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CC3200MODR1M2AMOBR

Texas Instruments

CC3200MODR1M2AMOBR by Texas Instruments

CC3200MODR1M2AMOBR by Texas Instruments is a 63-terminal chip carrier with 3.6V max supply voltage, ideal for commercial-grade microprocessor circuits. Featuring 4-Ch 12-Bit ADC channels and I2C/SPI/UART bus compatibility, it operates b/w -20 to 70°C with a compact size of 20.5mm x 17.5mm x 2.45mm for various IoT applications.

Median Price

$22.849

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1,375 parts In-Stock

1+ parts

$8.610

100+ parts

$8.440

1k+ parts

$8.270

10k+ parts

-

1,375

$8.610

$8.440

$8.270

-

Texas Instruments

USA . 5,288 parts In-Stock

1+ parts

$17.908

100+ parts

$15.643

1k+ parts

$10.788

10k+ parts

-

5,288

$17.908

$15.643

$10.788

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Mouser Electronics

USA . 800 parts In-Stock

1+ parts

$27.790

100+ parts

$21.370

1k+ parts

$19.630

10k+ parts

-

800

$27.790

$21.370

$19.630

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DigiKey

USA . 1,048 parts In-Stock

1+ parts

$28.330

100+ parts

$21.776

1k+ parts

$20.880

10k+ parts

-

1,048

$28.330

$21.776

$20.880

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 39 parts In-Stock

1+ parts

$13.485

100+ parts

-

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39

$13.485

-

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Digiode

USA . 4,744 parts In-Stock

1+ parts

$17.013

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4,744

$17.013

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Vyrian

USA . 2,609 parts In-Stock

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2,609

-

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-

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Semi Source

USA . 1 parts In-Stock

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1

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Prism Electronics

USA . 1 parts In-Stock

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1

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aranea Global

USA . 1,000 parts In-Stock

1+ parts

$13.215

100+ parts

-

1k+ parts

$12.687

10k+ parts

-

1,000

$13.215

-

$12.687

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Continental Prestige Electronics

USA . 4,837 parts In-Stock

1+ parts

$13.485

100+ parts

-

1k+ parts

-

10k+ parts

$13.215

4,837

$13.485

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-

$13.215

Ampacity Inc.

Singapore . 2,508 parts In-Stock

1+ parts

$15.220

100+ parts

-

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2,508

$15.220

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Semicontronic

India . 2,373 parts In-Stock

1+ parts

$15.220

100+ parts

$14.840

1k+ parts

$14.763

10k+ parts

-

2,373

$15.220

$14.840

$14.763

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Corphita

USA . 1,355 parts In-Stock

1+ parts

$16.117

100+ parts

-

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1,355

$16.117

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Advanced Electronics

New Zealand . 1,000 parts In-Stock

1+ parts

$44.344

100+ parts

$42.126

1k+ parts

$42.126

10k+ parts

-

1,000

$44.344

$42.126

$42.126

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Corohmni

South Africa . 122 parts In-Stock

1+ parts

$49.099

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-

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122

$49.099

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Parana Technologies

USA . 366 parts In-Stock

1+ parts

$74.208

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366

$74.208

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ChromeModa Solutions

Germany . 5,355 parts In-Stock

1+ parts

$83.380

100+ parts

$68.372

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5,355

$83.380

$68.372

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IDEA Electronic Components Group

UK . 2,078 parts In-Stock

1+ parts

$83.380

100+ parts

$79.211

1k+ parts

$75.042

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2,078

$83.380

$79.211

$75.042

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QUARKTWIN TECHNOLOGY LTD

USA . 15,390 parts In-Stock

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Lixinc

USA . 6,062 parts In-Stock

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A-Z Elektronik GmbH

Germany . 4,526 parts In-Stock

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Metaverse IC Inc.

Canada . 3,500 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,017 parts In-Stock

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Kepictronics

USA . 2,550 parts In-Stock

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Futuretech Components

Singapore . 2,349 parts In-Stock

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Perfect Parts

USA . 2,240 parts In-Stock

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DigiPath Technology Company

USA . 1,936 parts In-Stock

1+ parts

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$75.175

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1,936

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$75.175

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Argo Parts USA

USA . 1,469 parts In-Stock

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1,469

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GreenTree Electronics

Israel . 500 parts In-Stock

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500

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Overview

Unlock the power of connectivity with the Texas Instruments CC3200MODR1M2AMOBR. This cutting-edge microprocessor circuit offers unparalleled performance and versatility for a wide range of applications. With its high-quality manufacturing and reliable technology, this chip carrier is the perfect solution for your IoT projects. Seamlessly integrate I2C, SPI, and UART bus compatibility with 4-Ch 12-Bit ADC channels for optimal functionality. Trust Texas Instruments to deliver exceptional value and innovation with the CC3200MODR1M2AMOBR. Elevate your designs and stay ahead of the curve with this top-of-the-line product.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy and secure mounting on PCBs, saving space and reducing assembly time.

Maximum Supply Voltage: 3.6 V

Supports a wide range of input voltages for versatility and compatibility in various applications.

Package Shape: RECTANGULAR

Standard package shape that is easy to handle and fit in standard PCB layouts.

No. of Terminals: 63

Provides a high number of connectivity options for interfacing with other components.

Package Style (Meter): CHIP CARRIER

Chip carrier package style offers good thermal properties and reliability for the IC.

Minimum Supply Voltage: 2.3 V

Allows for operation in low-voltage scenarios, increasing the product's flexibility.

Maximum Operating Temperature: 70 °C

Wide operating temperature range ensures reliable performance in various environments.

Minimum Operating Temperature: -20 °C

Operates efficiently even in low-temperature conditions, suitable for a range of applications.

Terminal Finish: NICKEL GOLD

Nickel gold finish provides good conductivity and corrosion resistance for long-lasting performance.

ADC Channels: YES

Integrated Analog to Digital Converters enable accurate analog signal processing and conversion.

Terminal Position: BOTTOM

Bottom terminal position facilitates easy and secure connection to the PCB, enhancing reliability.

Maximum Seated Height: 2.45 mm

Low seated height allows for compact design and saves space in the overall system layout.

Width: 17.5 mm

Compact width dimension enables efficient PCB layout and integration into tight spaces.

Maximum Time At Peak Reflow Temperature (s): 30

Suitable reflow time ensures proper soldering of the IC during assembly, contributing to product reliability.

Peak Reflow Temperature °C: 260

High peak reflow temperature ensures reliable soldering and strong connection of the IC to the PCB.

Length: 20.5 mm

Optimal length dimension for space-saving layout and easy integration into various electronic devices.

Temperature Grade: COMMERCIAL

Commercial temperature grade suitable for standard operating conditions and applications.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Microprocessor circuit integration offers advanced processing capabilities for enhanced functionality.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity for efficient operation.

Terminal Form: BUTT

Butt terminal form ensures secure and reliable electrical connections for stable performance.

Analog To Digital Convertors: 4-Ch 12-Bit

Multiple high-resolution Analog to Digital Converters enable precise signal conversion for accurate data processing.

Nominal Supply Voltage: 3.3 V

Stable nominal supply voltage ensures consistent performance and compatibility with common power sources.

Bus Compatibility: I2C; SPI; UART

Support for multiple bus protocols enhances connectivity options and interoperability with various devices.

Terminal Pitch: 1.27 mm

Optimal terminal pitch for easy soldering and efficient PCB layout, ensuring reliable electrical connections.

Moisture Sensitivity Level (MSL): 3

Moisture sensitivity level 3 indicates the IC can withstand moderate exposure to moisture during handling and assembly.

No. of I/O Lines: 25

Multiple input/output lines allow for versatile interfacing with other components and peripherals for enhanced functionality.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs CC3200MODR1M2AMOBR attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

ADC Channels:

YES

Bus Compatibility:

I2C; SPI; UART

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

R-XBCC-B63

JESD-609 Code:

e4

Length:

20.5 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

25

No. of Terminals:

63

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-20 Cel

PWM Channels:

NO

Package Body Material:

UNSPECIFIED

Package Code:

BCC

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Maximum Seated Height:

2.45 mm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

17.5 mm

Peripheral IC Type:

Data EEPROM Size:

0

Analog To Digital Convertors:

4-Ch 12-Bit

Trade Compliance

CC3200MODR1M2AMOBR Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8473.30.11.80

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

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