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XCZU3EG-1SFVC784E

Xilinx

XCZU3EG-1SFVC784E by Xilinx

XCZU3EG-1SFVC784E by Xilinx is a CMOS microprocessor circuit with 784 terminals in a grid array package. It operates b/w 0-100°C, with supply voltage range of 0.825-0.876 V. Ideal for applications requiring high-performance computing and processing capabilities.

Median Price

$613.320

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Mouser Electronics

USA . 8 parts In-Stock

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DigiKey

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Digiode

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VNN

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Nova Conductors

Japan . 10 parts In-Stock

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Vyrian

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ACDS - Activité Composants Distribution Service

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AZTECH Wire

Italy . 333 parts In-Stock

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Corohmni

South Africa . 2,440 parts In-Stock

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Modulus Dynamics

Lithuania . 1,172 parts In-Stock

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Aztec Data Supply Inc.

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MARBEL Systems

Belgium . 17,000 parts In-Stock

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Texas Native Microelectronics

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Kenton Components

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Vigor

Singapore . 580 parts In-Stock

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One Stop Electronics

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Ampacity Inc.

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Semicontronic

India . 3 parts In-Stock

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Corphita

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Continental Prestige Electronics

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Argo Parts USA

USA . 2,391 parts In-Stock

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Netroflash

USA . 500 parts In-Stock

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Qasali Group International

UK . 15,181 parts In-Stock

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Supply Digital

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Glotronic Ltd.

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Overview

Unleash the power of innovation with the XCZU3EG-1SFVC784E by Xilinx. This cutting-edge microprocessor circuit offers unparalleled performance and reliability, backed by Xilinx's renowned reputation for quality and innovation. Perfect for a wide range of applications in the tech industry, this versatile device empowers you to take your projects to new heights. Experience seamless integration and optimized efficiency with the XCZU3EG-1SFVC784E - the ultimate solution for all your processing needs. Elevate your creations today with Xilinx.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides good protection and insulation for the components inside, ensuring durability and reliability.

Surface Mount: YES

Surface mount technology allows for compact and efficient placement on PCBs, saving space and making assembly easier.

Maximum Supply Voltage: 0.876 V

Higher maximum supply voltage allows for versatile power options and can accommodate various power sources.

Package Shape: RECTANGULAR

Rectangular shape is a standard form factor that is easy to work with and integrates well with other components in a design.

No. of Terminals: 784

Having a large number of terminals allows for more connectivity options and flexibility in designing complex circuits.

Package Style (Meter): GRID ARRAY

Grid array packaging provides efficient heat dissipation and can handle high thermal loads, ensuring reliable performance under varying conditions.

Minimum Supply Voltage: 0.825 V

Lower minimum supply voltage means the product can operate efficiently even with limited power sources, making it energy-efficient.

Maximum Operating Temperature: 100 °C

High maximum operating temperature range allows for reliable performance in various environments and under extended usage.

Minimum Operating Temperature: 0 °C

Low minimum operating temperature ensures the product can function in cold environments without any performance issues.

Terminal Finish: Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

Terminal finish with tin/silver/copper provides excellent conductivity and corrosion resistance, ensuring long-term connectivity.

Terminal Position: BOTTOM

Bottom terminal position allows for easy PCB mounting and soldering, simplifying assembly processes.

Maximum Time At Peak Reflow Temperature (s): 30

Short time at peak reflow temperature prevents component damage during soldering processes, ensuring product integrity.

Peak Reflow Temperature °C: 250

High peak reflow temperature allows for reliable soldering and ensures strong connections in challenging conditions.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Microprocessor circuit enables advanced computing capabilities and high-speed processing, ideal for applications requiring complex operations.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product efficient and reliable in various scenarios.

Terminal Form: BALL

Ball terminal form provides secure connections and is suitable for high-density mounting applications, ensuring stable performance.

Nominal Supply Voltage: 0.85 V

Stable nominal supply voltage ensures consistent and reliable operation, critical for maintaining performance over extended periods.

Moisture Sensitivity Level (MSL): 4

MSL level 4 indicates the product can withstand multiple reflows without losing reliability, suitable for demanding manufacturing processes.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs XCZU3EG-1SFVC784E attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Xilinx

Specs

JESD-30 Code:

R-PBGA-B784

JESD-609 Code:

e1

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

784

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

250

Maximum Supply Voltage:

.876 V

Minimum Supply Voltage:

.825 V

Nominal Supply Voltage:

.85 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

Terminal Form:

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Peripheral IC Type:

Trade Compliance

XCZU3EG-1SFVC784E Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A002.A.4

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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