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MCIMX6Y2CVM05AA

NXP Semiconductors

MCIMX6Y2CVM05AA by NXP Semiconductors

MCIMX6Y2CVM05AA by NXP Semiconductors is a low-profile, fine-pitch grid array SoC with 289 terminals. It operates in industrial temperature range (-40 to 105°C) and supports CMOS technology. With a supply voltage range of 1.275V to 1.5V, it is suitable for various applications requiring high-performance microcontrollers.

Median Price

$10.800

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 300 parts In-Stock

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$10.800

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300

$10.800

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Flip Electronics

USA . 4,724 parts In-Stock

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4,724

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Digiode

USA . 3,074 parts In-Stock

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3,074

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Vyrian

USA . 2,233 parts In-Stock

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Anansix

USA . 1,798 parts In-Stock

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1,798

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 816 parts In-Stock

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$7.892

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816

$7.892

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Semicontronic

India . 232 parts In-Stock

1+ parts

$8.000

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$7.800

1k+ parts

$7.760

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232

$8.000

$7.800

$7.760

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Aranea Global

USA . 50 parts In-Stock

1+ parts

$10.584

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$10.161

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50

$10.584

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$10.161

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Continental Prestige Electronics

USA . 5,514 parts In-Stock

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$10.800

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$10.584

5,514

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$10.584

Advanced Electronics

New Zealand . 500 parts In-Stock

1+ parts

$11.016

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$11.016

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$11.016

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500

$11.016

$11.016

$11.016

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One Stop Electronics

USA . 654 parts In-Stock

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$22.000

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$22.000

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Microchip USA

USA . 3,381 parts In-Stock

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$30.986

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Ampacity Inc.

Singapore . 494 parts In-Stock

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$34.000

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494

$34.000

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Corohmni

South Africa . 1,956 parts In-Stock

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$42.925

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$42.925

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Aztec Data Supply Inc.

USA . 4,334 parts In-Stock

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$64.350

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4,334

$64.350

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Authorized Procurement Solutions

USA . 8,000 parts In-Stock

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8,000

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UNI Independent Distributors

Spain . 6,650 parts In-Stock

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Argo Parts USA

USA . 3,892 parts In-Stock

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3,892

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Corphita

USA . 3,704 parts In-Stock

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3,704

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Perfect Parts

USA . 170 parts In-Stock

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170

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Overview

Unlock endless possibilities with the MCIMX6Y2CVM05AA by NXP Semiconductors. Known for their superior quality and innovation, NXP Semiconductors has crafted a product that exceeds expectations in the category of Other Function uPs,uCs & Peripheral ICs. This versatile device offers a wide range of applications, providing unmatched value and benefits to customers. Experience seamless performance and reliability like never before with the MCIMX6Y2CVM05AA.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides good durability and protection for the integrated circuits inside the package.

Surface Mount: YES

Surface mount capability allows for easy integration onto PCBs, saving space and enabling automated assembly processes.

Maximum Supply Voltage: 1.5 V

With a maximum supply voltage of 1.5 V, this product offers a wide operating range while ensuring safe voltage levels for the components.

Package Shape: SQUARE

The square package shape provides a consistent and compact form factor, making it suitable for various electronic applications.

No. of Terminals: 289

Having a high number of terminals allows for a greater connectivity options and flexibility in circuit designs.

Package Style: GRID ARRAY, LOW PROFILE, FINE PITCH

The grid array package style, along with low profile and fine pitch design, enables high-density mounting and efficient signal routing on the PCB.

Minimum Supply Voltage: 1.275 V

The low minimum supply voltage requirement enables energy-efficient operation and extends battery life in portable devices.

Maximum Operating Temperature: 105 °C

With a high maximum operating temperature of 105°C, this product can withstand demanding industrial environments without compromising performance.

Minimum Operating Temperature: -40 °C

The wide temperature range from -40°C to 105°C ensures reliable operation in both extreme cold and hot conditions.

Terminal Position: BOTTOM

Bottom terminal position facilitates easy PCB layout and soldering processes, enhancing overall manufacturing efficiency.

Maximum Seated Height: 1.32 mm

The low seated height of 1.32 mm minimizes the overall profile of the package, making it suitable for compact electronic devices.

Width: 14 mm

With a width of 14 mm, this product offers a balanced footprint size for accommodating various other components on the PCB.

Maximum Time At Peak Reflow Temperature (s): 40

The short time at peak reflow temperature of 40 seconds ensures effective soldering without damaging the sensitive components.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260°C, this product can withstand the high temperatures of the soldering process for reliable assembly.

Length: 14 mm

The 14 mm length contributes to the compact form factor of the package, enhancing space-saving capabilities in electronic designs.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable performance in harsh industrial environments, making it suitable for rugged applications.

Peripheral IC Type: SoC

The System-on-Chip (SoC) design integrates multiple functions into a single chip, reducing component count and enhancing system efficiency.

Technology: CMOS

Using CMOS technology offers low power consumption and high noise immunity, making the product suitable for energy-efficient and reliable operation.

Terminal Form: BALL

The ball terminal form provides reliable electrical connections and facilitates the soldering process for secure mounting on the PCB.

Terminal Pitch: 0.8 mm

The 0.8 mm terminal pitch allows for fine-pitch mounting, enabling high-density integration and efficient signal routing on the PCB.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MCIMX6Y2CVM05AA attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

S-PBGA-B289

Length:

14 mm

No. of Terminals:

289

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA289,17X17,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.32 mm

Maximum Supply Voltage:

1.5 V

Minimum Supply Voltage:

1.275 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

14 mm

Peripheral IC Type:

SoC

Trade Compliance

MCIMX6Y2CVM05AA Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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