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XC7Z045-2FBG676I

Xilinx

XC7Z045-2FBG676I by Xilinx

The Xilinx XC7Z045-2FBG676I is a System on Chip with CMOS technology. It operates b/w -40 to 100°C, with supply voltage ranging from 0.95V to 1.05V. With 676 terminals in a grid array package, it's ideal for applications requiring high-performance processing and integration capabilities.

Median Price

$2,039.340

Lifecycle Status

Suppliers In-Stock

9

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1k+

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DigiKey

USA . 3 parts In-Stock

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Digiode

USA . 210 parts In-Stock

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$1,953.162

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VNN

France . 273 parts In-Stock

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$2,055.960

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Nova Conductors

Japan . 53 parts In-Stock

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Vyrian

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Chip Stock

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North Shore Components

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Cyclops Electronics Ltd

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NexGen Digital

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AZTECH Wire

Italy . 493 parts In-Stock

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$15.840

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Modulus Dynamics

Lithuania . 914 parts In-Stock

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Corohmni

South Africa . 188 parts In-Stock

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$42.409

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MARBEL Systems

Belgium . 2,865 parts In-Stock

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$52.907

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Aztec Data Supply Inc.

USA . 89 parts In-Stock

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$62.620

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Texas Native Microelectronics

USA . 50 parts In-Stock

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$63.347

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$60.813

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$58.913

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Kenton Components

USA . 1,780 parts In-Stock

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$76.016

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Microchip USA

USA . 2,477 parts In-Stock

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$1,631.472

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Semicontronic

India . 8 parts In-Stock

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$1,733.230

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$1,689.899

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$1,681.233

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Corphita

USA . 165 parts In-Stock

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Argo Parts USA

USA . 1,467 parts In-Stock

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$2,039.225

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$2,018.833

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$1,998.440

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$1,978.048

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Ampacity Inc.

Singapore . 8 parts In-Stock

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$3,772.340

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Authorized Procurement Solutions

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Qasali Group International

UK . 2,213 parts In-Stock

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Supply Digital

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Vigor

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Futuretech Components

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A-Z Elektronik GmbH

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Lixinc

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Netroflash

USA . 100 parts In-Stock

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RC Electronics

USA . 99 parts In-Stock

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Overview

Unlock unparalleled performance and versatility with the XC7Z045-2FBG676I by Xilinx, a leading innovator in the semiconductor industry. This cutting-edge system on chip offers endless possibilities for a wide range of applications, from industrial automation to telecommunications. With its advanced technology and reliable design, this product ensures optimal functionality and seamless integration into any project. Experience the value and benefits of Xilinx's expertise, as you elevate your projects to new heights with the XC7Z045-2FBG676I.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and reliability, making the product suitable for a wide range of applications.

Surface Mount: YES

Surface mount capability makes the product easy to mount on PCBs, saving space and facilitating efficient assembly.

Maximum Supply Voltage: 1.05 V

The high maximum supply voltage allows for flexibility in power supply options, accommodating various voltage requirements.

Package Shape: SQUARE

Square package shape facilitates easy and compact integration into electronic systems.

No. of Terminals: 676

The high number of terminals provides connectivity for a wide range of functionalities, enhancing the product's versatility.

Package Style (Meter): GRID ARRAY

Grid array package style offers efficient heat dissipation and high density interconnection, improving overall performance.

Minimum Supply Voltage: 0.95 V

The low minimum supply voltage allows for operation in low power settings, potentially reducing energy consumption.

Maximum Operating Temperature: 100 °C

High maximum operating temperature ensures the product can perform reliably in demanding environmental conditions.

Minimum Operating Temperature: -40 °C

Wide operating temperature range enables the product to function effectively in extreme cold conditions.

Terminal Position: BOTTOM

Bottom terminal position simplifies PCB layout and improves signal integrity, enhancing overall functionality.

Maximum Seated Height: 2.54 mm

Low seated height allows for compact design and efficient use of space in electronic systems.

Width: 27 mm

Optimal width dimension enables easy integration into standard PCB layouts, enhancing compatibility.

Length: 27 mm

Compact length dimension contributes to a space-saving design, suitable for smaller electronic devices.

Peripheral IC Type: SYSTEM ON CHIP

System-on-chip technology integrates multiple functions into a single chip, reducing complexity and enhancing overall performance.

Technology: CMOS

CMOS technology offers low power consumption, high speed, and compatibility with various digital systems, making the product energy efficient and versatile.

Terminal Form: BALL

Ball terminal form provides reliable connectivity and facilitates soldering, ensuring secure attachment to PCBs.

Nominal Supply Voltage: 1 V

The nominal supply voltage of 1V ensures compatibility with standard power sources, simplifying integration into existing systems.

Terminal Pitch: 1 mm

The small terminal pitch of 1mm allows for high-density mounting and efficient use of PCB space, enabling compact designs.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs XC7Z045-2FBG676I attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Xilinx

Specs

JESD-30 Code:

S-PBGA-B676

Length:

27 mm

No. of Terminals:

676

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA676,26X26,40

Package Shape:

Package Style (Meter):

GRID ARRAY

Maximum Seated Height:

2.54 mm

Maximum Supply Voltage:

1.05 V

Minimum Supply Voltage:

.95 V

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Width:

27 mm

Peripheral IC Type:

Trade Compliance

XC7Z045-2FBG676I Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.D

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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