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MCIMX27VOP4A

NXP Semiconductors

MCIMX27VOP4A by NXP Semiconductors

MCIMX27VOP4A by NXP Semiconductors is a 404-terminal System on Chip with CMOS technology. It operates b/w -20 to 85 °C and has a supply voltage range of 1.38-1.52 V. Ideal for applications requiring low profile, fine pitch grid array packages.

Median Price

$26.955

Lifecycle Status

Suppliers In-Stock

16

In-Stock Inventory

1k+

Distributors (Authorized)

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Arrow

USA . 719 parts In-Stock

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$24.070

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Verical

USA . 719 parts In-Stock

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$24.070

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Mouser Electronics

USA . 213 parts In-Stock

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$46.890

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$34.610

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213

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DigiKey

USA . 652 parts In-Stock

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$46.920

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$34.612

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Chip1Stop

Japan . 630 parts In-Stock

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EBV Elektronik

Germany . 450 parts In-Stock

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Rochester

USA . 6 parts In-Stock

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$29.840

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$26.700

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$25.130

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$25.130

Distributors (In-Stock)

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Digiode

USA . 3,239 parts In-Stock

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$26.248

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Bristol Electronics

USA . 11,326 parts In-Stock

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$28.200

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$22.842

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Nova Conductors

Japan . 72 parts In-Stock

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$30.235

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Chip Stock

USA . 1,125 parts In-Stock

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Anansix

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TME

Poland . 360 parts In-Stock

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Vyrian

USA . 144 parts In-Stock

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LWI Electronics Inc

India . 15 parts In-Stock

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ComSIT Distribution GmbH

Germany . 10 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 424 parts In-Stock

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$19.550

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$19.550

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Semicontronic

India . 56 parts In-Stock

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$19.550

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$19.061

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$18.964

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$19.550

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$18.964

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Corphita

USA . 3,891 parts In-Stock

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$24.867

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Netroflash

USA . 50 parts In-Stock

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$30.235

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$29.630

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Corohmni

South Africa . 1,852 parts In-Stock

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$53.290

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Aztec Data Supply Inc.

USA . 439 parts In-Stock

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$73.636

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Lixinc

USA . 17,096 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 15,982 parts In-Stock

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Perfect Parts

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Metaverse IC Inc.

Canada . 8,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 7,470 parts In-Stock

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Argo Parts USA

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Microchip USA

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Futuretech Components

Singapore . 3,000 parts In-Stock

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Authorized Procurement Solutions

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Kepictronics

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Robosynatics

Brazil . 200 parts In-Stock

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$0.196

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$0.196

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$0.196

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$0.196

$0.196

Lucentia Tech

USA . 200 parts In-Stock

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$0.196

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$0.196

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$0.196

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$0.196

Infinite Electronics LLP (Excess)

. 91 parts In-Stock

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ChipstoGo Electronic ltd

UK . 57 parts In-Stock

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UNI Independent Distributors

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Overview

Unleash the power of innovation with the MCIMX27VOP4A by NXP Semiconductors. This cutting-edge System on Chip device offers unparalleled performance and reliability in a compact package. Designed for a wide range of applications, this versatile product is perfect for those seeking high-quality solutions. With NXP Semiconductors' reputation for excellence, you can trust that you are getting a top-of-the-line product that will exceed your expectations. Elevate your projects to the next level with the MCIMX27VOP4A and experience the value and benefits it brings to your designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides a good balance between durability and cost-effectiveness, making the product reliable and affordable.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly, saving time and effort during production.

Maximum Supply Voltage: 1.52 V

The high maximum supply voltage ensures compatibility with a wide range of power sources, increasing flexibility in applications.

Package Shape: SQUARE

The square shape allows for efficient use of space on the circuit board, optimizing layout and design.

No. of Terminals: 404

The high number of terminals provides ample connectivity options, enabling versatile functionality in various systems.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

This package style offers a compact and low-profile design with precise terminal spacing, enhancing performance and reliability.

Minimum Supply Voltage: 1.38 V

The low minimum supply voltage allows for efficient power consumption, leading to energy savings and extended battery life.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliable performance in demanding environments with elevated temperatures.

Minimum Operating Temperature: -20 °C

The low minimum operating temperature allows for operation in cold conditions, expanding the product's applicability to a wide range of environments.

Terminal Finish: TIN SILVER COPPER

This terminal finish provides excellent conductivity and corrosion resistance, ensuring stable connections and long-term durability.

Terminal Position: BOTTOM

The bottom terminal position simplifies PCB layout and assembly, optimizing space utilization and facilitating maintenance.

Maximum Seated Height: 1.4 mm

The low maximum seated height contributes to a compact overall profile, making the product suitable for space-constrained applications.

Width: 17 mm

The moderate width allows for compatibility with standard mounting configurations, facilitating integration into existing systems.

Maximum Time At Peak Reflow Temperature (s): 40

The short time at peak reflow temperature minimizes thermal stress on components during soldering, preserving their reliability.

Peak Reflow Temperature °C: 260

The high peak reflow temperature ensures proper soldering and joint integrity, enhancing the overall quality of the product.

Length: 17 mm

The moderate length contributes to a balanced form factor, allowing for versatile placement and compatibility with standard board sizes.

Peripheral IC Type: SYSTEM ON CHIP

The integration of various functions into a single chip simplifies system design, reduces component count, and improves overall efficiency.

Technology: CMOS

Complementary Metal-Oxide-Semiconductor technology offers low power consumption, high noise immunity, and fast switching speeds, enhancing performance and efficiency.

Terminal Form: BALL

The ball terminal form enables reliable contacts and solder joints, ensuring stable connections and long-term functionality.

Nominal Supply Voltage: 1.45 V

The nominal supply voltage provides a standard reference for power requirements, simplifying system design and compatibility.

Terminal Pitch: 0.65 mm

The fine terminal pitch allows for precise connections and compact layout, optimizing circuit density and performance.

Moisture Sensitivity Level (MSL): 3

The moderate moisture sensitivity level indicates suitable handling and storage requirements, ensuring product reliability and longevity.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MCIMX27VOP4A attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from NXP Semiconductors

Specs

Additional Features:

ALSO OPERATES WITH 1.3VNOM @266MHZ

JESD-30 Code:

S-PBGA-B404

JESD-609 Code:

e1

Length:

17 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

404

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.4 mm

Maximum Supply Voltage:

1.52 V

Minimum Supply Voltage:

1.38 V

Nominal Supply Voltage:

1.45 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

17 mm

Peripheral IC Type:

Trade Compliance

MCIMX27VOP4A Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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