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MPFS095T-1FCVG784I

Microchip Technology

MPFS095T-1FCVG784I by Microchip Technology

MPFS095T-1FCVG784I by Microchip Technology is a 784-terminal GRID ARRAY IC with CMOS technology. It operates b/w -40 to 100 °C, with supply voltage range of 0.97V to 1.03V. Ideal for applications requiring PROGRAMMABLE SoC in compact SQUARE package style.

Median Price

$219.760

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip Technology

USA . 60 parts In-Stock

1+ parts

$219.760

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60

$219.760

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DigiKey

USA . 3 parts In-Stock

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$219.760

100+ parts

$178.562

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3

$219.760

$178.562

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

NAC Semi

USA . 137 parts In-Stock

1+ parts

$204.070

100+ parts

$187.960

1k+ parts

$174.210

10k+ parts

-

137

$204.070

$187.960

$174.210

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Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$280.800

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10

$280.800

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Vyrian

USA . 7,386 parts In-Stock

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7,386

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Distributors (Availability)

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AZTECH Wire

Italy . 774 parts In-Stock

1+ parts

$18.981

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774

$18.981

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Ampacity Inc.

Singapore . 38 parts In-Stock

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$238.250

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38

$238.250

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Continental Prestige Electronics

USA . 2,046 parts In-Stock

1+ parts

$280.800

100+ parts

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10k+ parts

$275.184

2,046

$280.800

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$275.184

Netroflash

USA . 100 parts In-Stock

1+ parts

$280.800

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100

$280.800

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Microchip USA

USA . 1,205 parts In-Stock

1+ parts

$456.480

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1,205

$456.480

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NIA Electronics

USA . 8,014 parts In-Stock

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8,014

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Ledger Components

France . 8,014 parts In-Stock

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8,014

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Argo Parts USA

USA . 4,405 parts In-Stock

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4,405

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LOOK Integrated Logistics

Peru . 2,217 parts In-Stock

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2,217

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Montano Global Distributors

Canada . 1,441 parts In-Stock

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1,441

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LMD Electronica

Estonia . 1,198 parts In-Stock

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Overview

Unleash the power of innovation with the MPFS095T-1FCVG784I by Microchip Technology. As a leading manufacturer in the industry, Microchip Technology excels in providing high-quality products like this programmable SoC that are versatile and reliable. Perfect for various applications, this product offers unmatched value and benefits to customers seeking cutting-edge solutions. Experience seamless integration, superior performance, and endless possibilities with the MPFS095T-1FCVG784I. Elevate your projects to new heights with Microchip Technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy materials provide durability and protection for the integrated circuits within, ensuring a longer lifespan for the product.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on circuit boards, saving space and reducing manufacturing costs.

Maximum Supply Voltage: 1.03 V

The high maximum supply voltage of 1.03 V allows for reliable and stable performance under varying power conditions.

Package Shape: SQUARE

The square package shape offers uniformity and ease of fitting into standardized PCB layouts, optimizing space utilization.

No. of Terminals: 784

The high number of terminals (784) provides a wide range of connectivity options, allowing for versatile integration into complex electronic systems.

Package Style (Meter): GRID ARRAY, FINE PITCH

The grid array, fine pitch package style offers high density mounting and enhanced signal transmission capabilities, ideal for high-performance applications.

Minimum Supply Voltage: 0.97 V

The low minimum supply voltage of 0.97 V ensures efficiency and reduces power consumption, making the product suitable for energy-efficient designs.

Maximum Operating Temperature: 100 °C

With a maximum operating temperature of 100°C, the product can withstand harsh environmental conditions and maintain stable performance in challenging settings.

Minimum Operating Temperature: -40 °C

The wide operating temperature range of -40 to 100°C ensures reliability and functionality in both extreme cold and hot environments, making the product versatile for various applications.

Terminal Position: BOTTOM

The bottom terminal position facilitates easy installation and soldering on PCBs, simplifying assembly processes and improving production efficiency.

Maximum Seated Height: 2.92 mm

The low maximum seated height of 2.92 mm allows for compact designs and space-saving installations, particularly in slim and sleek electronic devices.

Width: 23 mm

The 23 mm width offers a balance between compactness and accessibility, enabling efficient integration into various electronic systems without compromising on usability.

Length: 23 mm

The 23 mm length complements the square package shape, providing a symmetrical form factor that enhances compatibility with standard PCB layouts and enclosure designs.

Peripheral IC Type: PROGRAMMABLE SoC

The programmable SoC (System-on-Chip) design allows for versatile customization and adaptability to different functions and applications, making the product highly flexible and scalable.

Technology: CMOS

The CMOS technology offers low power consumption, high speed operation, and compatibility with various digital systems, ensuring efficient performance and compatibility with modern electronic devices.

Terminal Form: BALL

The ball terminal form provides reliable connectivity and ensures secure soldering joints, preventing signal disruptions and enhancing the overall durability of the product.

Nominal Supply Voltage: 1 V

The nominal supply voltage of 1 V offers a stable and standard power input for consistent performance, simplifying system design and integration processes.

Terminal Pitch: 0.8 mm

The tight terminal pitch of 0.8 mm allows for high-density mounting and efficient signal transmission, enabling compact designs and enhanced performance in space-constrained applications.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MPFS095T-1FCVG784I attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Microchip Technology

Specs

Additional Features:

ALSO OPERATES AT 1.05V NOMINAL SUPPLY

JESD-30 Code:

S-PBGA-B784

Length:

23 mm

No. of Terminals:

784

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA784,28X28,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Maximum Seated Height:

2.92 mm

Maximum Supply Voltage:

1.03 V

Minimum Supply Voltage:

.97 V

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

23 mm

Peripheral IC Type:

Trade Compliance

MPFS095T-1FCVG784I Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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