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XA7Z020-1CLG484Q

Xilinx

XA7Z020-1CLG484Q by Xilinx

XA7Z020-1CLG484Q by Xilinx is a MICROPROCESSOR CIRCUIT with 484 terminals in a GRID ARRAY package. Operating b/w -40 to 125 °C, it's AEC-Q100 compliant for AUTOMOTIVE use. Features include 1.8V power supply, 0.8mm terminal pitch, and TIN SILVER COPPER finish.

Median Price

$197.580

Lifecycle Status

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Digiode

USA . 383 parts In-Stock

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Nova Conductors

Japan . 50 parts In-Stock

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AZTECH Wire

Italy . 740 parts In-Stock

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Modulus Dynamics

Lithuania . 3,422 parts In-Stock

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Corohmni

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MARBEL Systems

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Texas Native Microelectronics

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Kenton Components

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Aztec Data Supply Inc.

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Qasali Group International

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Ampacity Inc.

Singapore . 214 parts In-Stock

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Semicontronic

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Corphita

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Continental Prestige Electronics

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Overview

Unleash the power of innovation with the XA7Z020-1CLG484Q by Xilinx! As a trusted manufacturer in the industry, Xilinx delivers top-quality products that guarantee reliability and performance. This versatile microprocessor circuit is perfect for a wide range of applications, from automotive to industrial. With its advanced technology and high-grade materials, the XA7Z020-1CLG484Q offers unmatched value and benefits to customers looking for cutting-edge solutions. Upgrade your projects with this exceptional product and experience the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this product lightweight and durable, ideal for various applications.

Surface Mount: YES

The surface mount capability allows for easy installation and space-saving on PCBs.

Screening Level: AEC-Q100

AEC-Q100 screening ensures high reliability and quality standards, making this product suitable for automotive applications.

Package Shape: SQUARE

The square package shape provides stability and efficient use of space on a circuit board.

Power Supplies (V): 1, 1.8

The multiple power supply options offer flexibility in different operating conditions.

No. of Terminals: 484

The large number of terminals allow for versatile connectivity options in complex electronic systems.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The grid array, low profile, and fine pitch package style offers high density integration and efficient signal transmission.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this product can withstand harsh environmental conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures reliable performance in extreme cold environments.

Terminal Finish: TIN SILVER COPPER

The terminal finish of tin silver copper provides excellent conductivity and corrosion resistance.

Ultraviolet Erasable: N

The non-ultraviolet erasable feature ensures data integrity and security.

Terminal Position: BOTTOM

The bottom terminal position simplifies the assembly process and improves heat dissipation.

Maximum Seated Height: 1.6 mm

The low maximum seated height allows for a compact design and efficient use of space.

Width: 19 mm

The 19mm width offers compatibility with standard PCB sizes and easy integration into existing systems.

Maximum Time At Peak Reflow Temperature (s): 30

The short maximum time at peak reflow temperature ensures the integrity of the components during soldering.

Peak Reflow Temperature °C: 260

The high peak reflow temperature capability enables reliable soldering in various manufacturing processes.

Length: 19 mm

The 19mm length provides a compact footprint for space-constrained applications.

Temperature Grade: AUTOMOTIVE

The automotive-grade temperature rating ensures reliable operation in automotive environments.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

The microprocessor circuit type offers advanced processing capabilities for complex tasks.

Technology: CMOS

The CMOS technology provides low power consumption and high noise immunity for efficient operation.

Terminal Form: BALL

The ball terminal form enables reliable connections and easy soldering on PCBs.

Terminal Pitch: 0.8 mm

The 0.8mm terminal pitch allows for high-density mounting and compact circuit designs.

Moisture Sensitivity Level (MSL): 3

The MSL 3 rating ensures proper handling and storage to prevent moisture-related damage.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs XA7Z020-1CLG484Q attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Xilinx

Specs

JESD-30 Code:

S-PBGA-B484

JESD-609 Code:

e1

Length:

19 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

484

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA484,22X22,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1,1.8

Qualification:

Not Qualified

Screening Level:

AEC-Q100

Maximum Seated Height:

1.6 mm

Sub-Category:

Other uPs/uCs/Peripheral ICs

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Ultraviolet Erasable:

N

Width:

19 mm

Peripheral IC Type:

Trade Compliance

XA7Z020-1CLG484Q Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.D

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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