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CC3220MODSM2MOBR

Texas Instruments

CC3220MODSM2MOBR by Texas Instruments

The Texas Instruments CC3220MODSM2MOBR is a CORTEX-M4 microprocessor with 256 RAM words and 1024000 ROM words. It features 4 ADC channels, 4 timers, and connectivity options like I2C, I2S, SD, SPI, and UART. Ideal for industrial applications requiring low power consumption and high-speed processing capabilities.

Median Price

$10.495

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 444 parts In-Stock

1+ parts

$3.481

100+ parts

$3.387

1k+ parts

$3.360

10k+ parts

-

444

$3.481

$3.387

$3.360

-

Verical

USA . 444 parts In-Stock

1+ parts

$3.481

100+ parts

$3.387

1k+ parts

$3.360

10k+ parts

-

444

$3.481

$3.387

$3.360

-

Chip1Stop

Japan . 706 parts In-Stock

1+ parts

$9.034

100+ parts

$7.680

1k+ parts

$6.880

10k+ parts

-

706

$9.034

$7.680

$6.880

-

Texas Instruments

USA . 7,130 parts In-Stock

1+ parts

$9.450

100+ parts

$8.255

1k+ parts

$5.693

10k+ parts

-

7,130

$9.450

$8.255

$5.693

-

Farnell

UK . 988 parts In-Stock

1+ parts

$11.540

100+ parts

-

1k+ parts

-

10k+ parts

-

988

$11.540

-

-

-

DigiKey

USA . 114 parts In-Stock

1+ parts

$14.130

100+ parts

$10.779

1k+ parts

$9.678

10k+ parts

-

114

$14.130

$10.779

$9.678

-

Mouser Electronics

USA . 30 parts In-Stock

1+ parts

$14.130

100+ parts

$9.260

1k+ parts

$8.430

10k+ parts

-

30

$14.130

$9.260

$8.430

-

Element14

Singapore . 988 parts In-Stock

1+ parts

$26.150

100+ parts

$20.300

1k+ parts

$16.550

10k+ parts

-

988

$26.150

$20.300

$16.550

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 904 parts In-Stock

1+ parts

$7.578

100+ parts

-

1k+ parts

-

10k+ parts

-

904

$7.578

-

-

-

Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$7.610

100+ parts

-

1k+ parts

-

10k+ parts

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10

$7.610

-

-

-

Chip Stock

USA . 8,290 parts In-Stock

1+ parts

-

100+ parts

-

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8,290

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-

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Vyrian

USA . 3,317 parts In-Stock

1+ parts

-

100+ parts

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3,317

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-

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 1,188 parts In-Stock

1+ parts

$6.640

100+ parts

$6.474

1k+ parts

$6.441

10k+ parts

-

1,188

$6.640

$6.474

$6.441

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Ampacity Inc.

Singapore . 1,171 parts In-Stock

1+ parts

$6.640

100+ parts

-

1k+ parts

-

10k+ parts

-

1,171

$6.640

-

-

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Corphita

USA . 1,769 parts In-Stock

1+ parts

$7.179

100+ parts

-

1k+ parts

-

10k+ parts

-

1,769

$7.179

-

-

-

Continental Prestige Electronics

USA . 1,316 parts In-Stock

1+ parts

$7.610

100+ parts

-

1k+ parts

-

10k+ parts

$7.458

1,316

$7.610

-

-

$7.458

Netroflash

USA . 500 parts In-Stock

1+ parts

$7.610

100+ parts

$7.458

1k+ parts

-

10k+ parts

-

500

$7.610

$7.458

-

-

Advanced Electronics

New Zealand . 74 parts In-Stock

1+ parts

$7.762

100+ parts

$7.762

1k+ parts

$7.762

10k+ parts

-

74

$7.762

$7.762

$7.762

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Corohmni

South Africa . 526 parts In-Stock

1+ parts

$21.811

100+ parts

-

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-

10k+ parts

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526

$21.811

-

-

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Parana Technologies

USA . 1,340 parts In-Stock

1+ parts

$76.026

100+ parts

-

1k+ parts

-

10k+ parts

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1,340

$76.026

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-

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DigiPath Technology Company

USA . 188 parts In-Stock

1+ parts

$83.715

100+ parts

$77.017

1k+ parts

-

10k+ parts

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188

$83.715

$77.017

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-

ChromeModa Solutions

Germany . 2,274 parts In-Stock

1+ parts

$85.423

100+ parts

$70.047

1k+ parts

-

10k+ parts

-

2,274

$85.423

$70.047

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IDEA Electronic Components Group

UK . 1,865 parts In-Stock

1+ parts

$85.423

100+ parts

$81.152

1k+ parts

$76.881

10k+ parts

-

1,865

$85.423

$81.152

$76.881

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Lixinc

USA . 5,966 parts In-Stock

1+ parts

-

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5,966

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Argo Parts USA

USA . 890 parts In-Stock

1+ parts

-

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890

-

-

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Overview

Unlock endless possibilities with the Texas Instruments CC3220MODSM2MOBR, a versatile microprocessor circuit that offers unmatched quality and reliability. From industrial applications to IoT devices, this chip carrier package provides seamless connectivity through I2C, I2S, SD, SPI, and UART interfaces. With low power mode and boundary scan capabilities, this product ensures efficient performance and ease of use. Trust in Texas Instruments to deliver cutting-edge technology that empowers you to innovate and succeed in today's dynamic market. Elevate your designs with the CC3220MODSM2MOBR and experience the difference quality makes.

Feature Benefit Bullets

Surface Mount: YES

This product is easy to solder onto a circuit board, making it convenient for assembly.

Maximum Supply Voltage: 3.6 V

With a high maximum supply voltage, this product can handle a wide range of power inputs.

On Chip Data RAM Width: 8

The 8-bit data RAM width allows for efficient storage and processing of data.

Package Shape: RECTANGULAR

The rectangular package shape makes this product suitable for compact and organized PCB layouts.

No. of Terminals: 63

With a high number of terminals, this product offers plenty of connectivity options.

Package Style (Meter): CHIP CARRIER

The chip carrier package style provides a secure and reliable housing for the IC.

Minimum Supply Voltage: 2.3 V

This low minimum supply voltage ensures compatibility with a variety of power sources.

CPU Family: CORTEX-M4

The Cortex-M4 CPU family offers high performance and energy efficiency for optimal operation.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40°C, this product is suitable for use in harsh environments.

Terminal Finish: NICKEL GOLD

The nickel gold terminal finish provides excellent conductivity and corrosion resistance.

ADC Channels: YES

The presence of ADC channels allows for analog to digital conversion, expanding the product's capabilities.

Terminal Position: BOTTOM

The bottom terminal position facilitates easy integration into circuit designs.

ROM Words: 1024000

With a large ROM capacity of 1024000 words, this product can store extensive program data.

Maximum Seated Height: 2.45 mm

The low maximum seated height ensures compatibility with space-constrained applications.

RAM Words: 256

The 256-word RAM capacity allows for efficient temporary data storage during operation.

Width: 17.5 mm

The compact width of 17.5 mm enables flexibility in PCB layout designs.

Boundary Scan: YES

The presence of boundary scan capability facilitates testing and debugging during development.

Peripherals: TIMER(4), WDT

The inclusion of timers and a watchdog timer enhances the product's functionality.

Maximum Time At Peak Reflow Temperature (s): 30

This quick reflow time of 30 seconds during assembly ensures efficient production processes.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260°C, this product can withstand high-temperature soldering processes.

Length: 20.5 mm

The length of 20.5 mm provides a balance between compact size and functionality.

Temperature Grade: INDUSTRIAL

The industrial-grade temperature rating ensures reliability in demanding operating conditions.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

The product's microprocessor circuit type offers advanced processing capabilities.

No. of Timers: 4

With four timers, this product enables precise timing functions for various applications.

RAM Bytes: 262144

The 262144-byte RAM capacity allows for extensive data storage and processing capabilities.

Technology: CMOS

The CMOS technology used in this product offers efficient power consumption and high-speed operation.

Terminal Form: BUTT

The butt terminal form ensures secure and stable connections in circuit designs.

Analog To Digital Convertors: 4-Ch 12-Bit

The presence of four 12-bit analog to digital converters enables accurate conversion of analog signals.

Nominal Supply Voltage: 3.3 V

With a 3.3 V nominal supply voltage, this product is compatible with standard power sources.

No. of DMA Channels: 2

The two DMA channels provide efficient data transfer capabilities for improved performance.

No. of Serial I/Os: 2

With two serial I/Os, this product supports communication with external devices.

Connectivity: I2C, I2S, SD, SPI, UART

The various connectivity options including I2C, I2S, SD, SPI, and UART make this product versatile for different applications.

ROM Programmability: FLASH

The flash ROM programmability allows for flexible programming and updating of firmware.

Terminal Pitch: 1.27 mm

The 1.27 mm terminal pitch enables easy connection with standard PCB layouts.

Format: FIXED POINT

The fixed-point format simplifies mathematical operations and increases processing speed.

Moisture Sensitivity Level (MSL): 3

The MSL 3 rating ensures proper handling and storage of the product in moisture-sensitive environments.

Speed: 2400 rpm

The 2400 rpm speed capability enables fast data processing and system performance.

Low Power Mode: YES

The low power mode feature allows for energy-efficient operation, extending battery life.

On Chip Program ROM Width: 8

The 8-bit program ROM width provides efficient storage of program code.

No. of I/O Lines: 25

With 25 I/O lines, this product offers ample connectivity for external devices and peripherals.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs CC3220MODSM2MOBR attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Boundary Scan:

YES

CPU Family:

CORTEX-M4

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

R-XBCC-B63

JESD-609 Code:

e4

Length:

20.5 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

2

No. of External Interrupts:

0

No. of I/O Lines:

25

No. of Serial I/Os:

2

No. of Terminals:

63

No. of Timers:

4

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

UNSPECIFIED

Package Code:

BCC

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

RAM Bytes:

262144

RAM Words:

256

ROM Words:

1024000

ROM Programmability:

FLASH

Maximum Seated Height:

2.45 mm

Speed:

2400 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

17.5 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, I2S, SD, SPI, UART

Peripherals:

TIMER(4), WDT

Analog To Digital Convertors:

4-Ch 12-Bit

Trade Compliance

CC3220MODSM2MOBR Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

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