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VCBU68WMCE30

Texas Instruments

VCBU68WMCE30 by Texas Instruments

VCBU68WMCE30 by Texas Instruments is a MICROPROCESSOR CIRCUIT with 338 terminals in a GRID ARRAY package. It operates b/w 0-85 °C and has a supply voltage range of 1.28-1.42 V, making it ideal for low-power applications requiring high processing capabilities. The PLASTIC/EPOXY body material and BALL terminal form ensure durability and reliability in various electronic devices.

Median Price

$33.624

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$33.624

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100

$33.624

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Vyrian

USA . 3,371 parts In-Stock

1+ parts

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3,371

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Digiode

USA . 2,632 parts In-Stock

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2,632

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 1,608 parts In-Stock

1+ parts

$3.000

100+ parts

$2.925

1k+ parts

$2.910

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-

1,608

$3.000

$2.925

$2.910

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One Stop Electronics

USA . 613 parts In-Stock

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$11.000

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613

$11.000

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Ampacity Inc.

Singapore . 1,142 parts In-Stock

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$12.000

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$12.000

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Parana Technologies

USA . 316 parts In-Stock

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$16.687

100+ parts

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$16.948

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316

$16.687

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$16.948

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DigiPath Technology Company

USA . 587 parts In-Stock

1+ parts

$18.374

100+ parts

$16.904

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587

$18.374

$16.904

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ChromeModa Solutions

Germany . 3,366 parts In-Stock

1+ parts

$18.749

100+ parts

$15.374

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3,366

$18.749

$15.374

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IDEA Electronic Components Group

UK . 664 parts In-Stock

1+ parts

$18.749

100+ parts

$17.812

1k+ parts

$16.874

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664

$18.749

$17.812

$16.874

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AZTECH Wire

Italy . 283 parts In-Stock

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$19.248

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283

$19.248

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Bastille Electronics

Australia . 48 parts In-Stock

1+ parts

$33.620

100+ parts

$31.939

1k+ parts

-

10k+ parts

$29.922

48

$33.620

$31.939

-

$29.922

Continental Prestige Electronics

USA . 1,845 parts In-Stock

1+ parts

$33.624

100+ parts

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$32.951

1,845

$33.624

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$32.951

Corohmni

South Africa . 797 parts In-Stock

1+ parts

$42.553

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797

$42.553

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Corphita

USA . 612 parts In-Stock

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612

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Argo Parts USA

USA . 249 parts In-Stock

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249

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Overview

Discover the VCBU68WMCE30 by Texas Instruments, a cutting-edge MICROPROCESSOR CIRCUIT that offers unmatched quality and reliability. With a package style of GRID ARRAY, LOW PROFILE, FINE PITCH and a terminal finish of TIN SILVER COPPER, this innovative product is perfect for a wide range of applications. From consumer electronics to industrial equipment, trust Texas Instruments to deliver top-notch performance at all times. Upgrade your systems with the VCBU68WMCE30 and experience the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material provides durability and protection for the internal components of the product.

Surface Mount: YES

Surface mount technology offers compact design and efficient assembly, making the product suitable for space-constrained applications.

Maximum Supply Voltage: 1.42 V

The maximum supply voltage of 1.42V ensures safe operation of the product within the specified limits.

Package Shape: SQUARE

The square package shape allows for efficient use of PCB space and facilitates easy integration into electronic systems.

No. of Terminals: 338

With a high number of terminals, the product offers versatile connectivity options and compatibility with complex circuit configurations.

Technology: CMOS

The CMOS technology used in the product ensures low power consumption, high speed, and reliable performance.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs VCBU68WMCE30 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PBGA-B338

JESD-609 Code:

e1

Length:

13 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

338

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.3 mm

Maximum Supply Voltage:

1.42 V

Minimum Supply Voltage:

1.28 V

Nominal Supply Voltage:

1.35 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

13 mm

Peripheral IC Type:

Trade Compliance

VCBU68WMCE30 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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