package Shape: SQUARE; Minimum Operating Temperature: -40 Cel;
MPFS250T-FCSG536I
PROGRAMMABLE SoC; Terminal Form: BALL; No. of Terminals: 536; Package Code: LFBGA; Package Shape: SQUARE; Maximum Supply Voltage: 1.03 V;
MPFS250T-1FCVG484E
SoC; Terminal Form: BALL; No. of Terminals: 484; Package Code: FBGA; Package Shape: SQUARE; Maximum Supply Voltage: 1.03 V;
MPFS250T-FCG1152I
MPFS250T-FCG1152I by Microchip Tech is a 1152-terminal programmable SoC with CMOS tech. Operates b/w -40 to 100 °C, with supply voltage range of 0.97V to 1.03V. Ideal for applications requiring high-density integration in compact spaces.
MPFS250TS-1FCVG484I
SoC; Terminal Form: BALL; No. of Terminals: 484; Package Code: FBGA; Package Shape: SQUARE; Minimum Supply Voltage: .97 V;
MPFS250T-1FCSG536E
PROGRAMMABLE SoC; Terminal Form: BALL; No. of Terminals: 536; Package Code: LFBGA; Package Shape: SQUARE; Width: 16 mm;
MPFS250T-1FCG1152E
Microchip Technology's MPFS250T-1FCG1152E is a programmable SoC with CMOS technology. It operates b/w 0-100°C, with supply voltage range of 0.97-1.03V. This square GRID ARRAY package has 1152 terminals and is suitable for various Other Function uPs,uCs applications.
MPFS250T-1FCG1152I
PROGRAMMABLE SoC; Terminal Form: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE; Package Equivalence Code: BGA1152,34X34,40;
MPFS250TS-FCG1152I
MPFS250TS-FCG1152I by Microchip Technology is a programmable SoC with a package style of grid array and 1152 terminals. It operates at a voltage range of 0.97V to 1.03V and has a max seated height of 2.99mm. This IC is commonly used in applications requiring other function uPs, uCs, and peripheral devices.
MPFS250T-1FCSG536I
PROGRAMMABLE SoC; Terminal Form: BALL; No. of Terminals: 536; Package Code: LFBGA; Package Shape: SQUARE; Terminal Pitch: .5 mm;
MPFS250T-1FCVG784I
PROGRAMMABLE SoC; Terminal Form: BALL; No. of Terminals: 784; Package Code: FBGA; Package Shape: SQUARE; Technology: CMOS;
MPFS250TFCVG484E
MPFS250TFCVG484E by Microchip Tech features 484 terminals, operates b/w 0-100°C, and has a supply voltage range of 0.97-1.03V. This SoC peripheral IC in a grid array package is ideal for applications requiring fine pitch technology and CMOS design.
MPFS095TLS-FCSG325I
MPFS095TLS-FCSG325I by Microchip Tech is a 325-terminal IC with CMOS tech. Operates b/w -40 to 100°C, voltage range of 0.97-1.03V. Ideal for SoC programming applications due to its rectangular shape and bottom terminal position.
MPFS095TLS-FCVG484I
PROGRAMMABLE SoC; Terminal Form: BALL; No. of Terminals: 484; Package Code: FBGA; Package Shape: SQUARE; Package Equivalence Code: BGA484,22X22,32;
MPFS095T-1FCVG784I
PROGRAMMABLE SoC; Terminal Form: BALL; No. of Terminals: 784; Package Code: FBGA; Package Shape: SQUARE; Terminal Position: BOTTOM;
MPFS025T-1FCSG325E
PROGRAMMABLE SoC; Terminal Form: BALL; No. of Terminals: 325; Package Shape: RECTANGULAR; Surface Mount: YES; Terminal Position: BOTTOM;
MPFS025T-1FCVG484E
MPFS025T-1FCVG484E by Microchip Tech is a 484-terminal IC with CMOS tech. Operates b/w 0-100°C, voltage range of 0.97-1.03V. Ideal for applications requiring a programmable SoC in a compact 19x19mm grid array package.
MPFS025T-1FCVG484I
Microchip Technology's MPFS025T-1FCVG484I is a 484-terminal, programmable SoC with CMOS technology. It operates b/w -40 to 100 °C and has a supply voltage range of 0.97V to 1.03V. This square-shaped IC in grid array package is ideal for various applications requiring fine pitch surface mount technology.
MPFS025T-FCSG325E
PROGRAMMABLE SoC; Terminal Form: BALL; No. of Terminals: 325; Package Shape: RECTANGULAR; Surface Mount: YES; JESD-30 Code: R-PBGA-B325;
MPFS250TS-1FCG1152I
PROGRAMMABLE SoC; Terminal Form: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE; Surface Mount: YES;
Supply Digital Components
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