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MPFS250T-1FCVG484E

Microchip Technology

MPFS250T-1FCVG484E by Microchip Technology

The Microchip Technology MPFS250T-1FCVG484E is a SoC peripheral IC with CMOS technology. It operates b/w 0°C to 100°C, with a supply voltage range of 0.97V to 1.03V. This grid array IC, measuring 19mm x 19mm, is ideal for applications requiring fine pitch and surface mount capabilities.

Median Price

$324.425

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 29 parts In-Stock

1+ parts

$310.630

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29

$310.630

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DigiKey

USA . 76 parts In-Stock

1+ parts

$338.220

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76

$338.220

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 39 parts In-Stock

1+ parts

$445.914

100+ parts

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39

$445.914

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Vyrian

USA . 1,963 parts In-Stock

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1,963

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Distributors (Availability)

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AZTECH Wire

Italy . 493 parts In-Stock

1+ parts

$14.877

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493

$14.877

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Corohmni

South Africa . 459 parts In-Stock

1+ parts

$52.830

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459

$52.830

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Aztec Data Supply Inc.

USA . 1,496 parts In-Stock

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$54.730

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1,496

$54.730

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Ampacity Inc.

Singapore . 55 parts In-Stock

1+ parts

$353.950

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55

$353.950

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Argo Parts USA

USA . 3,410 parts In-Stock

1+ parts

$445.914

100+ parts

$441.455

1k+ parts

$436.996

10k+ parts

$432.536

3,410

$445.914

$441.455

$436.996

$432.536

Continental Prestige Electronics

USA . 1,079 parts In-Stock

1+ parts

$445.914

100+ parts

-

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$436.996

1,079

$445.914

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$436.996

Microchip USA

USA . 2,631 parts In-Stock

1+ parts

$678.150

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2,631

$678.150

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Authorized Procurement Solutions

USA . 12,000 parts In-Stock

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12,000

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LOOK Integrated Logistics

Peru . 2,171 parts In-Stock

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2,171

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NIA Electronics

USA . 1,027 parts In-Stock

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1,027

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Ledger Components

France . 1,027 parts In-Stock

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1,027

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LMD Electronica

Estonia . 91 parts In-Stock

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91

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Montano Global Distributors

Canada . 50 parts In-Stock

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50

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Overview

Unleash the power of innovation with the MPFS250T-1FCVG484E by Microchip Technology. With a reputation for excellence in the industry, this cutting-edge product offers unmatched quality and reliability. Ideal for a wide range of applications in the category of Other Function uPs, uCs & Peripheral ICs, this device boasts superior performance and efficiency. Elevate your projects with the value, benefits, and advantages that only Microchip Technology can deliver. Experience the difference with the MPFS250T-1FCVG484E and take your creations to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy package body material provides durability and protection for the components inside, ensuring reliable performance in various operating conditions.

Surface Mount: YES

Surface mount capability allows for easy installation on circuit boards, saving time and effort during the assembly process.

Maximum Supply Voltage: 1.03 V

A high maximum supply voltage of 1.03V ensures compatibility with a wide range of power sources, making the product versatile and adaptable.

Package Shape: SQUARE

The square package shape provides efficient use of space on the circuit board, allowing for compact and streamlined designs.

No. of Terminals: 484

A high number of terminals (484) enables the product to interface with multiple external devices and components, enhancing its functionality and connectivity.

Package Style (Meter): GRID ARRAY, FINE PITCH

The grid array, fine pitch package style offers high performance and reliability, making it suitable for demanding applications that require precision and accuracy.

Minimum Supply Voltage: 0.97 V

A low minimum supply voltage of 0.97V ensures efficient power consumption and helps in reducing energy costs during operation.

Maximum Operating Temperature: 100 °C

With a high maximum operating temperature of 100°C, the product can withstand extreme heat conditions, making it durable and reliable in harsh environments.

Minimum Operating Temperature: 0 °C

A minimum operating temperature of 0°C ensures the product can function effectively in cold environments, providing consistent performance in various temperature conditions.

Terminal Position: BOTTOM

Bottom terminal position facilitates easy connection with other components on the circuit board, simplifying the integration process and improving overall system efficiency.

Maximum Seated Height: 2.92 mm

A maximum seated height of 2.92mm allows for a low-profile design, making the product suitable for applications where space constraints are a concern.

Width: 19 mm

A compact width of 19mm enables the product to be used in compact electronic devices, providing versatility and flexibility in design.

Length: 19 mm

A length of 19mm offers a balanced form factor, making the product easy to incorporate into different electronic systems without compromising on performance or functionality.

Peripheral IC Type: SoC

System-on-Chip (SoC) peripheral IC type integrates multiple functions into a single chip, reducing complexity and power consumption while improving overall system efficiency.

Technology: CMOS

Complementary Metal-Oxide-Semiconductor (CMOS) technology provides low power consumption and high noise immunity, making the product energy-efficient and reliable for long-term use.

Terminal Form: BALL

Ball terminal form offers secure and reliable electrical connections, ensuring stable performance and reduced risk of signal loss or interference.

Nominal Supply Voltage: 1 V

A nominal supply voltage of 1V provides a stable power source for the product, ensuring consistent performance and reliability in various operating conditions.

Terminal Pitch: 0.8 mm

A terminal pitch of 0.8mm allows for high-density mounting on the circuit board, optimizing space utilization and enabling efficient placement of the product in electronic systems.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MPFS250T-1FCVG484E attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Microchip Technology

Specs

Additional Features:

ALSO OPERATES AT 1.05V NOMINAL SUPPLY

JESD-30 Code:

S-PBGA-B484

Length:

19 mm

No. of Terminals:

484

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA484,22X22,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Maximum Seated Height:

2.92 mm

Maximum Supply Voltage:

1.03 V

Minimum Supply Voltage:

.97 V

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

19 mm

Peripheral IC Type:

SoC

Trade Compliance

MPFS250T-1FCVG484E Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

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Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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