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MPFS250T-FCG1152E

Microchip Technology

MPFS250T-FCG1152E by Microchip Technology

MPFS250T-FCG1152E by Microchip: Programmable SoC with 1152 terminals, CMOS tech, 1V nominal supply. Square GRID ARRAY package for surface mount applications. Operates b/w 0-100°C, ideal for various uP & uC functions.

Median Price

$394.490

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 31 parts In-Stock

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$394.490

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31

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Distributors (In-Stock)

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NAC Semi

USA . 2 parts In-Stock

1+ parts

$338.130

100+ parts

$311.430

1k+ parts

$288.650

10k+ parts

-

2

$338.130

$311.430

$288.650

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Nova Conductors

Japan . 100 parts In-Stock

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$439.139

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100

$439.139

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Vyrian

USA . 7,051 parts In-Stock

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7,051

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Distributors (Availability)

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AZTECH Wire

Italy . 735 parts In-Stock

1+ parts

$5.664

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735

$5.664

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Ampacity Inc.

Singapore . 15 parts In-Stock

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$372.590

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15

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Argo Parts USA

USA . 3,969 parts In-Stock

1+ parts

$439.139

100+ parts

$434.747

1k+ parts

$430.356

10k+ parts

$425.965

3,969

$439.139

$434.747

$430.356

$425.965

Continental Prestige Electronics

USA . 3,224 parts In-Stock

1+ parts

$439.139

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$430.356

3,224

$439.139

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$430.356

Netroflash

USA . 2,000 parts In-Stock

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$439.139

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2,000

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Microchip USA

USA . 2,792 parts In-Stock

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$713.880

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2,792

$713.880

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LOOK Integrated Logistics

Peru . 6,387 parts In-Stock

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NIA Electronics

USA . 5,539 parts In-Stock

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Ledger Components

France . 5,539 parts In-Stock

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5,539

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Montano Global Distributors

Canada . 5,244 parts In-Stock

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LMD Electronica

Estonia . 3,958 parts In-Stock

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Overview

Discover the cutting-edge MPFS250T-FCG1152E by Microchip Technology, a top-tier manufacturer known for producing high-quality products. This versatile programmable SoC offers endless possibilities in various applications within the category of Other Function uPs,uCs & Peripheral ICs. With its advanced technology and innovative design, this product provides customers with unmatched value, benefits, and advantages. Elevate your projects to the next level with the MPFS250T-FCG1152E and experience excellence like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the IC, making it suitable for various applications.

Surface Mount: YES

Allows for easy and efficient mounting on circuit boards, saving space and simplifying assembly processes.

Maximum Supply Voltage: 1.03 V

Supports a higher supply voltage range, offering flexibility in power requirements for the IC.

Package Shape: SQUARE

Square shape allows for optimal use of space on the circuit board, maximizing efficiency in layout design.

No. of Terminals: 1152

High number of terminals allows for a wide range of connectivity options, enabling complex functionalities in the IC.

Package Style (Meter): GRID ARRAY

Grid array package style provides better electrical performance and thermal properties, enhancing the overall reliability of the IC.

Minimum Supply Voltage: 0.97 V

Low minimum supply voltage helps in reducing power consumption and improves energy efficiency of the IC.

Maximum Operating Temperature: 100 °C

High maximum operating temperature range ensures reliability and stability of the IC in various environmental conditions.

Minimum Operating Temperature: 0 °C

Low minimum operating temperature allows for usage in cold environments without affecting performance.

Terminal Position: BOTTOM

Bottom terminal position provides better soldering connections and ease of mounting on the PCB.

Maximum Seated Height: 2.99 mm

Low seated height allows for a compact design and integration in space-constrained applications.

Width: 35 mm

Compact width makes the IC suitable for small form factor devices and applications where space is limited.

Length: 35 mm

Equal length and width dimensions provide a square form factor, facilitating uniform layout design on the PCB.

Peripheral IC Type: PROGRAMMABLE SoC

Programmable System on Chip (SoC) allows for customization and flexibility in functionality, catering to diverse application requirements.

Technology: CMOS

Complementary Metal-Oxide-Semiconductor (CMOS) technology offers low power consumption, high speed, and reliability for the IC.

Terminal Form: BALL

Ball terminal form ensures better electrical connections and heat dissipation, enhancing the overall performance of the IC.

Nominal Supply Voltage: 1 V

Stable nominal supply voltage ensures consistent and reliable operation of the IC in various operating conditions.

Terminal Pitch: 1 mm

Narrow terminal pitch facilitates high-density mounting on the PCB, enabling more functionality in a smaller footprint.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MPFS250T-FCG1152E attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Microchip Technology

Specs

Additional Features:

ALSO OPERATES AT 1.05V NOMINAL SUPPLY

JESD-30 Code:

S-PBGA-B1152

Length:

35 mm

No. of Terminals:

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA1152,34X34,40

Package Shape:

Package Style (Meter):

GRID ARRAY

Maximum Seated Height:

2.99 mm

Maximum Supply Voltage:

1.03 V

Minimum Supply Voltage:

.97 V

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Width:

35 mm

Peripheral IC Type:

Trade Compliance

MPFS250T-FCG1152E Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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