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MPFS250T-1FCG1152E

Microchip Technology

MPFS250T-1FCG1152E by Microchip Technology

Microchip Technology's MPFS250T-1FCG1152E is a programmable SoC with CMOS technology. It operates b/w 0-100°C, with supply voltage range of 0.97-1.03V. This square GRID ARRAY package has 1152 terminals and is suitable for various Other Function uPs,uCs applications.

Median Price

$433.920

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 10 parts In-Stock

1+ parts

$433.920

100+ parts

-

1k+ parts

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10

$433.920

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DigiKey

USA . 4 parts In-Stock

1+ parts

$433.920

100+ parts

-

1k+ parts

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4

$433.920

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 900 parts In-Stock

1+ parts

$483.034

100+ parts

-

1k+ parts

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900

$483.034

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Vyrian

USA . 4,535 parts In-Stock

1+ parts

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100+ parts

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4,535

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 743 parts In-Stock

1+ parts

$6.052

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-

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743

$6.052

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Microchip USA

USA . 2,338 parts In-Stock

1+ parts

$380.060

100+ parts

$366.240

1k+ parts

$370.220

10k+ parts

$363.100

2,338

$380.060

$366.240

$370.220

$363.100

Ampacity Inc.

Singapore . 15 parts In-Stock

1+ parts

$409.840

100+ parts

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15

$409.840

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Argo Parts USA

USA . 2,315 parts In-Stock

1+ parts

$483.034

100+ parts

$478.204

1k+ parts

$473.374

10k+ parts

$468.543

2,315

$483.034

$478.204

$473.374

$468.543

Continental Prestige Electronics

USA . 2,103 parts In-Stock

1+ parts

$483.034

100+ parts

-

1k+ parts

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10k+ parts

$473.374

2,103

$483.034

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-

$473.374

Netroflash

USA . 100 parts In-Stock

1+ parts

$483.034

100+ parts

-

1k+ parts

$458.883

10k+ parts

$449.222

100

$483.034

-

$458.883

$449.222

NIA Electronics

USA . 8,222 parts In-Stock

1+ parts

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100+ parts

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8,222

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Ledger Components

France . 8,222 parts In-Stock

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8,222

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Montano Global Distributors

Canada . 7,275 parts In-Stock

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7,275

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LMD Electronica

Estonia . 2,292 parts In-Stock

1+ parts

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2,292

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LOOK Integrated Logistics

Peru . 449 parts In-Stock

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449

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Overview

Experience unmatched quality and performance with the MPFS250T-1FCG1152E by Microchip Technology. As a leading manufacturer in the industry, Microchip Technology delivers cutting-edge solutions for a wide range of applications. This versatile product falls under the category of Other Function uPs,uCs & Peripheral ICs, offering customers a reliable and efficient solution for their projects. With its innovative technology and high-quality materials, this product guarantees optimal performance and durability. Take your projects to the next level with the MPFS250T-1FCG1152E and unlock endless possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and cost-effective, making the product reliable and affordable.

Surface Mount: YES

Allows for easy and efficient installation on circuit boards, saving time and effort during manufacturing.

Maximum Supply Voltage: 1.03 V

Can handle higher voltage levels, providing flexibility in different power supply configurations.

Package Shape: SQUARE

Square shape allows for efficient use of space on circuit boards, optimizing layout and design.

No. of Terminals: 1152

High number of terminals enable connectivity with multiple components, increasing functionality and versatility.

Package Style (Meter): GRID ARRAY

Grid array package style offers high terminal density and good thermal performance, enhancing overall reliability.

Minimum Supply Voltage: 0.97 V

Low minimum supply voltage requirement ensures compatibility with a wide range of power sources.

Maximum Operating Temperature: 100 °C

Can operate at high temperatures without issues, suitable for demanding industrial environments.

Minimum Operating Temperature: 0 °C

Can still function effectively in low temperature conditions, providing reliability in various operating environments.

Terminal Position: BOTTOM

Bottom terminal position allows for easy connections and integration with other components, simplifying circuit design.

Maximum Seated Height: 2.99 mm

Low seated height profile saves space and allows for compact designs without compromising performance.

Width: 35 mm

Compact width dimension enables efficient use of board space, ideal for designs with size constraints.

Length: 35 mm

Square shape and consistent dimensions make it easy to incorporate the product into various board layouts.

Peripheral IC Type: PROGRAMMABLE SoC

Programmable System-on-Chip (SoC) offers flexibility and customization options for specific application requirements.

Technology: CMOS

Complementary Metal-Oxide-Semiconductor technology ensures low power consumption and high noise immunity, enhancing overall performance.

Terminal Form: BALL

Ball terminal form provides reliable electrical connections and facilitates high-speed data transmission, improving overall functionality.

Nominal Supply Voltage: 1 V

Stable nominal supply voltage ensures consistent performance and compatibility with standard power sources.

Terminal Pitch: 1 mm

Small terminal pitch allows for high-density packaging and precise connections, optimizing board layout and design.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MPFS250T-1FCG1152E attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Microchip Technology

Specs

Additional Features:

ALSO OPERATES AT 1.05V NOMINAL SUPPLY

JESD-30 Code:

S-PBGA-B1152

Length:

35 mm

No. of Terminals:

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA1152,34X34,40

Package Shape:

Package Style (Meter):

GRID ARRAY

Maximum Seated Height:

2.99 mm

Maximum Supply Voltage:

1.03 V

Minimum Supply Voltage:

.97 V

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Width:

35 mm

Peripheral IC Type:

Trade Compliance

MPFS250T-1FCG1152E Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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