Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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XA7Z020-1CLG484Q by Xilinx is a MICROPROCESSOR CIRCUIT with 484 terminals in a GRID ARRAY package. Operating b/w -40 to 125 °C, it's AEC-Q100 compliant for AUTOMOTIVE use. Features include 1.8V power supply, 0.8mm terminal pitch, and TIN SILVER COPPER finish.
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The use of plastic/epoxy material makes this product lightweight and durable, ideal for various applications.
The surface mount capability allows for easy installation and space-saving on PCBs.
AEC-Q100 screening ensures high reliability and quality standards, making this product suitable for automotive applications.
The square package shape provides stability and efficient use of space on a circuit board.
The multiple power supply options offer flexibility in different operating conditions.
The large number of terminals allow for versatile connectivity options in complex electronic systems.
The grid array, low profile, and fine pitch package style offers high density integration and efficient signal transmission.
With a high maximum operating temperature, this product can withstand harsh environmental conditions.
The low minimum operating temperature ensures reliable performance in extreme cold environments.
The terminal finish of tin silver copper provides excellent conductivity and corrosion resistance.
The non-ultraviolet erasable feature ensures data integrity and security.
The bottom terminal position simplifies the assembly process and improves heat dissipation.
The low maximum seated height allows for a compact design and efficient use of space.
The 19mm width offers compatibility with standard PCB sizes and easy integration into existing systems.
The short maximum time at peak reflow temperature ensures the integrity of the components during soldering.
The high peak reflow temperature capability enables reliable soldering in various manufacturing processes.
The 19mm length provides a compact footprint for space-constrained applications.
The automotive-grade temperature rating ensures reliable operation in automotive environments.
The microprocessor circuit type offers advanced processing capabilities for complex tasks.
The CMOS technology provides low power consumption and high noise immunity for efficient operation.
The ball terminal form enables reliable connections and easy soldering on PCBs.
The 0.8mm terminal pitch allows for high-density mounting and compact circuit designs.
The MSL 3 rating ensures proper handling and storage to prevent moisture-related damage.
Other Function uPs,uCs & Peripheral ICs XA7Z020-1CLG484Q attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Xilinx
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XA7Z020-1CLG484Q Peripheral ICs trade compliance attributes, and parameters.
ECCN
3A991.D
ECCN Governance
EAR
HTS
8542.39.00.01
SB
8542.39.00.00
Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD
LM358N
Kec
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
2N7002,215
NXP Semiconductors
2N7002,215 by NXP Semiconductors is a small signal N-CHANNEL FET with a min DS breakdown voltage of 60V and max drain current of 0.3A. It is used for switching applications in enhancement mode, operates b/w -65 to 150 °C, and has a max power dissipation of 0.2W.
BAV99
Gec Plessey Semiconductors
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
BSS138
Diodes Incorporated
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .225 W; Minimum DS Breakdown Voltage: 50 V; Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR;
1N4148WS
Synsemi
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Bytesonic Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LM555CN
National Semiconductor
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Surface Mount: NO;
SS14
Onsemi
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Temic Semiconductors
2N7002
Zetex Plc
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Peak Reflow Temperature (C): 260; Package Shape: RECTANGULAR;
2N2222A
Infineon Technologies
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
ERJU06F10R0V
Panasonic
ERJU06F10R0V by Panasonic is an 0805 size SMT fixed resistor with a resistance of 10 ohm and 1% tolerance. It operates b/w -55 to 155 °C, suitable for AEC-Q200 standards in automotive applications due to its high temperature coefficient of 100 ppm/°C. With a max operating voltage of 150 V and power dissipation of 0.125 W, it is ideal for surface mounting type.
M85049/85-08W02
TE Connectivity
CONNECTOR ACCESSORY; Minimum Operating Temperature: -65 Cel; Wire Gauge (AWG): 0; Maximum Wire Size: 0 AWG; Maximum Operating Temperature: 175 Cel; Material: ALUMINUM ALLOY;
SMBJ18CA
Transpro Electronics
TRANS VOLTAGE SUPPRESSOR DIODE; Surface Mount: YES; JESD-609 Code: e0; Terminal Finish: Tin/Lead (Sn/Pb); Nominal Breakdown Voltage: 21.1 V; Maximum Clamping Voltage: 29.2 V;
FDC5614P
TAIZHOU ELECTRONICS CO LTD
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 1.92 W; Maximum Operating Temperature: 150 Cel; Package Body Material: PLASTIC/EPOXY;
Forward International Electronics
TRANS VOLTAGE SUPPRESSOR DIODE; Surface Mount: YES; Nominal Breakdown Voltage: 21.05 V; Maximum Clamping Voltage: 29.2 V; Maximum Repetitive Peak Reverse Voltage: 18 V; Polarity: BIDIRECTIONAL;
PIC18F4550-I/P
Microchip Technology
PIC18F4550-I/P by Microchip Technology is an 8-bit microcontroller with a max clock frequency of 48 MHz. It features 13-Ch 10-Bit ADC channels and USB connectivity, making it ideal for industrial applications requiring low power consumption and high-speed data processing. With 2048 RAM bytes and 256 Data EEPROM size, this CMOS technology-based microcontroller offers versatile performance in various embedded systems.
LM358M
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
LL4148
Changzhou Galaxy Century Microelectronics
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
MBRS360T3G
MBRS360T3G by Onsemi is a Schottky rectifier diode with a max forward voltage of 0.63V and a max output current of 3A. It is designed for applications requiring high-speed switching and low power loss, making it suitable for use in various electronic devices.
ATWINC1510-MR210PB1961
ATWINC1510-MR210PB1961 by Microchip operates at 3-4.2V, with a temp range of -40 to 85°C. It is a CMOS microprocessor circuit with 28 terminals, ideal for industrial applications requiring surface mount technology in a compact rectangular package style.
ATWINC1500-MR210PB1961
Microchip Technology's ATWINC1500-MR210PB1961 is a CMOS network controller with 28 terminals. It operates b/w -40 to 85°C, with supply voltage ranging from 2.7V to 3.6V. Ideal for industrial applications requiring surface mount technology and a compact rectangular package style.
MCIMX515DJM8CR2
Freescale Semiconductor
SYSTEM ON CHIP; Terminal Form: BALL; No. of Terminals: 529; Package Code: LFBGA; Package Shape: SQUARE; Maximum Supply Voltage: 1.15 V;
ATSAMA5D27-SOM1
ATSAMA5D27-SOM1 by Microchip: Operates at 3-3.6V, -40 to 85°C temp range, with 176 terminals. Ideal for industrial applications, supports CAN(2), I2C, SPI interfaces. Compact MICROELECTRONIC ASSEMBLY package style at 38x40mm size.
D2-92633-LR
Renesas Electronics
D2-92633-LR by Renesas Electronics is a low-profile, fine-pitch SoC peripheral IC with 128 terminals. Operating b/w -10°C to 85°C, it has a supply voltage range of 1.7V to 1.9V and peak reflow temperature of 260°C. Ideal for applications requiring compact design and high performance in electronics manufacturing.
CC1310F128RSMT
Texas Instruments
CC1310F128RSMT by Texas Instruments is a Cortex-M3 CPU with 28672 RAM bytes. It operates b/w -40 to 85°C, with a supply voltage range of 1.8-3.8V. Ideal for industrial applications requiring a microprocessor circuit in a compact chip carrier package.
EFR32BG24A010F1024IM40-BR
Silicon Labs
EFR32BG24A010F1024IM40-BR by Silicon Labs is a 40-terminal SoC with CMOS technology. It operates b/w -40 to 125 °C, with supply voltage range of 1.71V to 3.8V. Ideal for applications requiring low-profile, surface-mount ICs in various electronic devices.
FT245RL
FTDI
FT245RL by FTDI is a 28-terminal peripheral IC with supply voltage range of 3.3V to 5.25V, operating temperature from -40°C to 85°C. It features CMOS technology, GULL WING terminals, and is ideal for MICROPROCESSOR CIRCUIT applications in industrial settings due to its small outline package style.
ATECC608B-MAHCZ-T
Microchip ATECC608B-MAHCZ-T is a cryptographic authenticator IC with 8 terminals, 1-Wire bus compatibility, and CMOS technology. It operates b/w -40 to 85 °C, suitable for industrial applications requiring secure authentication. Package style: Small Outline, Heat Sink/Slug, Very Thin Profile.
XC7Z007S-1CLG400C
Xilinx
The Xilinx XC7Z007S-1CLG400C is a System on Chip with CMOS technology. It operates b/w 0-85°C, with supply voltage range of 0.95-1.05V. Featuring a grid array package style, it's ideal for applications requiring low profile and fine pitch designs in the Other Function uPs,uCs & Peripheral ICs category.
MCIMX357CJQ5CR2
MCIMX357CJQ5CR2 by NXP Semiconductors is a 400-terminal GRID ARRAY uP with 1.22-1.47 V supply range, ideal for SYSTEM ON CHIP applications in industrial settings. It features a low profile design, operates b/w -40 to 85 °C, and has a peak reflow temp of 260 C.
ST33HTPH2032AHD1
STMicroelectronics
ST33HTPH2032AHD1 by STMicroelectronics is a 32-terminal chip carrier with cryptographic authenticator technology. Operating b/w -40 to 105°C, it has a terminal pitch of 0.5mm and nominal voltage of 1.8V. Ideal for secure applications requiring compact design and high performance in a square package shape.
MPFS250T-FCG1152I
MPFS250T-FCG1152I by Microchip Tech is a 1152-terminal programmable SoC with CMOS tech. Operates b/w -40 to 100 °C, with supply voltage range of 0.97V to 1.03V. Ideal for applications requiring high-density integration in compact spaces.
MCIMX535DVV1C
SYSTEM ON CHIP; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 529; Package Code: FBGA; Package Shape: SQUARE;
CC3220MODASF12MONR
The Texas Instruments CC3220MODASF12MONR is a CMOS microprocessor circuit with 4-Ch 12-Bit ADC channels. It operates b/w -40 to 85 °C, with a supply voltage range of 2.3V to 3.6V. Ideal for industrial applications, it offers I2C, I2S, SPI, and UART connectivity options.
TMS320DM365ZCED30
TMS320DM365ZCED30 by Texas Instruments is a 32-bit microprocessor with 338 terminals, operating at -40 to 85°C. It features a 32-bit external data bus width and supports I2C, SPI, UART, and USB buses. Ideal for industrial applications requiring a low-profile package style with a grid array layout.
MCP25050T-I/SL
MCP25050T-I/SL by Microchip Tech is an 8-bit peripheral IC with a supply voltage range of 2.7-5.5V, ideal for industrial applications. It features a small outline package style, dual terminal position, and operates in temperatures ranging from -40 to 85°C. This CMOS technology microprocessor circuit has 14 terminals and is surface mountable with TS16949 screening level certification.
BGM13P32F512GA-V2R
SoC;
LS1021AXE7KQB
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 525; Package Code: HBGA; Package Shape: SQUARE; Nominal Supply Voltage: 1 V;
SCANSTA112SMX
SCANSTA112SMX by Texas Instruments is a MICROPROCESSOR CIRCUIT with 100 terminals in a GRID ARRAY package. It operates at temperatures from -40 to 85 °C and has a supply voltage of 3.3 V, making it ideal for industrial applications requiring low profile, fine pitch ICs.
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XA7Z020-1CLG400Q
MICROPROCESSOR CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 400; Package Code: LFBGA; Package Shape: SQUARE;
XA7Z030-1FBV484Q
MICROPROCESSOR CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE;
XA7Z020-1CLG400I
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 400; Package Code: LFBGA; Package Shape: SQUARE; JESD-30 Code: S-PBGA-B400;
XA7Z010-1CLG400Q
XA7Z010-1CLG225Q
MICROPROCESSOR CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 225; Package Code: LFBGA; Package Shape: SQUARE;
XA7Z010-1CLG225I
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 225; Package Code: LFBGA; Package Shape: SQUARE; Width: 13 mm;
XA7Z010-1CLG400I
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 400; Package Code: LFBGA; Package Shape: SQUARE; Package Equivalence Code: BGA400,20X20,32;
XA7Z020-1CLG484I
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 484; Package Code: LFBGA; Package Shape: SQUARE; Terminal Pitch: .8 mm;
XA7Z030-1FBG484I
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE; Ultraviolet Erasable: N;
XA7Z030-1FBG484Q
XA7Z030-1FBV484I
MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE;
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